公开(公告)号：US4312116A

公开(公告)日：1982-01-26

申请号：US140266

申请日：1980-04-14

Applicant: Floyd R. Moser ,  Richard W. Noth

Inventor： Floyd R. Moser ,  Richard W. Noth

IPC: H01L23/28 ,  H01L21/50 ,  H01L23/055 ,  H01L1/10

CPC classification number: H01L21/50 ,  H01L23/055 ,  H01L2924/0002 ,  Y10T29/49124

Abstract: A method of packaging an electronic module in a cap is disclosed. The module, comprising one or more silicon chips mounted on a substrate and having the chips sealed onto the substrate with a silicone polymer is supported on a cap with the chips disposed inwardly. An epoxy is dispensed on the back surface of the substrate and allowed to flow and bridge over the gap between the substrate and cap. The epoxy is cured by first heating the assembly with the applied epoxy to a temperature which will gel the epoxy. The temperature and rate of heating are selected so that the temperature is stabilized before the critical viscosity of the epoxy is reached. Subsequently, a higher temperature is used to complete the cure. The process is also characterized in that no significant decrease in temperature is permitted after the dispensing and flowing of the epoxy.

Abstract translation: 公开了一种将电子模块封装在盖中的方法。 该模块包括安装在基板上的一个或多个硅芯片，并且具有用硅氧烷聚合物密封在基板上的芯片被支撑在具有向内设置的芯片的盖上。 环氧树脂被分配在衬底的背面上并允许流动并桥接在衬底和盖子之间的间隙上。 环氧树脂通过首先用所施加的环氧树脂加热到使环氧树脂凝胶化的温度来固化。 选择温度和加热速率，使得在达到环氧树脂的临界粘度之前使温度稳定。 随后，使用较高的温度来完成固化。 该方法的特征还在于在环氧树脂的分配和流动之后不允许温度显着降低。

公开(公告)号：US4139852A

公开(公告)日：1979-02-13

申请号：US825349

申请日：1977-08-17

Applicant: Joji Koyanagi

Inventor： Joji Koyanagi

IPC: H01Q1/08 ,  H01Q9/14 ,  H01L1/10

CPC classification number: H01Q1/084 ,  H01Q9/14

Abstract: In a whip-type antenna which can be used for either mobile or fixed station, the improvement is characterized in that the antenna has at least a portion of an antenna element thereof wound in turns so as to impart the inductance to the antenna element and a power-operated motor is capable of varying the turns and pitches of the above wound antenna element for varying the inductance, which leads to the variation of tuning frequency of the antenna.

Abstract translation: 在可用于移动或固定站的鞭状天线中，改进的特征在于天线具有其天线元件的至少一部分轮流缠绕，以便将电感赋予天线元件，并且 动力电动机能够改变上述缠绕天线元件的匝数和间距，以改变电感，这导致天线的调谐频率的变化。

公开(公告)号：US3902189A

公开(公告)日：1975-08-26

申请号：US45945474

申请日：1974-04-10

Applicant: HUNT ELECTRONICS

Inventor： SIMPSON FRANK M

IPC: H01L23/495 ,  B01J17/00 ,  H01L1/10

CPC classification number: H01L23/49503 ,  H01L23/49562 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2924/13034 ,  Y10T29/49121 ,  H01L2924/00014

Abstract: A prefabricated article, for example, a lead frame, is designed to accommodate parts, for example, semiconductor electronic devices and connecting wires therefor, which are bonded to the lead frame with a fusible material, for example, a metal alloy solder. The semiconductor device may be placed on a portion of a planar surface of the lead frame with a solder layer interposed therebetween. The planar surface of the lead frame is formed either with a single continuous groove or moat or a plurality of spaced grooves, forming a boundary around the die-receiving portion of the surface. The walls of the groove contiguous with the die-receiving surface intersect the surface at an angle sufficient to prevent the solder in a molten state from flowing across the boundary by the mechanism of the surface tension of the solder. This prevents the die from becoming disoriented during the bonding operation. Additionally, a pair of spaced terminals or legs of the lead frame are formed with angular projections on predetermined sections thereof which are adapted to receive and support the connecting wires when the wires are formed with similarly angled bends to facilitate the connection of contact pads of the semiconductor device on the supporting surface to the lead frame terminals are legs while maintaining the proper orientation of the wires with respect to the device.

