公开(公告)号：US10266704B2

公开(公告)日：2019-04-23

申请号：US16158872

申请日：2018-10-12

Applicant: Potters Industries, LLC

Inventor： Suruliappa Jeganathan ,  Chris Davies ,  Kevin Goforth

IPC: E01C19/12 ,  C09D5/33 ,  E01C19/18 ,  E01F9/50 ,  C09D7/62 ,  E01C23/16 ,  E01F9/524 ,  B05C11/11 ,  E01F9/506 ,  B05D7/00 ,  C09D163/00 ,  B05D5/06

Abstract: A method or applying a fast curing epoxy traffic marking composition is provided in which curing agents are coated on a carrier such as glass beads or porous silica. These carriers are dropped onto the epoxy coating and promote rapid curing of the top layer of the epoxy coating while the bottom layer is given additional time to adhere to the roadway surface.

公开(公告)号：US20180236483A1

公开(公告)日：2018-08-23

申请号：US15901167

申请日：2018-02-21

Applicant: Graco Minnesota Inc.

Inventor： Robert J. Lind ,  Matthew R. Smith ,  Nicholas P. Peterson ,  Benjamin R. Godding ,  Mark J. Brudevold ,  Matthew R. Theisen

IPC: B05C11/10 ,  B05C11/11

CPC classification number: B05C11/101 ,  B05C11/1042 ,  B05C11/11 ,  B29B13/022 ,  B29C65/4815 ,  B29C66/87

Abstract: An adaptive hot melt feed system includes a melt system, a feed system, a gas control device, a sensor, and a controller. The melt system includes a heated vessel. The feed system is configured to deliver a solid material to the vessel of the melt system for melting. The gas control device is configured to control a supply of gas provided to the feed system to drive the solid material from the feed system to the melt system. The sensor can be configured to detect an amount of material in the vessel of the melt system. The controller is in electronic communication with the gas control device and is programmed to signal the gas control device to vary the supply of gas to the feed system based on a fill metric determined by the controller.

公开(公告)号：US09810363B2

公开(公告)日：2017-11-07

申请号：US14490362

申请日：2014-09-18

Applicant: Nordson Corporation

Inventor： Charles P. Ganzer ,  Enes Ramosevac ,  Ronald Ramspeck ,  Raymond J. Slattery, III ,  Leslie J. Varga

IPC: F17D3/01 ,  F16L53/00 ,  F16K3/02 ,  F17D3/10 ,  B05C11/10 ,  B05C11/11 ,  B65B69/00

CPC classification number: F16L53/001 ,  B05C11/1031 ,  B05C11/1042 ,  B05C11/1047 ,  B05C11/11 ,  B65B69/0091 ,  F16K3/0281 ,  F16L53/30 ,  F17D3/01 ,  F17D3/10 ,  Y10T137/0318 ,  Y10T137/6416

Abstract: A bulk adhesive transfer system for transferring adhesive particulate to a melter includes a bulk supply and a transfer device, which may define a hopper of the melter, a mobile bin, and/or a buffer unit. The transfer device is configured to receive unmelted adhesive particulate from the bulk supply and then be selectively docked with the melter to transfer the adhesive particulate to the melter. The bulk adhesive transfer system may also include a knife gate valve device, which includes a plurality of ports that sequentially open and close to control flow of the adhesive particulate towards the melter. The bulk adhesive transfer system simplifies refilling operations for a melter while enabling continuous operation of the melter, even when the transfer device is undocked for removal from the melter.

公开(公告)号：US20170312778A1

公开(公告)日：2017-11-02

申请号：US15484990

申请日：2017-04-11

Applicant: NORDSON CORPORATION

Inventor： Enes Ramosevac

IPC: B05C11/10 ,  B65D25/02 ,  B05C11/11 ,  B65D43/16 ,  B05C5/00

CPC classification number: B05C11/101 ,  B05C5/001 ,  B05C11/11 ,  B65D25/02 ,  B65D43/163

Abstract: A hot melt adhesive supply system is disclosed. The hot melt adhesive supply system includes an outer container defining an upper cavity and a lower cavity. The upper cavity includes an inner container having a top opening to receive unmelted hot melt adhesive pieces and a bottom aperture. The system also includes a dispensing mechanism between the upper cavity and the lower cavity. The dispensing mechanism regulates the dispensing of the unmelted hot melt adhesive pieces from the upper cavity to the lower cavity. The dispensing mechanism includes a base plate and one or more rotating members that rotate to move the unmelted hot melt adhesive pieces through a gap defined between the base plate and the bottom aperture. The system also includes a transfer conduit that communicates the unmelted hot melt adhesive pieces from the lower cavity to a hot melt adhesive melter.

公开(公告)号：US20170218579A1

公开(公告)日：2017-08-03

申请号：US15491157

申请日：2017-04-19

Applicant: Graco Minnesota Inc.

