公开(公告)号：US20170339784A1

公开(公告)日：2017-11-23

申请号：US15534897

申请日：2015-12-10

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Andreas Zluc ,  Gerald Weidinger ,  Mario Schober ,  Hannes Stahr ,  Timo Schwarz ,  Benjamin Gruber

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H01L23/538

CPC classification number: H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/0002 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto, and which includes a layer thickness along a z-axis which is perpendicular with respect to the x-axis and to the y-axis; and at least one metallic layer which is attached to the dielectric layer in a planar manner. The layer composite along the z-axis is free from a symmetry plane which is oriented in parallel with respect to the xy-plane, and the dielectric layer includes a dielectric material which has an elastic modulus E in a range between 1 and 20 GPa and along the x-axis and along the y-axis a coefficient of thermal expansion in a range between 0 and 17 ppm/K. A method of manufacturing such a circuit board is also described. Further, a method of manufacturing a circuit board structure comprising two asymmetric circuit boards and a method of manufacturing two processed asymmetric circuit boards from a larger circuit board structure is described.

公开(公告)号：US20170339783A1

公开(公告)日：2017-11-23

申请号：US15534172

申请日：2015-12-10

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Hannes Stahr ,  Andreas Zluc ,  Timo Schwarz ,  Gerald Weidinger

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/14 ,  H01L23/00 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H01L23/538

CPC classification number: H05K1/0271 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/145 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/18162 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0017 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09136 ,  H01L2924/00

Abstract: A circuit board and a method of manufacturing a circuit board or two circuit boards are illustrated and described. The circuit board includes (a) a dielectric layer with a planar extension in parallel with respect to an xy-plane which is spanned by an x-axis and a y-axis perpendicular thereto and a layer thickness along a z-direction which is perpendicular with respect to the x-axis and to the y-axis; (b) a metallic layer which is attached to the dielectric layer in a planar manner; and (c) a component which is embedded in the dielectric layer and/or in a dielectric core-layer of the circuit board. The dielectric layer includes a dielectric material which has (i) an elastic modulus E in a range between 1 and 20 GPa and (ii) a coefficient of thermal expansion in a range between 0 and 17 ppm/K along the x-axis and along the y-axis.

公开(公告)号：US20170261187A1

公开(公告)日：2017-09-14

申请号：US15453848

申请日：2017-03-08

Applicant: Lilibrand LLC

Inventor： Ariel Meir ,  Niv Sadeh ,  Noam Meir ,  Rina Meir

IPC: F21V17/04 ,  F21V5/04 ,  G02B27/30 ,  H01L33/62 ,  H05K1/02 ,  H01L33/60 ,  H01L33/50 ,  H01L33/48 ,  H05K1/18 ,  F21S8/04 ,  H01L33/58

CPC classification number: F21V17/04 ,  F21S8/033 ,  F21S8/04 ,  F21V5/04 ,  F21V13/04 ,  F21W2131/10 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B19/0061 ,  G02B27/30 ,  H01L33/502 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0091 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10106 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.

公开(公告)号：US09743510B2

公开(公告)日：2017-08-22

申请号：US14579108

申请日：2014-12-22

Applicant: NIKON CORPORATION

Inventor： Ryoichi Suganuma ,  Hirofumi Arima ,  Satoru Suzuki ,  Takuya Sato

IPC: H01L29/16 ,  H05K1/02 ,  H04N5/225 ,  H05K1/05 ,  H05K3/46 ,  H01L27/146 ,  H05K1/11 ,  H05K1/18 ,  H05K3/44 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15153 ,  H01L2924/1531 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

公开(公告)号：US09706647B2

公开(公告)日：2017-07-11

申请号：US14276413

申请日：2014-05-13

Applicant: MC10, INC.

Inventor： Yung-Yu Hsu ,  John Work ,  Kevin J. Dowling

IPC: H05K1/02 ,  A61B5/00 ,  H01L23/538 ,  H05K1/18 ,  H01L23/14

CPC classification number: H05K1/0283 ,  A61B5/0059 ,  A61B5/6846 ,  A61B2562/164 ,  H01L23/145 ,  H01L23/5386 ,  H01L23/5387 ,  H01L2924/15791 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945

Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.

