公开(公告)号：US08898885B2

公开(公告)日：2014-12-02

申请号：US13233735

申请日：2011-09-15

Applicant: Vinit Singh ,  Christine A. Frysz ,  Matthew Geary ,  Eitan Babcock ,  Justin Derbas

Inventor： Vinit Singh ,  Christine A. Frysz ,  Matthew Geary ,  Eitan Babcock ,  Justin Derbas

IPC: H04R31/00 ,  H01Q7/00 ,  A61N1/372

CPC classification number: H01Q1/38 ,  A61N1/0553 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3756 ,  A61N1/3787 ,  B33Y80/00 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F17/02 ,  H01F21/005 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/42 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01F41/32 ,  H01F2027/2809 ,  H01Q7/00 ,  H01R43/00 ,  H01R43/20 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/126 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49195

Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Abstract translation: 一种用于具有多个导体层的无线通信结构，分隔每个导体层的绝缘体层以及连接两个导体层的至少一个连接器，其中在谐振器中感应电信号时电阻减小 预定频率。

公开(公告)号：US08855786B2

公开(公告)日：2014-10-07

申请号：US13255659

申请日：2010-03-09

Applicant: Justin R. Derbas ,  Vinit Singh

Inventor： Justin R. Derbas ,  Vinit Singh

IPC: A61N1/00

CPC classification number: H01Q1/38 ,  A61N1/0553 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3756 ,  A61N1/3787 ,  B33Y80/00 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F17/02 ,  H01F21/005 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/42 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01F41/32 ,  H01F2027/2809 ,  H01Q7/00 ,  H01R43/00 ,  H01R43/20 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/126 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49195

Abstract: A resonator is provided for use in a system for energy transfer between a first device and a second device. The resonator includes a coil having multiple layers, each layer including inductive and insulative layers. The thickness of a conductor layer may be relative to the skin depth of the conductor.

Abstract translation: 提供了一种谐振器，用于在第一装置和第二装置之间用于能量传递的系统中。 谐振器包括具有多层的线圈，每层包括感应层和绝缘层。 导体层的厚度可以相对于导体的趋肤深度。

公开(公告)号：US08803649B2

公开(公告)日：2014-08-12

申请号：US13797593

申请日：2013-03-12

Applicant: NuCurrent, Inc.

Inventor： Vinit Singh ,  Jacob Babcock ,  Christine A. Frysz

IPC: H01F5/00

CPC classification number: H01Q1/38 ,  A61N1/0553 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3756 ,  A61N1/3787 ,  B33Y80/00 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F17/02 ,  H01F21/005 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/42 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01F41/32 ,  H01F2027/2809 ,  H01Q7/00 ,  H01R43/00 ,  H01R43/20 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/126 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49195

Abstract: A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

Abstract translation: 描述了具有由绝缘体层隔开的多个导体层的电感器的多层多匝结构。 电感器还包括电连接在导体层之间的连接器。 电感器的结构可以包括其中的空腔。 电感器的结构使得电阻在其中减小，从而提高电感器的效率。 电感器在无线电频率范围内工作时特别有用。

公开(公告)号：US20140160707A1

公开(公告)日：2014-06-12

申请号：US13707113

申请日：2012-12-06

Applicant: Zhichao Zhang ,  Tao Wu ,  Zhiguo Qian ,  Kemal Aygun

Inventor： Zhichao Zhang ,  Tao Wu ,  Zhiguo Qian ,  Kemal Aygun

IPC: H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/0298 ,  H01L21/4846 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K2201/0191 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

Abstract translation: 本文描述的一些实施例包括形成这种装置的装置和方法。 一个这样的实施例可以包括具有要耦合到半导体管芯的焊盘的布线布置，其中第一迹线耦合到焊盘之间的第一焊盘，以及耦合到焊盘之间的第二焊盘的第二迹线。 第一和第二迹线可以具有不同的厚度。 描述包括附加装置和方法的其他实施例。

公开(公告)号：US08745863B2

公开(公告)日：2014-06-10

申请号：US13169674

申请日：2011-06-27

Applicant: Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

Inventor： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC: H01K3/10

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate.

Abstract translation: 制造多层印刷电路板的方法包括以下步骤（A）和（B）。 （A）提供穿透开口，其形成为通孔，并且每个具有用于芯基板的小直径，以及（B）提供形成为具有用于芯基板的大直径的通孔的穿透开口。

公开(公告)号：US08720048B2

公开(公告)日：2014-05-13

申请号：US14030579

申请日：2013-09-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Mi Sun Hwang ,  Jae Joon Lee ,  Myung Sam Kang

IPC: H05K3/36 ,  H01K3/10

CPC classification number: H05K3/10 ,  H05K1/0271 ,  H05K1/09 ,  H05K3/4602 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/068 ,  H05K2201/09136

Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.

