公开(公告)号：US20230357002A1

公开(公告)日：2023-11-09

申请号：US18357019

申请日：2023-07-21

Applicant: Taiwan Semiconductor Manufacturing Company Ltd.

Inventor： Chih-Ming Chen ,  Yuan-Chih Hsieh ,  Chung-Yi Yu

IPC: B81C1/00 ,  H01L23/488 ,  H01L25/00 ,  B81B7/00

CPC classification number: B81C1/00269 ,  H01L23/488 ,  H01L25/50 ,  B81C1/00238 ,  B81C1/00 ,  B81B7/0041 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2201/0264 ,  B81C2203/035 ,  B81C2203/0118 ,  B81B2201/0235 ,  H01L24/81

Abstract: The present disclosure provides a packaging method, including: providing a first semiconductor substrate; forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate includes a first bonding metal layer and a second bonding metal layer; providing a second semiconductor substrate having a bonding region, wherein the bonding region of the second semiconductor substrate includes a third bonding layer; and bonding the first semiconductor substrate to the second semiconductor substrate by bringing the bonding region of the first semiconductor substrate in contact with the bonding region of the second semiconductor substrate; wherein the first and third bonding metal layers include copper (Cu), and the second bonding metal layer includes Tin (Sn). An associated packaging structure is also disclosed.

公开(公告)号：US20230235664A1

公开(公告)日：2023-07-27

申请号：US17582816

申请日：2022-01-24

Applicant: Schlumberger Technology Corporation

Inventor： Remi Robutel ,  Cleverson Souza Chaves ,  Mohamed Salim Cherchali ,  Claire Tassin ,  Nicolas Renoux

IPC: E21B47/07 ,  B81B7/00 ,  E21B47/12 ,  E21B47/01

CPC classification number: E21B47/07 ,  B81B7/0074 ,  E21B47/01 ,  E21B47/12 ,  B81B2201/025 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/07 ,  B81B2207/091

Abstract: A downhole sensor system includes a first sensor package having a substrate, an integrated circuit chip mounted to the substrate, the integrated circuit chip including a processor, a transducer chip mounted to the integrated circuit chip, and a plurality of sensors configured to measure at least shock, pressure, temperature, and humidity. At least one of the plurality of sensors is mounted to the transducer chip such that a stack is formed at least from the substrate, the integrated circuit, the transducer chip, and the sensor. The plurality of sensors are in communication with the processor.

公开(公告)号：US11697588B2

公开(公告)日：2023-07-11

申请号：US17542679

申请日：2021-12-06

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Yi-Ren Wang ,  Shing-Chyang Pan ,  Yuan-Chih Hsieh

IPC: B81B7/00 ,  B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81C1/00047 ,  B81C1/00095 ,  B81C1/00277 ,  B81B2201/0235 ,  B81B2201/0242

Abstract: Various embodiments of the present disclosure are directed towards a method for manufacturing an integrated chip, the method comprises forming an interconnect structure over a semiconductor substrate. An upper dielectric layer is formed over the interconnect structure. An outgas layer is formed within the upper dielectric layer. The outgas layer comprises a first material that is amorphous. A microelectromechanical systems (MEMS) substrate is formed over the interconnect structure. The MEMS substrate comprises a moveable structure directly over the outgas layer.

公开(公告)号：US20230175866A1

公开(公告)日：2023-06-08

申请号：US18161616

申请日：2023-01-30

Applicant: Magic Leap, Inc.

Inventor： Cuthbert Martindale ALLEN ,  Michael Derek ABBOTT ,  Igor LEVINSKY ,  Jeffrey JOHNSON ,  Shimon GOLDSTEIN ,  Aaron Mark SCHUELKE

IPC: G01C25/00 ,  B81B7/02

CPC classification number: G01C25/005 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242

Abstract: An electronics system has a board with a thermal interface having an exposed surface. A thermoelectric device is placed against the thermal interface to heat the board. Heat transfers through the board from a first region where the thermal interface is located to a second region where an electronics device is mounted. The electronics device has a temperature sensor that detects the temperature of the electronics device. The temperature of the electronics device is used to calibrate an accelerometer and a gyroscope in the electronics device. Calibration data includes a temperature and a corresponding acceleration offset and a corresponding angle offset. A field computer simultaneously senses a temperature, an acceleration and an angle from the temperature sensor, accelerometer and gyroscope and adjusts the measured data with the offset data at the same temperature. The field computer provides corrected data to a controlled system.