Inventor： Barry W. Mattson

IPC: E01C23/24 ,  B05D1/26 ,  B05C5/00 ,  B05C11/10 ,  B05C11/11

CPC classification number: E01C23/246 ,  B05C5/001 ,  B05C11/1031 ,  B05C11/11 ,  B05D1/26 ,  E01C23/16 ,  E01C23/24

Abstract: A screed box includes a screed bucket, a screed plate mount attached to the screed bucket, a screed plate slidably connected to the screed plate mount and a screed bar attached to a bottom of the screed bucket. The screed plate mount includes a sealing edge. The screed plate includes at least one screed flange. The screed bar includes a body and a sealing lip including at least one projection. The screed bar is slidable between an open position where the sealing lip engages the sealing edge and a closed position where the sealing lip is disengaged from the sealing edge, and the at least one projection engages the sealing edge when the screed bar is in the open position and when the screed bar is in a closed position.

公开(公告)号：US20160184859A1

公开(公告)日：2016-06-30

申请号：US14966026

申请日：2015-12-11

Applicant: Tokyo Electron Limited

Inventor： Fumihiro Kamimura ,  Hiromi Hara

IPC: B05C11/10 ,  H01L21/306 ,  B05C11/11 ,  H01L21/67 ,  B05C5/00

Abstract: Provided is a substrate liquid processing apparatus that processes a substrate with a processing liquid. The substrate liquid processing apparatus includes: a processing liquid storage unit configured to store the processing liquid therein; a processing liquid heating unit configured to heat the processing liquid, a controller configured to control the processing liquid heating unit; a temperature sensor; and a concentration sensor connected to the controller. The controller is configured to: measure a concentration of the processing liquid with the concentration sensor, measure a temperature of the processing liquid with the temperature sensor, calculate a boiling point corresponding to the measured concentration of the processing liquid, and control the output of the processing liquid heating unit, based on the boiling point and the measured temperature of the processing liquid.

Abstract translation: 提供了一种用处理液处理基板的基板液体处理装置。 基板液体处理装置包括：处理液体存储单元，被配置为在其中存储处理液体; 处理液加热单元，被配置为加热处理液;控制器，被配置为控制处理液加热单元; 温度传感器; 和连接到控制器的浓度传感器。 控制器被配置为：用浓度传感器测量处理液的浓度，用温度传感器测量处理液的温度，计算对应于所测量的处理液浓度的沸点，并控制 处理液体加热单元，基于处理液的沸点和测量温度。

公开(公告)号：US20160008840A1

公开(公告)日：2016-01-14

申请号：US14795213

申请日：2015-07-09

Applicant: Tokyo Electron Limited

Inventor： Norihiko Sasagawa ,  Hiroichi Inada ,  Masahito Hamada

IPC: B05C11/11 ,  B05C5/00 ,  B05C11/08

CPC classification number: H01L21/6715 ,  B01F3/0853 ,  B01F3/0861 ,  B01F5/0057 ,  B01F5/0071 ,  B01F7/00908 ,  B01F7/00916 ,  B01F15/00883 ,  B01F15/00889 ,  B01F2003/0896 ,  G03F7/3021

Abstract: Disclosed is a chemical liquid discharge mechanism. The mechanism includes: a storage portion including a chemical liquid storage space; a diluent supply port opened to supply a diluent for reducing a viscosity of the chemical liquid to the storage space; a vertex flow forming portion that forms vortex flows in the diluent and the chemical liquid by supplying a fluid to the storage space to stir the diluent and the chemical liquid; and a liquid discharge port opened to an upper side of the diluent supply port in the storage space such that, by the supply of the diluent, the diluent and the chemical liquid flow into the liquid discharge port to be discharged from the storage space. Thus, the viscosity of the waste liquid discharged from the liquid discharge port may be reduced, and thus, it is not necessary to largely set the inclination of the liquid discharge path.

Abstract translation: 公开了一种化学液体排出机构。 该机构包括：存储部，其包括药液存储空间; 打开稀释剂供给口以提供用于将化学液体的粘度降低到储存空间的稀释剂; 顶点流形成部分，通过向存储空间提供流体以搅拌稀释剂和化学液体，在稀释剂和化学液体中形成涡流; 以及液体排出口，其通过所述储存空间中的所述稀释剂供给口的上侧开口，使得通过所述稀释剂的供给，所述稀释剂和所述化学液体流入所述液体排出口以从所述存储空间排出。 因此，可以减少从液体排出口排出的废液的粘度，因此不需要大量设定液体排出路径的倾斜度。

公开(公告)号：US20150093906A1

公开(公告)日：2015-04-02

申请号：US14490939

申请日：2014-09-19

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Nobuo KOBAYASHI ,  Koichi HAMADA ,  Yoshiaki KUROKAWA ,  Masaaki FURUYA ,  Hideki MORI ,  Yasushi WATANABE ,  Yoshinori HAYASHI

