公开(公告)号：US09795030B2

公开(公告)日：2017-10-17

申请号：US15468333

申请日：2017-03-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09661749B2

公开(公告)日：2017-05-23

申请号：US14364914

申请日：2012-11-29

Applicant: Panasonic Corporation

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02 ,  B32B5/02 ,  B32B15/12 ,  B32B15/14

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09485861B2

公开(公告)日：2016-11-01

申请号：US14472221

申请日：2014-08-28

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Masaaki Endo ,  Takamitsu Utsumi ,  Shoji Otani

IPC: H05K1/03 ,  C08J5/24 ,  B32B15/08 ,  B32B7/06 ,  B32B15/20 ,  B32B27/20 ,  B32B27/32 ,  B32B27/28

CPC classification number: H05K1/0366 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2264/0257 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2457/08 ,  C08J5/24 ,  C08J2371/12 ,  H05K1/0373 ,  H05K2201/0137 ,  H05K2201/0212 ,  Y10T428/24355

Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

Abstract translation: 本发明提供一种在预浸料坯生产和处理过程中几乎没有树脂颗粒脱落和少量树脂剥离的预浸料，以具有优异的PPE介电性能和良好的粘着性。 一种由基材和包含PPE颗粒的可固化树脂组合物构成的含PPE的预浸料，其中所述预浸料的特征在于：（1）使用甲苯和甲醇的混合溶剂以95:5的质量比从预浸料中提取的PPE 包括不溶于混合溶剂的PPE颗粒（A），（2）PPE颗粒（A）中所含的PPE的量为70质量％以上，（3）包含在PPE颗粒（A）中的PPE的数均分子量 PPE颗粒（A）为8,000-40,000。

公开(公告)号：US09201299B2

公开(公告)日：2015-12-01

申请号：US13768734

申请日：2013-02-15

Applicant: SAN-El KAGAKU CO., LTD.

Inventor： Toshimitsu Kounou ,  Yasuhiro Kuroyanagai ,  Yukihiro Usui ,  Makoto Obunai

IPC: G03F7/029 ,  G03F7/004 ,  C08L33/14 ,  C08L63/04 ,  G03F7/038 ,  G03F7/075 ,  C08F20/28 ,  G03F7/033

CPC classification number: H05K3/287 ,  C08F20/28 ,  G03F7/033 ,  G03F7/0382 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/0757 ,  H05K2201/0209 ,  H05K2201/0212

Abstract: A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 μm, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

Abstract translation: 可固化树脂组合物包含：（I）100重量份的可固化树脂; （II）10〜1200重量份无机填料; 和（III）1〜100重量份弹性模量为1〜2000（MPa），平均粒径为0.01〜10μm的有机填料，其中组分（II）和（III）的含量重量比 ）为1〜41。

公开(公告)号：US20150057413A1

公开(公告)日：2015-02-26

申请号：US14472221

申请日：2014-08-28

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Masaaki ENDO ,  Takamitsu UTSUMI ,  Shoji OTANI

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2264/0257 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2457/08 ,  C08J5/24 ,  C08J2371/12 ,  H05K1/0373 ,  H05K2201/0137 ,  H05K2201/0212 ,  Y10T428/24355

Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

Abstract translation: 本发明提供一种在预浸料坯生产和处理过程中几乎没有树脂颗粒脱落和少量树脂剥离的预浸料，以具有优异的PPE介电性能和良好的粘着性。 一种由基材和包含PPE颗粒的可固化树脂组合物构成的含PPE的预浸料，其中所述预浸料的特征在于：（1）使用甲苯和甲醇的混合溶剂以95:5的质量比从预浸料中提取的PPE 包括不溶于混合溶剂的PPE颗粒（A），（2）PPE颗粒（A）中所含的PPE的量为70质量％以上，（3）包含在PPE颗粒（A）中的PPE的数均分子量 PPE颗粒（A）为8,000-40,000。

公开(公告)号：US20140097005A1

公开(公告)日：2014-04-10

申请号：US14046408

申请日：2013-10-04

Applicant: Tyco Electronics Japan G. K.

Inventor： Katsunori Fukuda ,  Akira Torigoe

IPC: H05K1/03

CPC classification number: H05K1/0306 ,  H05K3/246 ,  H05K3/387 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0239

Abstract: A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent.

