公开(公告)号：US20160372407A1

公开(公告)日：2016-12-22

申请号：US14902353

申请日：2014-10-23

Applicant: KYOCERA CORPORATION

Inventor： Kensaku MURAKAMI

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L24/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/0969 ,  H01L2924/00012

Abstract: This wiring board is provided with: an insulating base that has a lateral surface having an incision part; an electrode that is provided on the inner surface of the incision part; and a wiring conductor that is provided within the insulating base or on the surface of the insulating base and is electrically connected to the electrode via a connection conductor. The width of the incision part is larger than the depth thereof, and the connection conductor is connected to the electrode at an end of the incision part in the width direction. An electronic device according to the present invention is provided with this wiring board and an electronic component that is mounted to the upper surface of this wiring board.

Abstract translation: 该布线板设置有：具有切口部的侧面的绝缘基座; 设置在切口部的内表面上的电极; 以及布线导体，其设置在所述绝缘基底内或所述绝缘基底的表面上，并且经由连接导体电连接到所述电极。 切口部分的宽度大于其深度，并且连接导体在宽度方向上在切口部分的端部处连接到电极。 根据本发明的电子设备设置有该布线板和安装到该布线板的上表面的电子部件。

公开(公告)号：US20160345424A1

公开(公告)日：2016-11-24

申请号：US15159393

申请日：2016-05-19

Applicant: Tomoyoshi Kobayashi ,  Masato Kasashima

Inventor： Tomoyoshi Kobayashi ,  Masato Kasashima

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/05 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/09854 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2203/063

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract translation: 印刷电路板包括：基底构件; 设置在所述基座部件中的凹部; 安装在所述凹部中的散热构件; 以及经由绝缘体设置在基座构件的上侧和散热构件上的布线图案。 形成有凹部的内周面和散热构件的外周面彼此接触的接触部以及彼此接触的分离部。 凹部与散热构件之间的间隙填充有通过加热熔化的基底构件的热固性树脂。 布线图案的宽度方向的至少一部分通过与分离部垂直重叠的位置，其整个部分未穿过与接触部分垂直重叠的位置。

公开(公告)号：US20160294090A1

公开(公告)日：2016-10-06

申请号：US14842979

申请日：2015-09-02

Applicant: CviLux Corporation

Inventor： CHAO-CHUN YANG

IPC: H01R12/77

CPC classification number: H01R12/58 ,  H01R12/62 ,  H01R13/6658 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/1034

Abstract: An electrical connector is provided. The electrical connector includes an insulating housing, an adaptor board, and a plurality of terminals. The insulating housing has a plurality of slots, a plurality of terminal holes, and an inserting recess. The terminal holes are formed on an inner sidewall of the inserting recess. The adaptor board disposed on the insulating housing includes a plurality of first conductive portions and a plurality of notches formed at one side of the adaptor board. The terminals are respectively accommodated in the slots of the insulating housing. Each of the terminals has an elastic portion and a contacting portion. Each of elastic portions of the terminals can be engaged with each of notches and electrically connected to each of the first conductive portions. The contacting portions of the terminals respectively pass through the terminal holes and protrude from the inner sidewall of the inserting recess.

Abstract translation: 提供电连接器。 电连接器包括绝缘壳体，适配器板和多个端子。 绝缘壳体具有多个槽，多个端子孔和插入凹槽。 端子孔形成在插入凹部的内侧壁上。 设置在绝缘壳体上的适配器板包括形成在适配器板一侧的多个第一导电部分和多个凹口。 端子分别容纳在绝缘壳体的槽中。 每个端子具有弹性部分和接触部分。 端子的每个弹性部分可以与每个凹口接合并且电连接到每个第一导电部分。 端子的接触部分分别穿过端子孔并从插入凹槽的内侧壁突出。

公开(公告)号：US09402303B2

公开(公告)日：2016-07-26

申请号：US13908280

申请日：2013-06-03

Applicant: Apple Inc.

Inventor： Amy Qian ,  Carl R. Peterson ,  Jeremy C. Franklin ,  Joseph F. Alverson ,  Kevin D. Gibbs

IPC: H05K1/11 ,  H05K3/46 ,  H05K1/02 ,  G06F1/16 ,  H05K1/14

CPC classification number: H05K1/0221 ,  G06F1/1658 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09236 ,  H05K2201/09618 ,  H05K2201/10128

Abstract: An electronic device contains electrical circuits. The circuits may include circuitry on printed circuit boards and components such as a touch screen display and buttons. Signal paths for routing signals between the electrical circuits may be formed from metal traces on flexible printed circuit cables. The flexible printed circuit cables may be bent around one or more bend axes. A flexible printed circuit cable may be formed from a flexible polymer substrate having one or more layers of polymer. Upper and lower ground layers may be supported by the flexible polymer substrate. The metal traces for the signal paths may lie between the upper and lower ground layers. Longitudinal slits within the flexible printed circuit may be formed that pass through the ground layers and the polymer layers. Vias may be formed that couple the ground layers together. The vias may run along the edges of the slits.

