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公开(公告)号：US20240008173A1
公开(公告)日：2024-01-04
申请号：US18248257
申请日：2020-11-20
Applicant: KOREA PHOTONICS TECHNOLOGY INSTITUTE
Inventor： Gi Dong SA , Ja Yeon KIM , Sa Ung KIM , Ji Ho JEONG , Eunbee KIM
CPC classification number: H05K1/0283 , H05K1/0346 , H05K1/111 , H05K3/005 , H05K2201/0154 , H05K2201/09227 , H05K2201/10106 , H05K2201/10037 , H05K2201/10545
Abstract: A stretchable substrate and a manufacturing method of the stretchable substrate are disclosed. In a step of manufacturing a flexible substrate, a circuit pattern composed of one or more mounting pad parts configured to cause electronic parts to be mounted to a polyimide film PI having a fixed size is formed, and a wiring pattern configured to circuit-connect the mounting pad parts is formed, and further an outer circumferential line of the circuit pattern is realized in a cutting line for cutting. In a step of mounting parts, the electronic parts are mounted on the circuit pattern of the flexible substrate. In a punching step for cutting the cutting line, a punching jig set to be aligned to the cutting line of the flexible substrate on which the parts are mounted is utilized, thereby realizing the excellent tensile performance of wiring configured to connect a circuit.
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公开(公告)号：US11834561B2
公开(公告)日：2023-12-05
申请号：US18193224
申请日：2023-03-30
Applicant: DUPONT ELECTRONICS, INC.
Inventor： Ming-Siao Hsiao
CPC classification number: C08J5/18 , C08G73/1042 , C08G73/1053 , C08G73/1071 , C08J2379/08 , H01L27/1218 , H05K1/0346 , H05K2201/0154
Abstract: A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.
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公开(公告)号：US11800603B2
公开(公告)日：2023-10-24
申请号：US17580183
申请日：2022-01-20
Applicant: KT&G CORPORATION
Inventor： Hun Il Lim , Tae Hun Kim , Jung Ho Han , Sang Kyu Park
IPC: A24F13/00 , A24F40/42 , A24F40/90 , A24F40/46 , A24B15/167 , A24F40/20 , A24F40/30 , A24D3/17 , A24D1/20 , A24F40/60 , F21V3/00 , F21V5/00 , G02B19/00 , H05B3/54 , A24F40/485 , A24F40/10 , A24F40/44 , A24F40/40 , A24F40/57 , A24F40/65 , H05K1/02 , H05K1/14 , H05K1/18 , A24F40/50 , A24F40/95 , A24F15/01 , A24F40/51 , F21Y115/10
CPC classification number: A24F40/42 , A24B15/167 , A24D1/20 , A24D3/17 , A24F15/01 , A24F40/10 , A24F40/20 , A24F40/30 , A24F40/40 , A24F40/44 , A24F40/46 , A24F40/485 , A24F40/50 , A24F40/57 , A24F40/60 , A24F40/65 , A24F40/90 , A24F40/95 , F21V3/00 , F21V5/00 , G02B19/0009 , G02B19/0061 , H05B3/54 , H05K1/0203 , H05K1/0277 , H05K1/148 , H05K1/181 , A24F40/51 , F21Y2115/10 , H05K2201/012 , H05K2201/0154 , H05K2201/10219
Abstract: Provided is an aerosol generating apparatus including: a heater configured to generate aerosol by heating a cigarette, the heater including a first electrically conductive heating element formed along a first path on an electrically insulating substrate, a second electrically conductive heating element formed along a second path on the electrically insulating substrate, and a temperature sensor track formed along a third path in a region between the first path and the second path; a battery configured to supply power to the heater; and a controller configured to control the power supplied from the battery to the heater and monitor a temperature sensed using the temperature sensor track.
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公开(公告)号：US11760838B2
公开(公告)日：2023-09-19
申请号：US16863477
申请日：2020-04-30
Applicant: Arisawa Mfg. Co., Ltd.
Inventor： Hiroyuki Matsuyama , Yoshinori Sato
CPC classification number: C08G73/1067 , B32B15/08 , B32B15/20 , B32B27/281 , H05K1/0346 , B32B2457/08 , H05K2201/0154
Abstract: The polyimide resin precursor in the present embodiment is a polyimide resin precursor obtained by allowing a diamine component and a tetracarboxylic acid anhydride component to react with each other, wherein based on the whole of the diamine component, the content of p-phenylenediamine is 75 mol % or more; the tetracarboxylic acid anhydride component includes an ester-containing tetracarboxylic acid anhydride represented by formula (1), and at least one biphenyltetracarboxylic acid anhydride selected from the group consisting of 3,4,3′,4′-biphenyltetracarboxylic acid dianhydride, 2,3,3′,4′-biphenyltetracarboxylic acid dianhydride and 2,3,2′,3′-biphenyltetracarboxylic acid dianhydride; and based on the whole of the tetracarboxylic acid anhydride component, (i) the total of the content of the ester-containing tetracarboxylic acid anhydride and the content of the biphenyltetracarboxylic acid anhydride is 75 mol % or more, and (ii) the content of the ester-containing tetracarboxylic acid anhydride is 15 to 80 mol %, and the content of the biphenyltetracarboxylic acid anhydride is 85 to 20 mol %.
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公开(公告)号：US11732164B2
公开(公告)日：2023-08-22
申请号：US16767251
申请日：2019-05-17
Applicant: TOYOBO CO., LTD.