Abstract translation: 提供一种玻璃布线板，其包括玻璃基板和底漆层。 主层设置在玻璃基板上，并且包括设置在中间层上的中间层和镀铜层。 中间层包括树脂偶联剂和分散在树脂偶联剂中的金属元素。

公开(公告)号：US08623225B2

公开(公告)日：2014-01-07

申请号：US13581668

申请日：2011-02-21

Applicant: Naoto Takahashi

Inventor： Naoto Takahashi

IPC: H01B13/00

CPC classification number: H05K3/386 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1208 ,  H05K3/246 ,  H05K2201/0212

Abstract: The present invention provides a method of forming a fine pattern by the post-firing method. The production method of a metallized ceramic substrate comprises: a first step of forming an organic base layer on a ceramic substrate; a second step of forming a metal paste layer on the organic base layer to produce a metallized ceramic substrate precursor; and a third step of firing the metallized ceramic substrate precursor, wherein the organic base layer is a layer which absorbs a solvent in the metal paste layer and thermally decomposes at a temperature of firing the metal paste layer.

Abstract translation: 本发明提供通过后焙烧法形成精细图案的方法。 金属化陶瓷基板的制造方法包括：在陶瓷基板上形成有机基底层的第一工序; 在所述有机基底层上形成金属糊料层以制造金属化陶瓷基板前体的第二步骤; 以及烧制所述金属化陶瓷基板前体的第三工序，其中，所述有机基底层是吸收所述金属糊料层中的溶剂并在所述金属糊料层的烧成温度下热分解的层。

公开(公告)号：US20130164679A1

公开(公告)日：2013-06-27

申请号：US13768734

申请日：2013-02-15

Applicant: SAN-EI KAGAKU CO., LTD.

Inventor： Toshimitsu KOUNOU ,  Yasuhiro KUROYANAGAI ,  Yukihiro USUI ,  Makoto OBUNAI

IPC: G03F7/004 ,  C08L63/04 ,  C08L33/14

CPC classification number: H05K3/287 ,  C08F20/28 ,  G03F7/033 ,  G03F7/0382 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/0757 ,  H05K2201/0209 ,  H05K2201/0212

Abstract: A curable resin composition comprises: (I) 100 parts by weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 v, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

Abstract translation: 可固化树脂组合物包含：（I）100重量份的可固化树脂; （II）10〜1200重量份无机填料; 和（III）1〜100重量份弹性模量为1〜2000（MPa），平均粒径为0.01〜10v的有机填料，其中组分（II）和（III）的含量重量比 ）为1〜41。

公开(公告)号：USRE44251E1

公开(公告)日：2013-06-04

申请号：US10839813

申请日：2004-05-06

Applicant: Motoo Asai ,  Yoichiro Kawamura ,  Yoji Mori

Inventor： Motoo Asai ,  Yoichiro Kawamura ,  Yoji Mori

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L23/49833 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R12/523 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/114 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0212 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having through holes formed therein, and a second connection terminal group including a plurality of connection terminals formed at at least the peripheral portion of a back surface of the substrate. The first connection terminal group is connected to the second connection terminal group by way of the through holes. A build-up multilayer interconnection layer having via holes is formed on the top surface of the substrate, so that the first connection terminal group is connected to the second connection terminal group through the build-up multilayer interconnection layer and the through holes. According to another aspect, each signal line on the top surface of the build-up multilayer interconnection layer comprises a plurality of wiring patterns having different widths and a taper-shaped pattern that connects those wiring patterns together and whose width continuously changes. Each signal line has a smaller width at an area having a relatively high wiring density than at an area having a relatively low wiring density.

公开(公告)号：US20120305295A1

公开(公告)日：2012-12-06

申请号：US13576893

申请日：2010-02-03

Applicant: Kazuya Kimura ,  Kazuhiko Ooga ,  Kiichiro Miura

Inventor： Kazuya Kimura ,  Kazuhiko Ooga ,  Kiichiro Miura

IPC: C09D175/04 ,  H05K3/22 ,  H05K1/02

CPC classification number: C08G18/6674 ,  C08G18/0852 ,  C08G18/4833 ,  C08G18/4845 ,  C08G18/758 ,  C08L63/00 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0227

Abstract: It is an object of the present invention to provide a thermosetting composition which is excellent in low warpage properties and long-term electrical insulation reliability and is capable of forming an insulating film that inhibits disconnection of wiring of a flexible wiring board. The thermosetting composition of the present invention is a thermosetting composition for forming an insulating film, by curing the composition, on a flexible wiring board comprising a wiring pattern formed on a flexible substrate, and is characterized in that a cured product obtained by curing the composition has a tensile elastic modulus of 0.5 to 2.0 GPa.

Abstract translation: 本发明的目的是提供一种热弯性组合物，其具有优异的低翘曲性能和长期的电绝缘可靠性，并且能够形成一种绝缘膜，其阻止柔性布线板的布线断开。 本发明的热固性组合物是通过固化该组合物而形成绝缘膜的热固性组合物，该柔性布线板包括形成在柔性基板上的布线图案，其特征在于，将通过固化该组合物而获得的固化产物 拉伸弹性模量为0.5〜2.0GPa。