公开(公告)号：US08971055B2

公开(公告)日：2015-03-03

申请号：US12336058

申请日：2008-12-16

Applicant: Randall James Gass ,  Rodney Powell ,  Nick Campbell ,  Timothy John Luksetich ,  Roger Wolf ,  Jerry Scheel

Inventor： Randall James Gass ,  Rodney Powell ,  Nick Campbell ,  Timothy John Luksetich ,  Roger Wolf ,  Jerry Scheel

IPC: H05K7/00 ,  H01H71/12 ,  H05K3/46 ,  H01H1/58 ,  H01H71/08 ,  H05K1/18

CPC classification number: H01H71/123 ,  H01H71/125 ,  H01H2001/5816 ,  H01H2071/086 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A circuit breaker includes a housing, a rigid circuit board, and a flexible circuit board. The rigid circuit board is enclosed within the housing and has a main surface for supporting an electronic component. The flexible circuit board has a first end that is directly attached to an edge of the rigid circuit board.

Abstract translation: 断路器包括壳体，刚性电路板和柔性电路板。 刚性电路板被封装在壳体内并具有用于支撑电子部件的主表面。 柔性电路板具有直接附接到刚性电路板的边缘的第一端。

公开(公告)号：US08911848B2

公开(公告)日：2014-12-16

申请号：US13681872

申请日：2012-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Kyung Kim

IPC: H05K1/05 ,  H05K3/00 ,  H05K3/02

CPC classification number: H05K1/056 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0761 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0228 ,  Y10T156/10

Abstract: There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.

Abstract translation: 提供了一种覆铜层压板（CCL），包括：金属板; 绝缘层，其平面面积大于金属板的面积，并且层压在金属板上; 以及层叠在所述绝缘层上的铜层，其中所述绝缘层的边缘向外延伸超过所述金属板的边缘，使得形成将所述金属板的边缘与所述铜层的边缘绝缘的绝缘距离。 绝缘层可以包括聚酰亚胺层和聚酰亚胺接合层。

公开(公告)号：US08884166B2

公开(公告)日：2014-11-11

申请号：US13644888

申请日：2012-10-04

Applicant: Fujikura Ltd.

Inventor： Yuji Inatani

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K3/4611 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49144

Abstract: A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit formed on an insulating layer and having a region corresponding to the connector portion peeled off, an inner layer circuit side of the inner layer substrate and an insulating layer side of the outer layer substrate being adhered to one another via an adhesive layer so as to face one another, and a conductor layer other than the connector portion of the inner layer circuit being adhered to the outer layer substrate directly by the adhesive layer.

Abstract translation: 一种具有内层基板的连接部分露出的多层电路板，所述多层电路板包括：形成有内层电路的内层基板，所述内层电路包括所述连接器部分; 以及外层基板，其具有形成在绝缘层上并且具有与所述连接器部分剥离的区域相对应的区域的外层电路，所述内层基板的内层电路侧和所述外层基板的绝缘层侧被粘附到 通过粘合剂层彼此面对，并且除了内层电路的连接器部分之外的导体层直接通过粘合剂层粘附到外层基板。

公开(公告)号：US08759685B2

公开(公告)日：2014-06-24

申请号：US12609054

申请日：2009-10-30

Applicant: Hideaki Sakaguchi ,  Akinori Shiraishi

Inventor： Hideaki Sakaguchi ,  Akinori Shiraishi

IPC: H05K1/00 ,  H05K1/03

CPC classification number: H05K3/0052 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15788 ,  H05K1/0306 ,  H05K2201/0187 ,  H05K2201/0909 ,  H05K2201/09145 ,  Y10T29/49162 ,  H01L2224/0401

Abstract: A wiring substrate includes a substrate body including first and second surfaces on opposite sides and a substrate side surface; a penetration electrode penetrating through the substrate body; a first wiring pattern on the first surface and including a first pad; a second wiring pattern on the second surface and including a second pad; a first insulating resin layer covering the first wiring pattern except for an area corresponding to the first pad and having a first resin side surface; a second insulating resin layer covering the second wiring pattern except for an area corresponding to the second pad and having a second resin side surface that is flush with the first resin side surface; a notch part encompassing at least apart of the substrate body and having a resin material provided therein. The substrate side surface is located more inward than the first and second resin side surfaces.

Abstract translation: 布线基板包括：基板主体，包括相对侧的第一表面和第二表面;以及基板侧表面; 穿透基板主体的穿透电极; 第一布线图案，其包括第一垫; 第二布线图案，其包括第二垫; 第一绝缘树脂层，覆盖除了与所述第一焊盘相对应的区域之外的所述第一布线图案，并且具有第一树脂侧表面; 第二绝缘树脂层，覆盖除了与第二焊盘相对应的区域之外的第二布线图案，并且具有与第一树脂侧表面齐平的第二树脂侧表面; 凹口部分，其至少包围基板主体的一部分并且具有设置在其中的树脂材料。 基板侧表面比第一和第二树脂侧表面更靠内侧。

公开(公告)号：US20140146500A1

公开(公告)日：2014-05-29

申请号：US14093135

申请日：2013-11-29

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke SHIMIZU ,  Yuichi NAKAMURA ,  Tsuyoshi YAMAGUCHI

IPC: H05K3/00 ,  H05K1/18

CPC classification number: H05K3/0097 ,  H01L21/568 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/1469 ,  H01L2924/00

Abstract: A multi-piece substrate includes a unit component having four sides and including multiple wiring boards arrayed in a matrix, and a frame component supporting the unit component such that the frame component is surrounding an outer periphery of the unit component. Each of the wiring boards has a semiconductor element built therein, and the frame component has multiple slit portions formed such that the slit portions are formed along the four sides of the unit component, respectively.