公开(公告)号：US3686748A

公开(公告)日：1972-08-29

申请号：US3686748D

申请日：1970-04-13

Applicant: WILLIAM E ENGELER ,  DALE M BROWN

Inventor： ENGELER WILLIAM E ,  BROWN DALE M

IPC: H01L21/00 ,  H01L21/60 ,  H01L21/764 ,  H01L23/36 ,  H01L23/373 ,  H01L23/538 ,  B01J17/00 ,  H01L1/10

CPC classification number: H01L23/36 ,  H01L21/00 ,  H01L21/764 ,  H01L23/3736 ,  H01L23/538 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/6835 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/01014 ,  H01L2924/00

Abstract: A method and apparatus for providing electrical isolation between integrated circuits and a common high thermal conduction path to a heat sink are described. The method comprises providing an insulating film over the surface of a semiconductor wafer containing integrated circuits, forming a layer of high thermal conductivity material over the insulating film, selectively removing portions of the high thermal conductivity layer and the insulating film in regions between individual integrated circuits, selectively removing the semiconductor material from between integrated circuit elements and providing a low thermal resistance path between the high thermal conductivity layer and a suitable heat sink.

Abstract translation: 描述了一种用于在集成电路之间提供电绝缘的方法和装置以及到散热器的公共高导热路径。 该方法包括在包含集成电路的半导体晶片的表面上提供绝缘膜，在绝缘膜上形成高导热材料层，在各个集成电路之间的区域中选择性地去除高导热层和绝缘膜的部分 从集成电路元件之间选择性地去除半导体材料，并在高导热层和合适的散热器之间提供低热阻路径。

公开(公告)号：US3683492A

公开(公告)日：1972-08-15

申请号：US3683492D

申请日：1970-02-06

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： MEYERHOFF ALFRED ,  BLAKE WALTER E

IPC: H01L21/60 ,  H01L23/16 ,  B01J17/00 ,  H01L1/10

CPC classification number: H01L23/16 ,  H01L24/90 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1301 ,  Y10T29/49918 ,  Y10T29/5327 ,  Y10T29/53274 ,  H01L2924/00

Abstract: Protrusions formed in a case member of a compression bonded encapsulated electrical device act on a resilient member and accurately maintain the compression force acting on the electrical contacts and the semiconductor element of the device.

Abstract translation: 形成在压接结合的密封电气装置的壳体构件中的突起作用在弹性构件上并且精确地保持作用在装置的电触点和半导体元件上的压缩力。

公开(公告)号：US3619731A

公开(公告)日：1971-11-09

申请号：US3619731D

申请日：1968-10-11

Applicant: RCA CORP

Inventor： BAKER LAWRENCE K ,  SHARDLOW LAWRENCE R

IPC: H01L21/52 ,  H01L25/03 ,  H01L25/07 ,  H01L1/08 ,  H01L1/10 ,  H01L1/14 ,  H01L1/22

CPC classification number: H01L25/074 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device comprises a substrate, a first semiconductor pellet mounted on the substrate, an insulating material washer mounted on the first pellet, and a second semiconductor pellet mounted on the washer. The second pellet is rigidly secured to the washer and the first pellet, and electrically connected to the first pellet, by means of a solder filling the washer central opening and bonded to both pellets.

公开(公告)号：US3618203A

公开(公告)日：1971-11-09

申请号：US3618203D

申请日：1969-08-25

Applicant: OLIN MATHIESON

Inventor： PRYOR MICHAEL J

IPC: C03C27/02 ,  C04B37/02 ,  H01L23/045 ,  C21D1/26 ,  H01L1/10

CPC classification number: H01L23/045 ,  C03C27/02 ,  H01L24/01 ,  H01L2924/09701 ,  H01L2924/351 ,  Y10S228/903 ,  Y10T29/49171 ,  Y10T29/49218 ,  H01L2924/00