Abstract translation: 电子设备包含电路。 电路可以包括印刷电路板上的电路和诸如触摸屏显示器和按钮的部件。 用于在电路之间路由信号的信号路径可以由柔性印刷电路电缆上的金属迹线形成。 柔性印刷电路电缆可围绕一个或多个弯曲轴弯曲。 柔性印刷电路电缆可以由具有一层或多层聚合物的柔性聚合物基材形成。 上下接地层可以由柔性聚合物基底支撑。 用于信号路径的金属迹线可位于上层和下层之间。 可以形成柔性印刷电路内的纵向狭缝，其穿过接地层和聚合物层。 可以形成将接地层耦合在一起的通孔。 通孔可以沿着狭缝的边缘延伸。

公开(公告)号：US09204545B2

公开(公告)日：2015-12-01

申请号：US14526698

申请日：2014-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigetoshi Hayashi ,  Tomoya Yokoyama ,  Takako Sato

IPC: H05K1/11 ,  H05K1/03 ,  H01L23/15 ,  H01L23/498 ,  H05K1/02 ,  H05K1/09 ,  H01L23/13

CPC classification number: H05K1/112 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15162 ,  H01L2924/1531 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/113 ,  H05K1/116 ,  H05K1/165 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/083 ,  H05K2201/09145

Abstract: Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.

Abstract translation: 提供一种多层基板，其可以防止由于电极焊盘的线膨胀系数与陶瓷材料的线性膨胀系数之间的差异而产生的应力产生的裂纹。 布置在最外面部件安装电极焊盘下方的层上的电极焊盘的面积大于部件安装电极焊盘的面积。 类似地，布置在部件安装电极焊盘下方的层上的电极焊盘具有比部件安装电极焊盘的面积更大的面积，布置在部件安装电极焊盘下方的电极焊盘的面积大于 部件安装电极焊盘和布置在部件安装电极焊盘下方的层上的电极焊盘的面积大于部件安装电极焊盘的面积。

公开(公告)号：US09130326B2

公开(公告)日：2015-09-08

申请号：US14365531

申请日：2011-12-14

Applicant: Alfons Meis

Inventor： Alfons Meis

IPC: H01R4/60 ,  H01R25/14 ,  H01R25/16 ,  A47B97/00 ,  H05K1/11 ,  A47B57/40 ,  A47F5/10

CPC classification number: H01R25/14 ,  A47B57/40 ,  A47B97/00 ,  A47B2220/0077 ,  A47F5/103 ,  H01R25/16 ,  H05K1/118 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A device for supplying electrical energy to a load. A supporting element made of electrically insulating material is provided, which has at least one electrical strip conductor formed from an electrically conductive layer. At least one electrically conductive contact face per strip conductor is provided on the source side, via which the strip conductor is contactable with the voltage source. A flat plug that includes the load-side ends of the strip conductors is provided on the supporting element and effects the electrical connection to the load. A system for electrification of an electrical load on a furniture item is provided. At least one device, a support and at least one vertical profile are provided. The device is mounted on the support and the strip conductors of the support are electrified by inserting the support into the profile. For that purpose, the profile has at least one vertically arranged conductor rail.

Abstract translation: 用于向负载提供电能的装置。 提供由电绝缘材料制成的支撑元件，其具有由导电层形成的至少一个电条导体。 每个条形导体至少有一个导电接触面设置在源极侧，带状导体可以通过该接触面与电压源接触。 包括带状导体的负载侧端部的扁平插头设置在支撑元件上并且实现与负载的电连接。 提供了一种用于家具上的电负荷起电的系统。 提供至少一个装置，支撑件和至少一个垂直轮廓。 该装置安装在支撑件上，并且通过将支撑件插入型材中，使支撑件的带状导体通电。 为此，轮廓具有至少一个垂直布置的导轨。

公开(公告)号：US09119319B2

公开(公告)日：2015-08-25

申请号：US14512754

申请日：2014-10-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Wataru Kaneda ,  Noriyoshi Shimizu ,  Akio Rokugawa ,  Kaori Yokota

IPC: H01L23/12 ,  H05K1/18 ,  H01L23/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/18 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16054 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0052 ,  H05K3/043 ,  H05K3/4007 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/2072 ,  H05K2203/025 ,  H05K2203/0773 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A wiring board includes a first insulating layer containing a thermosetting resin, a first wiring layer stacked on an upper surface of the first insulating layer, a second insulating layer stacked on the upper surface of the first insulating layer, a second wiring layer stacked on an upper surface of the second insulating layer, and a third insulating layer stacked on the upper surface of the second insulating layer. The second and third insulating layers contain a first photosensitive resin. An outer side surface of the second insulating layer is flush with an outer side surface of the first insulating layer. An outer side surface of the third insulating layer is located inside the outer side surface of the second insulating layer in a plan view. The upper surface of the second insulating layer connecting to the outer side surface thereof is exposed from the third insulating layer.

