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公开(公告)号：US20180063947A1
公开(公告)日：2018-03-01
申请号：US15470309
申请日：2017-03-27
Applicant: Wistron Corporation
Inventor： Tien-Chung TSENG , Chen-Chieh LIEN
CPC classification number: H05K1/0275 , G01L1/20 , H05K1/111 , H05K1/16 , H05K1/181 , H05K5/0047 , H05K5/0208 , H05K5/03 , H05K7/1427 , H05K2201/09236 , H05K2201/09263 , H05K2201/10053
Abstract: A pressure sensing module for sensing a pressure applied to a circuit board is disclosed, The pressure sensing module includes a conductive pad, an elastic cover, a pushing part and a conductive unit. The conductive pad is connected to the circuit board. The elastic cover is connected to the circuit board and located on the conductive pad. The elastic cover includes a top end. The pushing part is connected to the top end. The conductive unit is located above the conductive pad. When the pushing part is not under pressure, the conductive unit does not move to touch the conductive pad. When the pushing part is under pressure, the pushing part causes the conductive unit to move toward the conductive pad such that the conductive unit touches the conductive pad.
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公开(公告)号：US20170330845A1
公开(公告)日：2017-11-16
申请号：US15663396
申请日：2017-07-28
Applicant: STORA ENSO OYJ
Inventor： Juha MAIJALA
IPC: H01L23/66 , H05K1/02 , B65D25/00 , H01L23/498 , H01L23/58 , H01L23/64 , A61J1/03 , H05K3/30 , H01L23/00 , H05K3/00 , H05K1/16 , H05K1/11
CPC classification number: H01L23/66 , A61J1/035 , A61J2200/30 , A61J2205/60 , B65D25/00 , B65D2203/10 , H01L23/4985 , H01L23/564 , H01L23/585 , H01L23/642 , H01L23/645 , H01L2924/0002 , H05K1/0216 , H05K1/0239 , H05K1/0275 , H05K1/028 , H05K1/0292 , H05K1/111 , H05K1/165 , H05K3/0052 , H05K3/301 , H05K3/303 , H05K3/305 , H05K2201/053 , H05K2201/056 , H05K2201/09045 , H05K2201/0909 , H05K2201/09127 , H05K2201/09254 , H05K2201/09263 , H05K2201/09954 , H05K2201/0999 , H05K2201/2036 , H05K2203/0195 , H05K2203/0228 , H01L2924/00
Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
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公开(公告)号：US09816691B2
公开(公告)日：2017-11-14
申请号：US15228924
申请日：2016-08-04
Applicant: LedEngin, Inc.
Inventor： Xiantao Yan
IPC: H01L25/075 , H01L33/64 , H05K1/02 , H05K1/03 , H05K1/14 , H05K1/18 , H05K3/00 , F21V19/00 , H01L33/08 , H01L33/48 , F21K9/90 , F21V5/00 , F21V5/04 , F21V23/00 , F21V29/70 , F21V9/16 , F21V21/14 , H01L33/58 , H05K3/46 , F21Y101/00 , F21Y105/10 , F21Y115/10
CPC classification number: F21V19/003 , F21K9/90 , F21V5/007 , F21V5/04 , F21V9/30 , F21V21/14 , F21V23/005 , F21V29/70 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/48 , H01L33/58 , H01L33/647 , H01L2924/0002 , H05K1/0204 , H05K1/0278 , H05K1/0283 , H05K1/0306 , H05K1/144 , H05K1/189 , H05K3/0061 , H05K3/0097 , H05K3/4626 , H05K3/4688 , H05K2201/042 , H05K2201/0909 , H05K2201/09127 , H05K2201/09263 , H05K2201/10106 , H05K2201/10121 , H05K2203/0143 , H05K2203/171 , H01L2924/00
Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.
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公开(公告)号：US09795031B2
公开(公告)日：2017-10-17
申请号：US14763074
申请日：2014-12-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Song Song , Kazuyoshi Nagayama
CPC classification number: H05K1/0393 , G02F1/13452 , H05K1/0248 , H05K1/0296 , H05K1/09 , H05K1/115 , H05K3/06 , H05K2201/0391 , H05K2201/09227 , H05K2201/09245 , H05K2201/09263 , H05K2201/09272 , H05K2201/10128 , H05K2201/10136
Abstract: The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.
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公开(公告)号：US09788581B2
公开(公告)日：2017-10-17
申请号：US14865440
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Aleksandar Aleksov , Adel Elsherbini , Sasha Oster , Braxton Lathrop , Nadine L. Dabby , Feras Eid
CPC classification number: A41D1/002 , G06F1/163 , H05K1/0283 , H05K1/0296 , H05K1/038 , H05K2201/0133 , H05K2201/09263 , H05K2201/10098 , H05K2201/10151
Abstract: Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.