公开(公告)号：US11667522B2

公开(公告)日：2023-06-06

申请号：US17109405

申请日：2020-12-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Chuan Tai ,  Fan Hu

IPC: B81B7/02 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81C1/00047 ,  B81C1/00333 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0315 ,  B81C2201/013 ,  B81C2201/0125 ,  B81C2203/0109

Abstract: The present disclosure relates to a MEMS package having different trench depths, and a method of fabricating the MEMS package. In some embodiments, a cap substrate is bonded to a device substrate. The cap substrate comprises a cap substrate bonded to a device substrate. The cap substrate comprises a MEMS trench, a scribe trench, and an edge trench respectively recessed from at a front-side surface of the cap substrate. A stopper is disposed within the MEMS trench and raised from a bottom surface of the MEMS trench.

公开(公告)号：US11650078B2

公开(公告)日：2023-05-16

申请号：US17825856

申请日：2022-05-26

Applicant: InvenSense, Inc.

Inventor： Doruk Senkal ,  Houri Johari-Galle ,  Joseph Seeger

IPC: G01C25/00 ,  G01C19/5776 ,  G01C19/5719 ,  G01C19/5726 ,  G01R29/02 ,  G01R19/00 ,  G01R23/00 ,  G01R25/00

CPC classification number: G01C25/005 ,  G01C19/5719 ,  G01C19/5726 ,  G01C19/5776 ,  G01R19/0038 ,  G01R23/005 ,  G01R25/00 ,  G01R29/02 ,  B81B2201/0242 ,  B81B2207/03

Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.

公开(公告)号：US20190195668A1

公开(公告)日：2019-06-27

申请号：US16247543

申请日：2019-01-14

Applicant: INVENSENSE, INC.

Inventor： Andy Milota ,  James Lim ,  William Kerry Keal

IPC: G01D18/00 ,  H03L7/00 ,  H03L1/00 ,  B81B7/02

CPC classification number: G01D18/008 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81B2207/09 ,  H03L1/00 ,  H03L7/00

Abstract: Various aspects of this disclosure comprise systems and methods for synchronizing sensor data acquisition and/or output. For example, various aspects of this disclosure provide for achieving a desired level of timing accuracy in a MEMS sensor system, even in an implementation in which timer drift is substantial.

公开(公告)号：US20190092621A1

公开(公告)日：2019-03-28

申请号：US15716977

申请日：2017-09-27

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Kristin N. Yee ,  Michael J. Melfi ,  Zhenhuan Yuan ,  John A. Balcerak ,  Arun K. Guru

IPC: B81B3/00 ,  H02P1/02

CPC classification number: B81B3/0075 ,  B81B3/0048 ,  B81B2201/0242 ,  G01D11/24 ,  G01D11/245 ,  G01D11/30 ,  H02P1/02

Abstract: A motor having a circuit board including at least two MEMS sensors. The circuit board is mounted within a housing of the motor using the same fasteners as an encoder of the motor. Mounting the MEMS sensors to the circuit board simplifies assembly of the motor and standardizes the positioning of the MEMS sensors within the housing, while the overall motor footprint is unaffected.

公开(公告)号：US20190028815A1

公开(公告)日：2019-01-24

申请号：US16137439

申请日：2018-09-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Brioschi ,  Marco Omar Ghidoni

IPC: H04R19/04 ,  H04R7/06 ,  H04R31/00 ,  H04R19/00 ,  H04R3/00 ,  B81C1/00 ,  B06B1/02 ,  H04R1/44 ,  B81B7/04

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module, comprising: a first substrate, which houses a first MEMS transducer, designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit, coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate, which houses a second MEMS transducer, designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit, mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

公开(公告)号：US20180362337A1

公开(公告)日：2018-12-20

申请号：US15781777

申请日：2016-10-12

Applicant: Robert Bosch GmbH

Inventor： Achim Breitling ,  Mawuli Ametowobla

IPC: B81C1/00 ,  B81B7/00 ,  G01P1/02

CPC classification number: B81C1/00285 ,  B81B7/0038 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81C2203/0145 ,  G01P1/02

Abstract: A method for producing a micromechanical component having a substrate and cap, which is connected to the substrate and encloses a first cavity therewith. A first pressure prevails in the first cavity, and a first gas mixture having a first chemical composition is enclosed, and an access opening is provided in the substrate or cap, which connects the first cavity to an environment of the micromechanical component, and then the first pressure and/or the first chemical composition is adjusted in the first cavity, and finally, the access opening is sealed with a laser by introducing energy/heat into an absorbing part of the substrate or cap, and a getter, introduced into the first cavity prior to the third task, is sealed with the laser radiation, and a getter, introduced into the first cavity prior to the third task, is activated at least partially with the laser radiation, during the third task.