Abstract: A COMPOSITE METAL PRODUCT, GLASS OR CERAMIC-TO-METAL SEALS USING THE COMPOSITE, AND THE METHOD OF MAKING THESE PRODUCTS. THE COMPOSITE HAS THE PROPERTIES OF A LOW COEFFICIENT OF EXPANSION, APPROXIMATING THAT OF THE GLASS OR CERAMIC, GOOD THERMAL CONDUCTIVITY, AND FINE GRAIN SIZE IN THE ANNEALED CONDITION. THIS IS ACHIEVED BY CLADDING AN ALLOY HAVING A LOW COEFFICIENT OF EXPANSION ON EITHER SIDE OF A LOW CARBON STEEL CORE HAVING A THERMAL CONDUCTIVITY OF AT LEAST 20 B.T.U./SQ. FT./FT./HR./*F. THE THICNESS OF THE CLADDING ON EITHER SIDE OF THE CORE NOT EXCEEDING 33 1/3% OF THE TOTAL THICKNESS OF THE COMPOSITE. THE LOW CARBON STEEL CORE CONTAINS UP TO 0.20% CARBON AND PREFERABLY UP TO 0.15% CARBON AND HAS A GRAIN SIZE OF NO MORE THAN 0.045 MM. AFTER ANNEALING OF THE COMPOSITE. THE COMPOSITE IS COLD ROLLED AT LEAST 70% AND PREFERABLY AT LEAST 80%, IT IS THEN ANNEALED BETWEEN ABOUT 1330*F. AND 1600*F. AND PREFERABLY BETWEEN ABOUT 1500F. AND 1600*F., FOR NO LONGER THAN 30 MINUTES AND THEN RAPIDLY COOLED TO ROOM TEMPERATURE. THE HEAT-UP RATE MUST BE FASTER THAN 100*F. PER MINUTE AND PREFERABLY FASTER THAN 250*F. PER MINUTE. THE SEAL IS MADE BY FORMING A CUP SHAPED HEADER HAVING APERTURES, OUT OF THE COMPOSITE. ELECTRICAL CONDUCTORS ARE THN INSERTED THROUGH THE APERTURES AND THE CUP IS THEN FILLED WITH GLASS OR CERAMIC TO SEAL THE CONDUCTORS IN PLACE.

公开(公告)号：US3539875A

公开(公告)日：1970-11-10

申请号：US3539875D

申请日：1968-09-25

Applicant: PHILIPS CORP

Inventor： FONG VICTOR ,  HARRINGTON BRADFORD K

IPC: H01L23/40 ,  H01L1/22 ,  H01L1/10 ,  H01L1/12

CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4087 ,  H01L2224/48091 ,  H01L2924/00014

公开(公告)号：US3514849A

公开(公告)日：1970-06-02

申请号：US79852368

申请日：1968-11-15

Applicant: TEXAS INSTRUMENTS INC

Inventor： LANDRON RAFAEL JR

IPC: C03C27/02 ,  C23F1/16 ,  C23F1/18 ,  H01J9/32 ,  H01L21/50 ,  H01L23/047 ,  H01L23/495 ,  H01L23/498 ,  H01L1/10

CPC classification number: H01J9/32 ,  C03C27/02 ,  C23F1/16 ,  C23F1/18 ,  H01L21/50 ,  H01L23/047 ,  H01L23/49551 ,  H01L23/49579 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  Y10S228/903 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/4981 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

公开(公告)号：US3476620A

公开(公告)日：1969-11-04

申请号：US3476620D

申请日：1968-10-10

Applicant: TRW SEMICONDUCTORS INC

Inventor： CRISHAL JOAN M ,  SANDSTROM JAMES P

IPC: C23C16/40 ,  C30B31/06 ,  H01L21/225 ,  H01L21/316 ,  H01L23/485 ,  H01L7/34 ,  H01L1/10

CPC classification number: H01L21/31625 ,  C23C16/401 ,  C30B29/06 ,  C30B31/06 ,  H01L21/02129 ,  H01L21/02271 ,  H01L21/02362 ,  H01L21/2255 ,  H01L23/485 ,  H01L2924/0002 ,  H01L2924/00