公开(公告)号：US5031073A

公开(公告)日：1991-07-09

申请号：US518389

申请日：1990-05-02

Applicant: Cheng-Cheng Chang

Inventor： Cheng-Cheng Chang

IPC: H01R12/04 ,  G01R31/28 ,  H05K1/11 ,  H05K1/14 ,  H05K3/22

CPC classification number: H05K3/222 ,  G01R31/2818 ,  H05K1/029 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/10363 ,  H05K2201/10689 ,  Y10T29/4913

Abstract: A method and apparatus for electrically connecting circuitry on a printed circuit board having a plurality of circuit regions, with each circuit region having components operatively associated with input and output signal lines that are electrically isolated from the signal lines of adjacent circuit regions. The input and output signal lines of a particular circuit region are arranged in a closely spaced pattern aligned with a corresponding pattern of traces on an adjacent circuit region. A plurality of connector members are selectively attached to the printed circuit board to provide signal communication among the regions. Each connector member has closely spaced conductive bars which are exposed to contact the signal lines. The conductive bars have a length and a pitch such that the bars place parallel trace patterns in electrical communication when pressed in place. The connector members are multi-layered members having the conductive bars attached to a dielectric substrate and having an elastomeric material captured between a dielectric substrate and a metallic cap.

Abstract translation: 一种用于在具有多个电路区域的印刷电路板上电连接电路的方法和装置，其中每个电路区域具有与与相邻电路区域的信号线电绝缘的输入和输出信号线可操作地相关联的部件。 特定电路区域的输入和输出信号线布置成与相邻电路区域上的相应迹线图案对准的紧密间隔的图案。 多个连接器构件选择性地附接到印刷电路板以提供区域之间的信号通信。 每个连接器构件具有紧密间隔的导电条，其暴露以接触信号线。 导电棒具有长度和间距，使得当按压就位时，条将电子通路中的平行轨迹图形放置。 连接器构件是多层构件，其具有连接到电介质基底的导电棒，并且具有捕获在电介质基底和金属帽之间的弹性体材料。

公开(公告)号：US4969827A

公开(公告)日：1990-11-13

申请号：US364957

申请日：1989-06-12

Applicant: Charles A. Hahs, Jr.

Inventor： Charles A. Hahs, Jr.

IPC: G09B23/18 ,  H01R13/03 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/326 ,  G09B23/185 ,  H01R12/714 ,  H01R13/035 ,  H05K1/119 ,  H05K1/142 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/14 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/1059 ,  H05K2201/209 ,  H05K3/36

Abstract: A modular building block for electronic circuitry is provided with areas for mounting circuitry thereon. Posts of a particular geometric shape and receptacles of a complementary geometric shape are provided on the substrate. The posts and receptacles are coated with an electrically conductive material and connected to nodes within the circuit such that when blocks are interconnected, post within receptacle, the interconnection provides both physical and electrical connection. An alternate embodiment is disclosed having fingers and edge cards, configured such that the fingers of one block grasp the edge cards of another block, providing physical and electrical connection between the blocks.

Abstract translation: 用于电子电路的模块构建块具有用于在其上安装电路的区域。 特定几何形状的柱和互补几何形状的插座设置在基板上。 柱和容器被涂覆有导电材料并连接到电路内的节点，使得当块互连时，将其固定在插座内，互连提供物理和电连接。 公开了具有手指和边缘卡的替代实施例，其被配置为使得一个块的指状物抓住另一个块的边缘卡，从而在块之间提供物理和电连接。

公开(公告)号：US20170027059A1

公开(公告)日：2017-01-26

申请号：US15282924

申请日：2016-09-30

Applicant: Michael Edward Figaro ,  Scott Edward Bacom ,  Jay Gregory Sherritt

Inventor： Michael Edward Figaro ,  Scott Edward Bacom ,  Jay Gregory Sherritt

IPC: H05K3/00 ,  G06F17/50

CPC classification number: H05K3/0005 ,  G06F17/5072 ,  H05K2201/09963

Abstract: A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the first and second pads. The third pad is devoid of electrical connection to either the first or the second pads. The component is recognizable by both a Computer Aided Design program and an automated component assembly machine.

