公开(公告)号：US20110044009A1

公开(公告)日：2011-02-24

申请号：US12923968

申请日：2010-10-19

Applicant: Yutaka Fukuda ,  Mitsuhiro Saitou ,  Toshihiro Nagaya ,  Kan Kinouchi ,  Sadahiro Akama ,  Koji Numazaki ,  Norihisa Imaizumi

Inventor： Yutaka Fukuda ,  Mitsuhiro Saitou ,  Toshihiro Nagaya ,  Kan Kinouchi ,  Sadahiro Akama ,  Koji Numazaki ,  Norihisa Imaizumi

IPC: H05K7/20

CPC classification number: H05K1/142 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/2076 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0263 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electric device includes: a first electric element; a second electric element capable of flowing large current therethrough so that heat is generated in the second electric element; a heat sink; and a first wiring board and a second wiring board, which are disposed on one side of the heat sink. The large current in the second electric element is larger than that in the first electric element. The first wiring board and the second wiring board are separated each other. The first electric element is disposed on the first wiring board, and the second electric element is disposed on the second wiring board.

Abstract translation: 电气装置包括：第一电气元件; 第二电气元件，其能够流过大电流，使得在所述第二电气元件中产生热量; 散热器 以及设置在散热器的一侧的第一布线板和第二布线板。 第二电元件中的大电流大于第一电元件中的大电流。 第一布线板和第二布线板彼此分离。 第一电气元件设置在第一布线板上，第二电气元件设置在第二布线板上。

公开(公告)号：US20100236815A1

公开(公告)日：2010-09-23

申请号：US12727146

申请日：2010-03-18

Applicant: Jack Seidler

Inventor： Jack Seidler

IPC: H01B5/00 ,  H05K3/00

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

公开(公告)号：US07757929B2

公开(公告)日：2010-07-20

申请号：US11426298

申请日：2006-06-23

Applicant: Donald A. Ice ,  Darin James Douma

Inventor： Donald A. Ice ,  Darin James Douma

IPC: B23K31/02

CPC classification number: G02B6/4246 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/302

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part, and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。

公开(公告)号：US20100170706A1

公开(公告)日：2010-07-08

申请号：US12452104

申请日：2008-06-06

Applicant: Peter Kimmich ,  Quoc-Dat Nguyen

Inventor： Peter Kimmich ,  Quoc-Dat Nguyen

IPC: H05K1/03 ,  H05K3/36 ,  H05K1/16 ,  H05K1/11

CPC classification number: H05K1/144 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49551 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49213 ,  H01L2924/00

Abstract: An electronic module includes a first substrate having at least one electronic component, and a housing embedded in the substrate and designed as an injection molded housing or a transfer molded housing, and which includes electrical leads protruding from the housing, connected to the first substrate and designed as a pressed screen. At least one further second substrate provided with second electrical is embedded in the housing, the second leads being designed as a second pressed screen, and the two pressed screens being directly connected to each other in at least one location.

Abstract translation: 电子模块包括具有至少一个电子部件的第一基板和嵌入在该基板中并被设计为注射成型外壳或传递模制外壳的壳体，并且包括从壳体突出的电引线，连接到第一基板和 设计为压屏。 设置有第二电气的至少一个另外的第二基板嵌入壳体中，第二引线被设计为第二压制屏幕，并且两个压制屏幕在至少一个位置中彼此直接连接。

公开(公告)号：US20090135572A1

公开(公告)日：2009-05-28

申请号：US12064996

申请日：2006-08-30

Applicant: Sadamichi Takakusaki ,  Noriaki Sakamoto

Inventor： Sadamichi Takakusaki ,  Noriaki Sakamoto

IPC: H05K1/11 ,  H05K13/04

CPC classification number: H01L25/162 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/056 ,  H05K1/142 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/09554 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T29/5313 ,  H01L2924/00 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside.