IPC: H01L21/311 ,  B05C3/02 ,  B05C11/11 ,  B05C5/02 ,  B05C11/08 ,  B05C11/10

CPC classification number: H01L21/31111 ,  H01L21/67017 ,  H01L21/6708

Abstract: A substrate treatment apparatus which can more efficiently regenerate phosphoric acid which is able to be returned to etching treatment along with such etching treatment as much as possible without using a large facility, that is a substrate treatment apparatus which treats a silicon substrate W on which a nitride film is formed by a liquid etchant which contains phosphoric acid, which comprises an etching treatment unit (the spin treatment unit 30) which gives a suitable quantity of liquid, etchant to each substrate which is fed one at a time so as to etch the substrate and remove the nitride film, a phosphoric acid regenerating unit (the spin treatment unit 30) which mixes liquid etchant used for treatment of one substrate and a suitable quantity of liquid hydrofluoric acid for the amount of the used liquid etchant under a predetermined temperature environment to regenerate the phosphoric acid, and a phosphoric acid recovery unit (the pump 38, phosphoric acid recovery tank 50, and pump 52) which returns the phosphoric acid which was obtained by the phosphoric acid regenerating unit to the liquid etchant to be used at the etching treatment unit.

Abstract translation: 一种能够更有效地再生磷酸的基板处理装置，其可以在不使用大的设备的情况下尽可能多地进行蚀刻处理而返回到蚀刻处理，也就是基板处理装置，其处理硅基板W， 氮化物膜由含有磷酸的液体蚀刻剂形成，该液体蚀刻剂包括蚀刻处理单元（旋转处理单元30），该蚀刻处理单元（旋转处理单元30）向每个衬底提供适当量的液体，蚀刻剂，每个衬底一次一个地蚀刻， 基板并去除氮化物膜，将磷酸再生单元（旋转处理单元30）在预定温度环境下将用于处理一个基板的液体蚀刻剂和适量的液体氢氟酸混合使用液体蚀刻剂的量 再生磷酸，磷酸回收装置（泵38，磷酸回收槽50，pu mp 52），其将由磷酸再生单元获得的磷酸返回到在蚀刻处理单元处使用的液体蚀刻剂。

公开(公告)号：US08826852B2

公开(公告)日：2014-09-09

申请号：US12758678

申请日：2010-04-12

Applicant: Christopher Malone ,  Kissak Sarajian ,  Todd Schuh

Inventor： Christopher Malone ,  Kissak Sarajian ,  Todd Schuh

IPC: B05C11/11 ,  B65D43/04 ,  B05B15/04 ,  B05C21/00

CPC classification number: B05C21/005 ,  B05B12/26 ,  Y10S220/19

Abstract: The present invention is an optimized DWP for minimizing coating error that has two centering components which center the DWP inside a threaded or non-threaded opening effectively masking the threads and/or opening during the coating process.

Abstract translation: 本发明是用于最小化涂层误差的优化的DWP，其具有将DWP中心在螺纹或非螺纹开口内的两个定心部件，其有效地遮蔽了涂层过程中的螺纹和/或打开。

公开(公告)号：US08691016B2

公开(公告)日：2014-04-08

申请号：US13522007

申请日：2010-10-29

Applicant: Tohru Sonoda ,  Nobuhiro Hayashi ,  Shinichi Kawato

Inventor： Tohru Sonoda ,  Nobuhiro Hayashi ,  Shinichi Kawato

IPC: B05C11/11 ,  C23C16/00 ,  H01L21/00 ,  H01L21/31 ,  H01L21/469

CPC classification number: H01L51/001 ,  C23C14/042 ,  C23C14/12 ,  H01L27/3211 ,  H01L51/0011 ,  H01L51/56

Abstract: A deposition mask 601 is used to form a thin film 3 in a prescribed pattern on a substrate 10 by deposition. Each of a plurality of improved openings 62A of the deposition mask 601 has a protruding opening portion 64, and is formed so that the opening amount at an end in a lateral direction is larger than that in a central portion in the lateral direction. In a deposition apparatus 50, the deposition mask 601 is held in a fixed relative positional relation with a deposition source 53 by a mask unit 55. In the case of forming the thin film 3 in a stripe pattern on the substrate 10 by the deposition apparatus 50, deposition particles are sequentially deposited on the substrate 10 while relatively moving the substrate 10 along a scanning direction with a gap H being provided between the substrate 10 and the deposition mask 601.

Abstract translation: 沉积掩模601用于通过沉积在衬底10上以规定的图案形成薄膜3。 沉积掩模601的多个改进开口62A中的每一个具有突出的开口部分64，并且形成为使得横向端部的开口量大于在横向方向上的中心部分的开口量。 在沉积装置50中，沉积掩模601通过掩模单元55与沉积源53保持固定的相对位置关系。在通过沉积装置在基板10上形成条纹图案的薄膜3的情况下 如图50所示，在衬底10和衬底10之间设置有间隙H的同时使衬底10沿着扫描方向相对移动的同时，沉积粒子依次沉积在衬底10上。