Abstract:
A MICROWAVE CIRCUIT EMPLOYING MULTIPLATE TECHNIQUE IN WHICH TWO PLATES OF DIELECTRIC MATERIAL EACH CARRY ON ONE SIDE THEREOF A CONTINUOUS METAL LAYER AND ON THE OTHER SIDE CONDUCTOR TRACKS FORMING MICROWAVE CIRCUIT ELEMENTS, WITH SUCH PLATES BEING SUPERIMPOSED WITH THEIR SIDES CARRYING SUCH CONDUCTOR TRACKS IN OPPOSED RELATION, AND COMPRESSION FORCES APPLIED THERETO, CHARACTERIZED BY THE DIELECTRIC BEING IN THE FORM OF A RELATIVELY THINC COATING ON ONE SIDE OF RESPECTIVE RELATIVELY THICK METAL PLATES AND THE CONDUCTOR TRACKS BEING DISPOSED THE OUTER FACE OF THE RESPECTIVE DIELECTRIC COATINGS, THE RESPECTIVE PLATES AND ASSOCIATED DIELECTRIC COATINGS HAVING PERFORATIONS EXTENDING THERETHROUGH, THE WALLS OF THE APERTURES BEING COATED WITH A METALLIT LAYER EXTENDING FROM SELECTED CONDUCTOR TRACKS TO THE ASSOCIATED METAL PLATE TO CONDUCTIVELY CONNECT THE SAME.
Abstract:
The present application discloses a filtering cable, which solves the problem that the cable in the related art cannot ensure a simple and reasonable structural design while having good filter performance. One or several core wires and N defective conductor layers surrounding the core wires are sequentially provided from inside to outside in the cross section in the radial direction of the filtering cable; wherein the defective conductor layer has an etching pattern; the etching pattern is distributed in the axial direction of the filtering cable; the etching pattern is used to make the filtering cable equivalent to a preset filter circuit to filter the signal transmitted in the filtering cable.
Abstract:
Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).
Abstract:
A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
Abstract:
Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.
Abstract:
According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).
Abstract:
A substrate integrated waveguide (10) comprises a top conductive layer (14) and a bottom conductive layer (15) provided on either sides a substrate (11). At least one wall (12, 13) of conductive material is provided in the substrate (11) to define, together with the top and bottom layers (14, 15), the waveguide. The at least one wall (12, 13) comprise a multitude of thin conductive wires densely arranged close to each other in the substrate (11) and having respective short ends connected to the top and bottom layers (14, 15). The high number of wires per surface unit in the wall (12, 13) effectively prevent significant amount of power leakage through the wall (12, 13) during operation of the substrate integrated waveguide (10).
Abstract:
Various embodiments implement waveguides for signal distribution or signal filtering in satellite receivers. According to some embodiments, a low noise block downconverter (LNB) is implemented using waveguides configured for signal distribution, band pass filtering, low pass filtering, high pass filtering, or band stop filtering. For some embodiments, the waveguides may be formed by the LNB chassis and the ground plane of a printed circuit board mounted to the LNB chassis.
Abstract:
In some embodiments a printed circuit board is fabricated using printed circuit board material, and a waveguide is formed that is contained within the printed circuit board material. Other embodiments are described and claimed.
Abstract:
A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.