Abstract translation: 描述了一种无源电气部件，其包括基板，至少第一，第二和第三导电焊盘，每个基板设置在基板上，并且至少第一电气装置固定地附接到第一焊盘和第二焊盘。 第一电气设备电连接到第一和第二焊盘。 第三垫没有与第一或第二垫的电连接。 该组件可由计算机辅助设计程序和自动化组件装配机器识别。

公开(公告)号：US09341328B2

公开(公告)日：2016-05-17

申请号：US14107759

申请日：2013-12-16

Applicant: OSRAM Gesellschaft mit beschräenkter Haftung

Inventor： Harald Stoyan

IPC: H01L29/18 ,  H01L21/02 ,  F21S2/00 ,  H05K1/14 ,  F21V23/06 ,  F21K99/00 ,  F21Y101/02 ,  H05K3/34 ,  H05K3/36

CPC classification number: F21S2/005 ,  F21K9/20 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/141 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3442 ,  H05K3/363 ,  H05K2201/046 ,  H05K2201/09963 ,  H05K2201/10106 ,  Y10T29/41

Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules are provided, which in each case comprise at least one radiation emitting semiconductor component on a carrier body. At least one separately fabricated connection carrier is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.

Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块，其在每种情况下都包括载体主体上的至少一个辐射发射半导体部件。 提供至少一个单独制造的连接载体。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。

公开(公告)号：US20150248846A1

公开(公告)日：2015-09-03

申请号：US14698005

申请日：2015-04-28

Applicant: Min Soo KANG ,  Mi Hee PARK

Inventor： Min Soo KANG ,  Mi Hee PARK

IPC: G09B23/18

CPC classification number: G09B23/185 ,  G09B23/18 ,  G09B23/183 ,  G09B25/02 ,  H05K1/0286 ,  H05K1/142 ,  H05K2201/049 ,  H05K2201/09963

Abstract: According to a construction kit for module type circuit elements disclosed in the present invention, individual circuit elements for forming an electronic circuit are formed in the shape of a module, a circuit diagram and the actual elements of the circuit elements can be intuitionally identified through an upper surface and a lower surface of a circuit element block module having the shape of module, user convenience is improved by coupling the circuit element block module with a lead line connection block module without using a soldering process or a wire connection process, a connection error and a malfunction of a port occurring in existing SMD or dip type circuit elements are prevented, and the learning of the electronic circuit elements can be improved by enhancing an intuitive learning approach of a learner.

Abstract translation: 根据本发明公开的用于模块型电路元件的构造套件，用于形成电子电路的各个电路元件形成为模块形状，电路图，并且可以通过以下方式直观地识别电路元件的实际元件： 具有模块形状的电路元件块模块的上表面和下表面，通过将电路元件块模块与引线连接块模块耦合而不使用焊接过程或电线连接过程来改善用户便利性，连接错误 并且防止在现有的SMD或浸式电路元件中发生的端口的故障，并且通过增强学习者的直觉学习方法可以提高电子电路元件的学习。

公开(公告)号：US20120297618A1

公开(公告)日：2012-11-29

申请号：US13571252

申请日：2012-08-09

Applicant: JengPing Lu ,  Eugene M. Chow

Inventor： JengPing Lu ,  Eugene M. Chow

IPC: H05K3/00

CPC classification number: H05K1/142 ,  H05K1/0286 ,  H05K1/14 ,  H05K3/368 ,  H05K2201/09963 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A method of forming an interconnect substrate includes providing at least two unit cells, arranging the unit cells to form a desired circuit pattern, and joining the unit cells to form the interconnect substrate having the desired circuit pattern.

Abstract translation: 形成互连衬底的方法包括提供至少两个单元电池，布置单元电池以形成期望的电路图案，以及连接单元电池以形成具有所需电路图案的互连衬底。

公开(公告)号：US20100304580A1

公开(公告)日：2010-12-02

申请号：US12454908

申请日：2009-05-26

Applicant: Thomas Baycura

Inventor： Thomas Baycura

IPC: H01R12/00 ,  H05K3/34

CPC classification number: H05K1/0286 ,  H05K1/141 ,  H05K1/142 ,  H05K1/147 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/049 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09963 ,  H05K2201/10689 ,  H05K2203/0195 ,  H05K2203/167 ,  Y10T29/49144

Abstract: An apparatus and method of providing an electrical component interface is disclosed. For one embodiment, the electrical component interface includes an electrical component adapter. The electrical component adapter includes an electronic component solder pattern for receiving and allowing attachment of an electrical component. An adhesive backing is adjacent a surface of the electrical component adapter. The adhesive backing provides attachment of the electrical component adapter to a second surface.

