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公开(公告)号：US20240223966A1
公开(公告)日：2024-07-04
申请号：US18395782
申请日：2023-12-26
Applicant: AAC Technologies Pte. Ltd.
Inventor： Yuwei Liu , Colin Robert Jenkins , Rui Zhang
CPC classification number: H04R19/04 , B81B3/0075 , H04R7/04 , H04R7/18 , B81B2201/0257 , B81B2203/0127 , H04R2201/003
Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the capacitive includes a back plate and a diaphragm, a reinforcing portion is located between the diaphragm and the substrate, a projection of an inner surface of the reinforcing portion along a vibration direction of the diaphragm is flush with an inner surface of the back cavity or located in the back cavity, the reinforcing portion includes an etched barrier wall and a sacrificial layer located within the etched barrier wall. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the reliability.
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公开(公告)号：US20240217809A1
公开(公告)日：2024-07-04
申请号：US18454038
申请日：2023-08-22
Inventor： Zhuanzhuan Zhao , Kaijie Wang , Rui Zhang
IPC: B81B3/00
CPC classification number: B81B3/0056 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81B2203/0353
Abstract: A MEMS microphone, includes a substrate with a back cavity, and a capacitive system including a back plate and a diaphragm located on the substrate, the back plate includes a body portion and a first protrusion, the diaphragm includes a main portion and a second protrusion, the first protrusion is corresponding to the second protrusion, the substrate includes an upper end close to the capacitive system and a lower end away from the capacitive system, an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the resonant frequency.
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公开(公告)号：US20240215649A1
公开(公告)日：2024-07-04
申请号：US18454041
申请日：2023-08-22
Inventor： Jinyang Li , Rui Zhang
CPC classification number: A24F40/51 , A24F40/10 , A24F40/40 , B81B3/0021 , H04R1/028 , H04R7/04 , H04R19/04 , B81B2201/0257 , B81B2201/0292 , B81B2203/0127 , B81B2203/019 , H04R2201/003
Abstract: A MEMS sensor, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the MEMS sensor includes a first back plate assembly and a diaphragm opposite to the first back plate assembly. The first back plate assembly includes a first back plate and a second back plate, the first back plate includes a plurality of a first back plate holes, the second back plate includes a plurality of a second back plate holes, each first back plate hole and each second back plate hole are staggered with each other in a vibration direction of the diaphragm. Compared with the related art, the MEMS sensor disclosed by the present disclosure could play a good dustproof effect.
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公开(公告)号：US12013282B2
公开(公告)日：2024-06-18
申请号：US17818820
申请日：2022-08-10
Applicant: INVENSENSE, INC.
Inventor： Jeremy Parker , Kieran Harney
CPC classification number: G01H3/00 , B81B3/0018 , B81B7/0061 , B81B2201/0257 , G01H11/06 , H04R19/005 , H04R31/006 , H04R2201/003
Abstract: An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.
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公开(公告)号：US20240182297A1
公开(公告)日：2024-06-06
申请号：US18519897
申请日：2023-11-27
Applicant: Infineon Technologies AG
Inventor： Hutomo Suryo Wasisto , Fabian Streb , Sebastian Anzinger , Marc Füldner , Dominic Maier
CPC classification number: B81C1/00285 , B81B7/0029 , B81B2201/0257 , B81C2201/0132 , H04R1/023 , H04R2201/003 , H04R2201/029
Abstract: A method for manufacturing a micromechanical environmental barrier chip includes providing a substrate having a first surface and an opposite second surface, depositing a material layer having a different etch characteristic than the substrate onto the first surface, creating a microstructured micromechanical environmental barrier structure on top of the material layer by applying a microstructuring process, applying an anisotropic etching process comprising at least one etching step for anisotropically etching from the second surface towards the first surface to create at least a cavity underneath the micromechanical environmental barrier structure, the cavity extending between the second surface and the material layer, and removing the material layer underneath the micromechanical environmental barrier structure to expose the environmental barrier structure.
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Patent Agency Ranking
公开(公告)号：US20240109770A1
公开(公告)日：2024-04-04
申请号：US17936931
申请日：2022-09-30
Applicant: Knowles Electronics, LLC
Inventor： Peter V. Loeppert , Michael Pedersen
CPC classification number: B81C1/00158 , B81B3/0021 , B81B2201/0257 , B81B2203/0163 , B81B2203/0307 , B81C2201/013 , B81C2201/017
Abstract: A method of fabricating a die for a microelectromechanical systems (MEMS) microphone includes the steps of forming a diaphragm, etching a plurality of slots through the diaphragm to define a plurality of springs, releasing the diaphragm and the plurality of springs, wherein the plurality of springs relieves intrinsic stress of the diaphragm, and sealing the plurality of slots with sealing material, thereby disabling the springs.
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公开(公告)号：US11950053B2
公开(公告)日：2024-04-02
申请号：US17739202
申请日：2022-05-09
Inventor： Zhengyu Shi , Linlin Wang , Rui Zhang
CPC classification number: H04R19/04 , B81B3/0045 , H04R7/04 , H04R7/18 , B81B2201/0257 , H04R2201/003
Abstract: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.
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公开(公告)号：US20240101410A1
公开(公告)日：2024-03-28
申请号：US17952357
申请日：2022-09-26
Inventor： Taimoor Ali
CPC classification number: B81B3/0021 , H04R23/008 , B81B2201/0257 , B81B2201/047 , B81B2203/0127 , B81B2203/0315 , B81B2203/053 , H04R2201/003
Abstract: An MEMS optical microphone, including a casing including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, an aperture is provided penetrating through the diaphragm, and a size of the aperture increases or decreases with acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor arranged on opposite sides of the diaphragm, the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the aperture, and a size of the light beam is larger than a maximum size of the aperture; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Dynamic range of the MEMS optical microphone is improved, wider range of sound signals can be sensed, and higher sensitivity can be realized.
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公开(公告)号：US20240089644A1
公开(公告)日：2024-03-14
申请号：US18517963
申请日：2023-11-22
Inventor： Sullivan DO , Yu DU
CPC classification number: H04R1/04 , B81B7/02 , H04R1/222 , H04R1/2896 , H04R19/04 , B81B2201/0257 , H04R2201/003
Abstract: In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.
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20.发明公开公开(公告)号：US20240083744A1
公开(公告)日：2024-03-14
申请号：US18517221
申请日：2023-11-22
Applicant: Infineon Technologies AG
Inventor： Dietmar Straeussnigg , Niccoló De Milleri , Andreas Wiesbauer
CPC classification number: B81B7/008 , B81B7/02 , H04R3/06 , B81B2201/0257 , H04R2201/003 , H04R2410/03
Abstract: A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.
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