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Patent Agency Ranking
公开(公告)号：US20170288349A1
公开(公告)日：2017-10-05
申请号：US15433399
申请日：2017-02-15
Applicant: CommScope Technologies LLC
Inventor： Bernard Harold Hammond, JR. , David Patrick Murray , Ian Robert George
IPC: H01R13/719
CPC classification number: H01R13/6466 , H01R4/2416 , H01R13/6658 , H01R13/719 , H01R24/64 , H01R2107/00 , H05K1/0228 , H05K1/162 , H05K3/4644 , H05K2201/09236 , H05K2201/09245 , H05K2201/09263 , H05K2201/10189 , Y10S439/941 , Y10T29/49117 , Y10T29/49204 , Y10T29/49222
Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.
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公开(公告)号：US09773743B2
公开(公告)日：2017-09-26
申请号：US14430173
申请日：2013-09-23
Applicant: STORA ENSO OYJ
Inventor： Juha Maijala
IPC: H01L23/66 , A61J1/03 , B65D25/00 , H05K3/30 , H01L23/498 , H01L23/00 , H01L23/58 , H01L23/64 , H05K1/02 , H05K1/11 , H05K1/16 , H05K3/00
CPC classification number: H01L23/66 , A61J1/035 , A61J2200/30 , A61J2205/60 , B65D25/00 , B65D2203/10 , H01L23/4985 , H01L23/564 , H01L23/585 , H01L23/642 , H01L23/645 , H01L2924/0002 , H05K1/0216 , H05K1/0239 , H05K1/0275 , H05K1/028 , H05K1/0292 , H05K1/111 , H05K1/165 , H05K3/0052 , H05K3/301 , H05K3/303 , H05K3/305 , H05K2201/053 , H05K2201/056 , H05K2201/09045 , H05K2201/0909 , H05K2201/09127 , H05K2201/09254 , H05K2201/09263 , H05K2201/09954 , H05K2201/0999 , H05K2201/2036 , H05K2203/0195 , H05K2203/0228 , H01L2924/00
Abstract: A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
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公开(公告)号：US20170271952A1
公开(公告)日：2017-09-21
申请号：US15459919
申请日：2017-03-15
Applicant: Andreas Stihl AG & Co. KG
Inventor： Kay-Steffen Gurr , Gernot Liebhard , Lothar Lehmann , Rudolf Saemann
CPC classification number: H02K9/02 , H02K11/30 , H02P3/12 , H05K1/167 , H05K2201/09263 , H05K2201/09972
Abstract: An electronic control unit is configured to operate an electric motor from a rechargeable battery pack. The control unit has a circuit board with electronic components for driving the electric motor. Furthermore, an electrical braking circuit having a braking resistor and also a braking switch is provided. The receiving surface of the circuit board is spatially divided into a first surface region and a second surface region. The first surface region serves to receive electronic components; the second surface region serves to receive the braking resistor, wherein the braking resistor is configured as a conductor track which is formed on the circuit board.
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公开(公告)号：US09730315B1
公开(公告)日：2017-08-08
申请号：US15250446
申请日：2016-08-29
Applicant: Square, Inc.
Inventor： Mani Razaghi
CPC classification number: H05K1/0275 , G06F21/70 , G06F21/86 , H01H2239/002 , H01H2239/032 , H01L23/57 , H01L23/576 , H01L2223/6677 , H05K1/147 , H05K1/167 , H05K5/0208 , H05K2201/09263 , H05K2201/0999 , H05K2203/107
Abstract: A circuit board is protected by being enclosed in a security housing that includes conductive tamper traces running along its interior surface, the conductive tamper traces being a housing portion of a tamper detection circuit. The tamper detection circuit also includes a board portion that detect tampering with the tamper detection circuit by monitoring voltages at monitor nodes along the board portion. The board portion of the tamper detection circuit is connected to the tamper traces via multiple connector pieces. The connector pieces can be held in place by board connector piece holders affixed to the board or housing connector piece holders of the housing. When tampering is detected, it can be localized based on voltages measured at multiple recesses along the housing. The tamper detection circuit can be arranged in a wheatstone bridge layout for environmental tolerance. The circuit board's functions/components can be disabled if tampering is detected.
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公开(公告)号：US20170200678A1
公开(公告)日：2017-07-13
申请号：US15319565
申请日：2016-02-16
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L23/538 , H01L25/065 , H01L23/00
CPC classification number: H01L23/5387 , G09F9/301 , H01L23/5386 , H01L23/562 , H01L25/0655 , H01L27/12 , H05K1/028 , H05K2201/09263 , H05K2201/10287
Abstract: The present invention provides a flexible substrate for packaging and a package. The flexible substrate for packaging includes a bendable region provided in a central region of the flexible substrate; chips provided at both sides of the bendable region and at both ends of the flexible substrate, respectively; and a wire provided to be connected between the chips and to pass through the bendable region. A portion of the wire corresponding to the bendable region is provided with an anti-stress structure, and the anti-stress structure is configured to release a tensile resistance and a compressive resistance when the bendable region is bent.
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