Abstract translation: 提供一种其中并入其中的电子电路稳定地工作的电路装置。 混合集成电路装置包括设置在大致相同平面上的多个电路板。 在电路板的每个顶表面上形成包括导电图案和电路元件的电子电路。 此外，这些电路板由密封树脂一体地支撑。 此外，连接到形成在电路板表面上的电子电路的引线从密封树脂引出到外部。

公开(公告)号：US20090011548A1

公开(公告)日：2009-01-08

申请号：US12182519

申请日：2008-07-30

Applicant: Junichi Iimura ,  Yasuhiro Koike ,  Soichi Izutani

Inventor： Junichi Iimura ,  Yasuhiro Koike ,  Soichi Izutani

IPC: H01L21/60

CPC classification number: H01L21/481 ,  H01L23/49575 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/056 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10924 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of manufacturing a hybrid integrated circuit device of the present invention includes the steps of preparing a lead frame which constituted by units each having a plurality of leads, and fixing a circuit substrate on each unit of the lead frame by fixing pads which are formed on the surface of the circuit substrate to the leads, where a space between a first pad which is formed at an end edge of the circuit substrate and a second pad which is adjacent to the first pad is set narrower than a space between the pads themselves.

Abstract translation: 制造本发明的混合集成电路器件的方法包括以下步骤：制备由具有多个引线的单元构成的引线框架，以及通过形成的固定焊盘将电路基板固定在引线框架的每个单元上 在电路基板的与引线相关的表面上，形成在电路基板的端部边缘的第一焊盘与第一焊盘相邻的第二焊盘之间的空间被设定为比焊盘本身之间的空间窄 。

公开(公告)号：US20080179722A1

公开(公告)日：2008-07-31

申请号：US11930183

申请日：2007-10-31

Applicant: Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

Inventor： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC: H01L23/495

CPC classification number: H05K1/141 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0262 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10924 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

Abstract translation: 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。

公开(公告)号：US20080119065A1

公开(公告)日：2008-05-22

申请号：US11928782

申请日：2007-10-30

Applicant: Sadamichi TAKAKUSAKI ,  Noriaki SAKAMOTO ,  Katsuyoshi MINO

Inventor： Sadamichi TAKAKUSAKI ,  Noriaki SAKAMOTO ,  Katsuyoshi MINO

IPC: H01R12/00

CPC classification number: H01L23/49531 ,  H01L21/565 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.

Abstract translation: 提供了具有改进的包装密度的电路装置。 本发明的电路装置包括：电路板，其表面被绝缘层覆盖; 形成在绝缘层的表面上的导电图案; 电连接到导电图案的电路元件; 并且连接到由导电图案形成的焊盘的引线。 此外，控制元件固定到由引线的一部分形成的台面部的上表面，并且台肩部的后表面与电路板的上表面间隔开。

公开(公告)号：US20080061410A1

公开(公告)日：2008-03-13

申请号：US11976503

申请日：2007-10-25

Applicant: Norihisa Imaizumi ,  Yuuki Sanada ,  Takeshi Ishikawa

Inventor： Norihisa Imaizumi ,  Yuuki Sanada ,  Takeshi Ishikawa

IPC: H01L23/495

CPC classification number: H01L25/0652 ,  H01L23/49531 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/117 ,  H05K1/144 ,  H05K1/145 ,  H05K3/284 ,  H05K3/3405 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10924 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.

Abstract translation: 电子设备包括：第一基板和第二基板; 布置在所述第一和第二基板之间的引线框架，用于在其间进行电连接; 以及分别设置在第一和第二基板上的第一凹槽和第二凹槽。 第一和第二沟槽对应于第一和第二基板和引线框架之间的连接部分。 引线框架以这样的方式连接到第一和第二基板，使得引线框架的一端通过导电接合材料接合在第一和第二槽中。

公开(公告)号：US07258264B2

公开(公告)日：2007-08-21

申请号：US11066056

申请日：2005-02-25

Applicant: Donald A. Ice ,  Darin James Douma

Inventor： Donald A. Ice ,  Darin James Douma

IPC: B23K31/02 ,  B23K31/00 ,  H01R12/00 ,  H01R27/00 ,  H01R13/405

CPC classification number: G02B6/4246 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/302

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards are disclosed. The lead frame connector includes an electrically insulating case having a first part separated from a second part and a plurality of conductors that are electrically isolated one from another by the electrically insulating case. Each of the plurality of conductors can form an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The electrical contact is aligned with and soldered to the leads that protrude from the back end of an optical sub-assembly. The contact points can then be connected to electrical pads on a PCB.

Abstract translation: 公开了使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括具有与第二部分分离的第一部分的电绝缘壳体和由电绝缘壳体彼此电隔离的多个导体。 多个导体中的每一个可以形成相对于第一部分被限制在固定位置的电触点和从第二部分延伸的接触点。 电触点对准并焊接到从光学子组件的后端突出的引线。 接触点可以连接到PCB上的电焊盘。