Abstract translation: 制造印刷电路板的方法包括：布置芯层，其中在多个绝缘构件之间布置有具有不同热膨胀系数的金属层的至少两层的至少两层的弯曲防止部分; 形成电路图案，以便在芯层的内部和芯层的外表面中的至少一个上具有期望的图案; 以及形成包括露出所述芯层上的电路图案的开口部分的绝缘层。

公开(公告)号：US08698591B2

公开(公告)日：2014-04-15

申请号：US13797581

申请日：2013-03-12

Applicant: NuCurrent, Inc.

Inventor： Vinit Singh ,  Jacob Babcock ,  Christine A. Frysz

IPC: H01F5/00

CPC classification number: H01Q1/38 ,  A61N1/0553 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3756 ,  A61N1/3787 ,  B33Y80/00 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F17/02 ,  H01F21/005 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/42 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01F41/32 ,  H01F2027/2809 ,  H01Q7/00 ,  H01R43/00 ,  H01R43/20 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/126 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49195

Abstract: A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

Abstract translation: 描述了具有由绝缘体层隔开的多个导体层的电感器的多层多匝结构。 电感器还包括电连接在导体层之间的连接器。 电感器的结构可以包括其中的空腔。 电感器的结构使得电阻在其中减小，从而提高电感器的效率。 电感器在无线电频率范围内工作时特别有用。

公开(公告)号：US08698590B2

公开(公告)日：2014-04-15

申请号：US13797561

申请日：2013-03-12

Applicant: NuCurrent, Inc.

Inventor： Vinit Singh ,  Jacob Babcock ,  Christine A. Frysz

IPC: H01F5/00

CPC classification number: H01Q1/38 ,  A61N1/0553 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3756 ,  A61N1/3787 ,  B33Y80/00 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F17/02 ,  H01F21/005 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/42 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01F41/32 ,  H01F2027/2809 ,  H01Q7/00 ,  H01R43/00 ,  H01R43/20 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/126 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49195

Abstract: A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

Abstract translation: 描述了具有由绝缘体层隔开的多个导体层的电感器的多层多匝结构。 电感器还包括电连接在导体层之间的连接器。 电感器的结构可以包括其中的空腔。 电感器的结构使得电阻在其中减小，从而提高电感器的效率。 电感器在无线电频率范围内工作时特别有用。

公开(公告)号：US08692642B2

公开(公告)日：2014-04-08

申请号：US13797478

申请日：2013-03-12

Applicant: NuCurrent, Inc.

Inventor： Vinit Singh ,  Jacob Babcock ,  Christine A. Frysz

IPC: H01F5/00

CPC classification number: H01Q1/38 ,  A61N1/0553 ,  A61N1/3605 ,  A61N1/37229 ,  A61N1/3756 ,  A61N1/3787 ,  B33Y80/00 ,  H01F5/00 ,  H01F5/003 ,  H01F7/06 ,  H01F17/00 ,  H01F17/0006 ,  H01F17/0013 ,  H01F17/02 ,  H01F21/005 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/30 ,  H01F27/42 ,  H01F29/02 ,  H01F38/14 ,  H01F41/00 ,  H01F41/04 ,  H01F41/041 ,  H01F41/32 ,  H01F2027/2809 ,  H01Q7/00 ,  H01R43/00 ,  H01R43/20 ,  H02J7/025 ,  H02J17/00 ,  H02J50/12 ,  H02P13/00 ,  H03H7/01 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0062 ,  H04B5/0068 ,  H04B5/0075 ,  H05B6/06 ,  H05B6/1245 ,  H05B6/36 ,  H05B6/362 ,  H05K1/165 ,  H05K2201/0352 ,  Y02B40/126 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49195

Abstract: A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

Abstract translation: 描述了具有由绝缘体层隔开的多个导体层的电感器的多层多匝结构。 电感器还包括电连接在导体层之间的连接器。 电感器的结构可以包括其中的空腔。 电感器的结构使得电阻在其中减小，从而提高电感器的效率。 电感器在无线电频率范围内工作时特别有用。

公开(公告)号：US08683684B2

公开(公告)日：2014-04-01

申请号：US13200920

申请日：2011-10-05

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Abstract translation: 一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。