Abstract translation: 布线基板包括含有热固性树脂的第一绝缘层，堆叠在第一绝缘层的上表面上的第一布线层，堆叠在第一绝缘层的上表面上的第二绝缘层，堆叠在第一绝缘层上的第二布线层 第二绝缘层的上表面和堆叠在第二绝缘层的上表面上的第三绝缘层。 第二和第三绝缘层包含第一感光树脂。 第二绝缘层的外侧表面与第一绝缘层的外侧表面齐平。 第三绝缘层的外侧表面在平面图中位于第二绝缘层的外侧表面内。 连接到其外侧表面的第二绝缘层的上表面从第三绝缘层露出。

公开(公告)号：US09107311B2

公开(公告)日：2015-08-11

申请号：US13858102

申请日：2013-04-08

Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Fu-Yun Shen ,  Zhi-Tian Wang ,  Bo Ming

IPC: H05K1/09 ,  H05K3/10 ,  H05K3/42 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/092 ,  H05K3/005 ,  H05K3/10 ,  H05K3/281 ,  H05K3/427 ,  H05K2201/0195 ,  H05K2201/09036 ,  H05K2201/09145 ,  Y10T29/49155

Abstract: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.

Abstract translation: 印刷电路板包括以上述顺序布置的第一导电电路图案，基底层，粘合片和第二导电电路图案。 印刷电路板包括单层导电电路区域。 粘合片在空间上限定对应于单层导电电路区域的第一开口。 粘合片包括围绕第一开口的第一内侧壁。 第二导电电路图案限定在空间上对应于单层导电电路区域的第二开口。 第二导电电路图案包括围绕第二开口的第二内侧壁。 第一内侧壁和第二内侧壁不是完全共面的。

公开(公告)号：US09088106B2

公开(公告)日：2015-07-21

申请号：US13894041

申请日：2013-05-14

Applicant: CommScope, Inc. of North Carolina

Inventor： Amid I. Hashim

IPC: H01R13/6466 ,  H01R24/64 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11

CPC classification number: H01R13/6466 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09145 ,  H05K2201/09672 ,  H05K2201/10189 ,  H05K2201/10363

Abstract: Communications jacks include a housing and a flexible printed circuit board that is at least partly within the housing. Eight input contacts that are mounted on the flexible printed circuit board, with the fourth and fifth input contacts forming a first differential pair, the first and second input contacts forming a second differential pair, the third and sixth input contacts forming a third differential pair, and the seventh and eighth input contacts forming a fourth differential pair. The plug contact regions of the input contacts are arranged in numerical order across a plug aperture of the jack. Eight output contacts are also provided, and the flexible printed circuit board includes conductive paths that electrically connect each input contact to a respective output contact. The fourth and fifth input contacts are mounted on the flexible printed circuit board at respective first and second mounting locations that are closer to a back end of the housing than are respective third and fourth mounting locations where the third and sixth input contacts are mounted on the flexible printed circuit board.

Abstract translation: 通信插孔包括壳体和至少部分地在壳体内的柔性印刷电路板。 安装在柔性印刷电路板上的八个输入触点，其中第四和第五输入触点形成第一差分对，第一和第二输入触点形成第二差分对，第三和第六输入触点形成第三差分对， 并且第七和第八输入触点形成第四差分对。 输入触点的插头接触区域以数字顺序布置在插座的插头孔上。 还提供八个输出触点，并且柔性印刷电路板包括将每个输入触点电连接到相应的输出触点的导电路径。 第四和第五输入触点安装在柔性印刷电路板上的相应的第一和第二安装位置处，其比第三和第四安装位置更靠近壳体的后端，其中第三和第六输入触点安装在 柔性印刷电路板。

公开(公告)号：US09084362B2

公开(公告)日：2015-07-14

申请号：US13736086

申请日：2013-01-08

Applicant: NVIDIA Corporation

Inventor： Shuang Xu

IPC: H05K3/00 ,  H05K1/14 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K1/142 ,  H05K3/36 ,  H05K3/42 ,  H05K2201/09145 ,  H05K2201/09618 ,  H05K2201/209 ,  H05K2203/044 ,  Y10T29/49126

Abstract: Disclosed are a method and system to reduce impedance of printed circuit boards through an interconnecting of printed circuit boards using a square wave pattern of plated-through holes. A method of connecting a first printed circuit board to a second printed circuit board comprises forming a square wave pattern of the first printed circuit board and the second printed circuit board and adjoining the first printed circuit board and the second printed circuit board. The method also involves producing plated-through holes along the square wave pattern, a top section, and/or a bottom section of the adjoined first printed circuit board and second printed circuit board. The method further involves securing the top section and the bottom section using a first metal clip and a second metal clip, respectively, and connecting the first printed circuit board to the second printed circuit board by a wave soldering process.

Abstract translation: 公开了通过使用电镀通孔的方波图案的印刷电路板的互连来减少印刷电路板的阻抗的方法和系统。 将第一印刷电路板连接到第二印刷电路板的方法包括形成第一印刷电路板和第二印刷电路板的方波图案，并且邻接第一印刷电路板和第二印刷电路板。 该方法还涉及沿邻接的第一印刷电路板和第二印刷电路板的方波图形，顶部部分和/或底部部分产生电镀通孔。 该方法还包括分别使用第一金属夹和第二金属夹固定顶部部分和底部部分，并通过波峰焊接工艺将第一印刷电路板连接到第二印刷电路板。