Abstract translation: 公开了一种提供电气部件接口的装​​置和方法。 对于一个实施例，电气部件接口包括电气部件适配器。 电气部件适配器包括用于接收和允许电气部件的附接的电子部件焊接图案。 粘合剂背衬邻近电气部件适配器的表面。 粘合背衬提供电气部件适配器附接到第二表面。

公开(公告)号：US20100142198A1

公开(公告)日：2010-06-10

申请号：US12331383

申请日：2008-12-09

Applicant: Chih-Wen Yang

Inventor： Chih-Wen Yang

IPC: F21V21/00 ,  F21K7/00

CPC classification number: F21S2/005 ,  F21V21/08 ,  F21V21/088 ,  F21V21/35 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/0286 ,  H05K1/142 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/10325

Abstract: A configurable light emitting system includes a plurality of light emitting units, at least a first external conductor, and at least a second external conductor. Each of the light emitting units includes an anode, a cathode, a first electrical contact electrically connected to the anode, and a second electrical contact electrically connected to the cathode. The first external conductor is electrically connected to the first electrical contact of each of the light emitting unit, and configured to supply a positive voltage thereto. The second external conductor is electrically connected to the second electrical contact of each of the light emitting unit, and configured to supply a negative voltage thereto. The plurality of the light emitting units are configured as a tile structure or a brick structure, and are electrically connected together through the first external conductor and second external conductor.

Abstract translation: 可配置的发光系统包括多个发光单元，至少第一外部导体和至少第二外部导体。 每个发光单元包括阳极，阴极，电连接到阳极的第一电触点和电连接到阴极的第二电触点。 第一外部导体电连接到每个发光单元的第一电触点，并且被配置为向其提供正电压。 第二外部导体电连接到每个发光单元的第二电触点，并且被配置为向其提供负电压。 多个发光单元被构造为瓦片结构或砖结构，并且通过第一外部导体和第二外部导体电连接在一起。

公开(公告)号：US20080068816A1

公开(公告)日：2008-03-20

申请号：US11788369

申请日：2007-04-18

Applicant: In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

Inventor： In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

IPC: H05K7/00 ,  H01R11/30

CPC classification number: H01R11/30 ,  H01R13/6205 ,  H05K1/0286 ,  H05K1/09 ,  H05K1/141 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/09963 ,  H05K2201/10325

Abstract: Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

Abstract translation: 印刷电路板和面包板装置具有接触焊盘和磁性部件连接器，其中接触焊盘和磁性部件连接器之间的连接由磁力制成。 接触焊盘或磁性部件连接器都将是磁性的，另一个将由将被吸收的磁体的材料制成。 例如，通常具有铜迹线的印刷电路板包括由吸收磁体的材料制成的接触垫。 电路部件连接到具有磁性腿的磁性部件连接器，然后将这些部件连接到电路板或面包板装置的接触垫上。 这使得组件与印刷电路板或面包板设备的连接快速简单，并且可以方便地拆卸和更换部件。 磁性部件连接器也可以被配置为彼此磁性地连接。

公开(公告)号：US07281931B2

公开(公告)日：2007-10-16

申请号：US10897465

申请日：2004-07-23

Applicant: Nagao Miyazaki ,  Yoshihiko Suzuki

Inventor： Nagao Miyazaki ,  Yoshihiko Suzuki

IPC: H01R4/58

CPC classification number: H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

Abstract: In a construction for electrically connecting electrical unit with joint surfaces thereof opposed to each other, wiring patterns electrically connected with distortion gauges are formed on function-element forming surfaces of each electrical three-dimensional unit and are extended to edge portions formed between the function-element forming surfaces and adjacent wiring surfaces as the joint surfaces to form first lands; second lands extending from the edge portions by a specified distance are formed at positions of the wiring surfaces corresponding to the first lands; and electrical connectors displaying a joining performance upon being pressed together are formed to bridge the first and second lands while being held in close contact with the first and second lands. A plurality of three-dimensional electrical unit can be securely and easily electrically connected with each other with high precision.

Abstract translation: 在将电气单元与其相对的接合面电连接的结构中，在每个电三维单元的功能元件形成表面上形成与变形量规电连接的布线图案，并延伸到形成在功能元件之间的边缘部分， 元件形成表面和相邻布线表面作为接合表面以形成第一焊盘; 在与第一焊盘对应的布线面的位置处形成从边缘部延伸规定距离的第二焊盘; 并且形成在被压在一起时显示接合性能的电连接器，以在与第一和第二焊盘保持紧密接触的同时桥接第一和第二焊盘。 多个三维电气单元可以以高精度牢固且容易地彼此电连接。