Abstract translation: 多片基板包括具有四边的单元组件，并且包括以矩阵形式排列的多个布线板，以及支撑单元组件的框架部件，使得框架部件围绕单元部件的外周。 每个布线板具有内置的半导体元件，并且框架部件具有多个狭缝部分，这些狭缝部分形成为使得狭缝部分分别沿单元部件的四个侧面形成。

公开(公告)号：US08610580B2

公开(公告)日：2013-12-17

申请号：US13449237

申请日：2012-04-17

Applicant: Paul Elizondo ,  John Azevedo

Inventor： Paul Elizondo ,  John Azevedo

IPC: G08B13/14

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A breakaway RFID tag is configured such that it includes part of a Printed Circuit Board Assembly (PCB). Thus, the breakaway RFID tag can be used to track the PCB as it migrates through a manufacturing process. In one embodiment, the RFID tag can be assembled first and then used to track the PCB as it is populated with components and installed into larger assemblies and ultimately into the end device. Once the PCB is installed into a larger assembly or the end device, the breakaway RFID tag is configured such that it can be broken off and attached to the outside of the larger assembly or end device.

Abstract translation: 分离的RFID标签被配置为使得其包括印刷电路板组件（PCB）的一部分。 因此，分离的RFID标签可以用于在通过制造过程迁移时跟踪PCB。 在一个实施例中，RFID标签可以首先组装，然后用于跟踪PCB，因为它被填充有部件并且被安装到更大的组件中并且最终进入终端设备。 一旦PCB被安装到更大的组件或终端设备中，分离的RFID标签被配置成使得它可以被分解并且附接到较大组件或终端设备的外部。

公开(公告)号：US20130280559A1

公开(公告)日：2013-10-24

申请号：US13864931

申请日：2013-04-17

Applicant: SAFT

Inventor： Laurent GUIDAL ,  Pascal SUSSET ,  Nicolas VIGIER

IPC: H01M10/48 ,  H01M2/12

CPC classification number: H01M10/48 ,  H01M2/105 ,  H01M2/12 ,  H01M2/1241 ,  H01M2/1276 ,  H01M2/345 ,  H01M10/0525 ,  H01M10/34 ,  H01M10/425 ,  H01M10/482 ,  H01M10/488 ,  H01M2200/20 ,  H05K1/0268 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/0909 ,  H05K2201/10037 ,  H05K2203/175

Abstract: In a system and method for detecting venting of a sealed storage cell, the sealed storage cell comprises a container with a sealing cap adapted to be detached from the container and move in the presence of gas overpressure inside the container to allow venting of the storage cell. The detection system comprises a printed circuit board with a central portion designed to be situated opposite the sealing cap, a peripheral portion surrounding the central portion and connected to the central portion by a hinge adapted to flex during movement of the sealing cap, and at least one frangible portion adapted to break upon movement of the sealing cap. An electrical printed track connects the peripheral portion to the central portion through the hinge and frangible portion(s), and is designed to be broken upon breaking of the frangible portion(s) following movement of the sealing cap.

Abstract translation: 在用于检测密封存储单元的排气的系统和方法中，密封储存单元包括具有密封盖的容器，该密封盖适于与容器分离并在容器内存在气体超压的情况下移动以允许储存室 。 检测系统包括印刷电路板，其中心部分被设计成与密封盖相对设置，围绕中心部分并通过适于在密封盖运动期间弯曲的铰链连接到中心部分的周边部分，并且至少 一个易碎部分适于破坏密封帽的运动。 电印刷轨道通过铰链和易碎部分将周边部分连接到中心部分，并且被设计成在密封盖的移动之后断裂易碎部分时被破坏。

公开(公告)号：US08536457B2

公开(公告)日：2013-09-17

申请号：US12453627

申请日：2009-05-18

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/20

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.

公开(公告)号：US20130229778A1

公开(公告)日：2013-09-05

申请号：US13774655

申请日：2013-02-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Chung Sang RYOU

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0266 ,  H05K1/02 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09918 ,  Y10T29/49117

Abstract: A PCB according to an exemplary embodiment of the present disclosure includes a plurality of unit PCBs arrayed on the PCB, and a sawing line formed among the plurality of unit PCBs.

Abstract translation: 根据本公开的示例性实施例的PCB包括排列在PCB上的多个单元PCB以及在多个单元PCB之间形成的锯线。

公开(公告)号：US08496866B2

公开(公告)日：2013-07-30

申请号：US12596887

申请日：2008-04-17

Applicant: Claus Peter Kluge

Inventor： Claus Peter Kluge

IPC: B29C71/00

CPC classification number: H05K3/0052 ,  B28D1/221 ,  H01C17/006 ,  H05K1/0306 ,  H05K2201/0909 ,  H05K2203/1105 ,  H05K2203/1121 ,  Y10T428/15

Abstract: A method for the targeted introduction of cleavage lines or predetermined breaking lines in ceramic substrates for subsequent separation, wherein, in a thermal treatment step or methods step, the cleavage line or predetermined breaking line is heated locally and then cooled suddenly by a coolant in such a way that targeted cracking or material weakness occurs along the cleavage line or predetermined breaking lines.

Abstract translation: 用于在陶瓷基板中靶向引入切割线或预定断裂线用于后续分离的方法，其中在热处理步骤或方法步骤中，将切割线或预定断裂线局部加热，然后由冷却剂突然冷却 沿切割线或预定断裂线发生靶向裂纹或材料薄弱的方式。