Inventor： Ryo Sonoda , Tadahiko Mikami , Tetsuo Kawakusu
IPC: C09J11/06 , C09J7/30 , C09J11/08 , C08L63/00 , C08L79/08 , C08K5/06 , H05K1/03 , B32B15/09 , B32B15/12 , B32B15/20 , B32B27/10 , B32B15/18 , C09J123/26 , H05K1/02 , H05K1/05
CPC classification number: C09J123/26 , C09J11/06 , H05K1/028 , H05K1/056 , H05K2201/0154 , H05K2201/0355
Abstract: The present invention aims to provide an adhesive composition which exhibits high adhesive property not only to the conventional polyimide and polyester film but also to a metal substrate, can achieve high solder heat resistance and exhibits excellent low-dielectric characteristics. According to the present invention, there is provided an adhesive composition containing an acid-modified polyolefin (a), an oligo-phenylene ether (b) having a number-average molecular weight of 3000 or less, and an epoxy resin (c), wherein the adhesive composition satisfies the following requirement(s) (A) and/or (B):
(A) The adhesive composition contains more than 20 parts by mass and 60 parts by mass or less of the epoxy resin (c) to 100 parts by mass of the acid-modified polyolefin (a);
(B) The adhesive composition further contains a polycarbodiimide (d).-
Patent Agency Ranking
公开(公告)号：US11729908B2
公开(公告)日：2023-08-15
申请号：US17178312
申请日：2021-02-18
Applicant: Ticona LLC
Inventor： Young Shin Kim
CPC classification number: H05K1/0373 , H01Q1/243 , H01Q1/38 , H01Q21/065 , H05K3/0032 , H05K3/182 , H05K2201/0129 , H05K2201/0141 , H05K2201/0145 , H05K2201/0154 , H05K2201/0209 , H05K2201/0263 , H05K2201/10098 , H05K2203/072
Abstract: A circuit structure that comprises a substrate and one or more conductive elements disposed on the substrate is provided. The substrate comprises a polymer composition that comprises an electrically conductive filler distributed within a polymer matrix. The polymer matrix contains at least one thermoplastic high performance polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa, and the polymer composition exhibits a dielectric constant of about 4 or more and a dissipation factor of about 0.3 or less, as determined at a frequency of 2 GHz.
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17.发明公开公开(公告)号：US20230250317A1
公开(公告)日：2023-08-10
申请号：US18133393
申请日：2023-04-11
Applicant: KANEKA CORPORATION
Inventor： Fumiya Kono , Takayoshi Akiyama , Mami Akisada , Mari Uno
CPC classification number: C09J7/38 , C09J7/25 , H05K1/036 , H05K1/0393 , H05K2201/0154
Abstract: A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a temperature of 23° C. and a relative humidity of 50% is 0.0030 or less. The adhesive layer has no melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100° C. or higher and 420° C. or lower. The polyimide contained in the adhesive layer has one or more tetracarboxylic dianhydride residues selected from a pyromellitic dianhydride residue and a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, and one or more diamine residues selected from a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4′-diamino-2,2′-dimethylbiphenyl residue.
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公开(公告)号：US20230235139A1
公开(公告)日：2023-07-27
申请号：US18193224
申请日：2023-03-30
Applicant: DUPONT ELECTRONICS, INC.
Inventor： MING-SIAO HSIAO
CPC classification number: C08J5/18 , C08G73/1071 , C08G73/1053 , C08G73/1042 , H05K2201/0154 , C08J2379/08 , H01L27/1218
Abstract: A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.
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公开(公告)号：US11700884B2
公开(公告)日：2023-07-18
申请号：US16639020
申请日：2018-10-26
Applicant: KT&G CORPORATION
Inventor： Hwi Kyeong An
IPC: A24F13/00 , A24F40/42 , A24F40/90 , A24F40/46 , A24B15/167 , A24F40/20 , A24F40/30 , A24D3/17 , A24D1/20 , A24F40/60 , F21V3/00 , F21V5/00 , G02B19/00 , H05B3/54 , A24F40/485 , A24F40/10 , A24F40/44 , A24F40/40 , A24F40/57 , A24F40/65 , H05K1/02 , H05K1/14 , H05K1/18 , A24F40/50 , A24F40/95 , A24F15/01 , A24F40/51 , F21Y115/10
CPC classification number: A24F40/42 , A24B15/167 , A24D1/20 , A24D3/17 , A24F15/01 , A24F40/10 , A24F40/20 , A24F40/30 , A24F40/40 , A24F40/44 , A24F40/46 , A24F40/485 , A24F40/50 , A24F40/57 , A24F40/60 , A24F40/65 , A24F40/90 , A24F40/95 , F21V3/00 , F21V5/00 , G02B19/0009 , G02B19/0061 , H05B3/54 , H05K1/0203 , H05K1/0277 , H05K1/148 , H05K1/181 , A24F40/51 , F21Y2115/10 , H05K2201/012 , H05K2201/0154 , H05K2201/10219
Abstract: Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.
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公开(公告)号：US11700687B2
公开(公告)日：2023-07-11
申请号：US16899504
申请日：2020-06-11
Applicant: DUPONT ELECTRONICS, INC.
Inventor： Joseph Casey Johnson , Delanie J Losey , Peggy Scott , Christopher Dennis Simone
CPC classification number: H05K1/036 , B32B15/08 , B32B27/281 , H05K1/0393 , C08J2479/08 , C08L79/08 , H05K2201/0154 , Y10T428/31681 , Y10T428/31721
Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.
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