公开(公告)号：US20170181704A1

公开(公告)日：2017-06-29

申请号：US15375514

申请日：2016-12-12

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. ROGERS ,  Ming YING ,  Andrew BONIFAS ,  Nanshu LU

IPC: A61B5/00 ,  A61B5/01 ,  H05K1/18 ,  A61N1/04 ,  H05K3/30 ,  H05K1/16 ,  H05K1/11 ,  A61B42/10 ,  H05K1/02

CPC classification number: A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US20170164461A1

公开(公告)日：2017-06-08

申请号：US14962692

申请日：2015-12-08

Applicant: Intel Corporation

Inventor： Braxton Lathrop ,  Sasha Oster ,  Aleksandar Aleksov ,  Nadine L. Dabby

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/12 ,  H05K1/03

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/11 ,  H05K3/0058 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/1275 ,  H05K3/281 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/1545

Abstract: Apparatus and methods are provided for flexible, stretchable, wearable electronics. In an example, an apparatus for providing flexible and stretchable conductors can include a first elastomer layer, conductive ink applied to the first elastomer layer, and an adhesive layer, in cooperation with the first elastomer layer, configured to encapsulate the conductive ink, the adhesive layer further configured to allow the apparatus to be attached to a second apparatus.

公开(公告)号：US09669209B2

公开(公告)日：2017-06-06

申请号：US15132177

申请日：2016-04-18

Applicant: Second Sight Medical Products, Inc.

Inventor： Jordan Neysmith ,  Robert Greenberg ,  James Little ,  Brian Mech ,  Neil Talbot ,  Qingfang Yao ,  Dao Min Zhou

IPC: H05K3/02 ,  H05K3/10 ,  A61N1/05 ,  H05K1/11 ,  H05K3/38 ,  H05K3/46 ,  H05K1/09 ,  H05K3/18 ,  A61N1/36 ,  H05K3/00

CPC classification number: A61N1/0543 ,  A61N1/0541 ,  A61N1/36046 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/188 ,  H05K3/22 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/0154 ,  Y10T29/49156 ,  Y10T29/49158

Abstract: A flexible circuit electrode array with more than one layer of metal traces comprising: a polymer base layer; more than one layer of metal traces, separated by polymer layers, deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; and a polymer top layer deposited on said polymer base layer and said metal traces. Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow.

公开(公告)号：US09585245B2

公开(公告)日：2017-02-28

申请号：US15171510

申请日：2016-06-02

Applicant: VivaLnk, Inc.

Inventor： Jiang Li ,  Junfeng Mei

IPC: G06K7/08 ,  G06K19/06 ,  H05K1/02 ,  A61B5/00 ,  H04B1/3827 ,  H05K3/30 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract translation: 电子贴片包括可折叠电路层，其包括可折叠网络，其包括：包括多个电子部件的多个电子模块和连接多个电子模块的柔性带，其中柔性带包括导电的导电电路 与多个电子模块中的多个电子部件连接。 相邻的电子模块可以垂直于可折叠电路层的相反方向波动。 电子贴片还包括包围可折叠电路层的弹性层。

公开(公告)号：US20170048986A1

公开(公告)日：2017-02-16

申请号：US14964964

申请日：2015-12-10

Applicant: Palo Alto Research Center Incorporated

Inventor： Ping Mei ,  Gregory L. Whiting ,  Brent S. Krusor

IPC: H05K3/30 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K3/306 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/19 ,  H01L2924/19105 ,  H05K1/183 ,  H05K1/184 ,  H05K3/0017 ,  H05K3/0026 ,  H05K3/0044 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2203/1327 ,  Y02P70/613

Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among others, where the surface of the electronic circuit component is at the same level as the associated substrate, the surface of the electronic circuit component holding connection pads. A gap exists between the electronic circuit component, and the end of an opening within the substrate. This gap is filled with a filler material, such as a bonding material. The bonding material also used to encapsulate or bond together the back side of the substrate and electronic circuit component. During the manufacturing process, the front surface of the electronic circuit component (which includes the contact pads) and the front surface of the substrate which includes electronic circuitry are held in an adhesive relationship by a flat material having an upper surface which includes adhesive or sticky material (such as PDMS). Once the flat material is removed the planar flat or level upper surface can readily accept the formation of conductive traces by the use of inkjet printing or other technologies.

Abstract translation: 本发明提供了一种电子电路部件的制造方法，例如裸片，以及封装的集成芯片，其中电子电路部件的表面与相关联的基板处于相同的水平，电子电路部件的表面保持连接焊盘 。 在电子电路部件与衬底内的开口端之间存在间隙。 该间隙填充有诸如粘合材料的填充材料。 接合材料也用于将基板和电子电路部件的背面封装或粘合在一起。 在制造过程中，电子电路部件（其包括接触焊盘）的前表面和包括电子电路的基板的前表面通过具有上表面的扁平材料保持粘合关系，该上表面包括粘合或粘性 材料（如PDMS）。 一旦平面材料被去除，平面平坦或平坦的上表面就可以通过使用喷墨印刷或其他技术容易地接受导电迹线的形成。