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    Method of encapsulating a micro-device by anodic bonding
    191.
    发明授权
    Method of encapsulating a micro-device by anodic bonding 有权
    通过阳极接合封装微器件的方法

    公开(公告)号：US09018043B2

    公开(公告)日：2015-04-28

    申请号：US14198947

    申请日：2014-03-06

    Applicant: Commissariat a l'energie atomique et aux ene alt

    Inventor： Stephane Nicolas

    IPC: B81C1/00

    CPC classification number: B81C1/00269 ,  B81C1/00285 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/031

    Abstract: A method for encapsulating at least one micro-device, comprising at least the following steps: bonding a face of a first substrate comprising at least one material impermeable to noble gases, in contact with a second substrate comprising glass and with a thickness of about 300 μm or more; etching at least one cavity through the second substrate such that side walls of the cavity are at least partly formed by remaining portions of the second substrate and that an upper wall of the cavity is formed by part of said face of the first substrate; anodic bonding of the remaining portions of the second substrate in contact with a third substrate in which the micro-device is formed, such that the micro-device is encapsulated in the cavity.

    Abstract translation: 一种用于封装至少一个微器件的方法，包括至少以下步骤：将包含至少一种不可渗透的材料的第一基底的表面与惰性气体接触，所述第一基底与含有玻璃的第二基底接触并具有约300的厚度 μm以上; 通过所述第二基板蚀刻至少一个空腔，使得所述空腔的侧壁至少部分地由所述第二基板的剩余部分形成，并且所述空腔的上壁由所述第一基板的所述面的一部分形成; 与形成有微器件的第三基板接触的第二基板的剩余部分的阳极接合，使得微器件被封装在空腔中。

    Method and structure for a micro-mechanical device containing liquid thereon
    192.
    发明授权
    Method and structure for a micro-mechanical device containing liquid thereon 有权
    用于在其上容纳液体的微机械装置的方法和结构

    公开(公告)号：US08980669B2

    公开(公告)日：2015-03-17

    申请号：US14078598

    申请日：2013-11-13

    Applicant: Sagatek Co., Ltd.

    Inventor： Jung-Hsiang Chen ,  Cheng-Szu Chen ,  Bo-Ting Chen

    IPC: H01L21/00 ,  H01L21/30 ,  B81C3/00

    CPC classification number: B81C3/001 ,  B81C2201/019 ,  B81C2203/036 ,  G01C9/02 ,  G01C9/18

    Abstract: The present invention discloses an adhesive-free method for preparation of micro electro-mechanical structure, comprising forming a micro electro-mechanical structure on a first substrate, forming an enclosing space for immersing liquid on the first or second substrate, and applying pressure to fix the first and second substrate. Before applying the pressure, the assembly including the two substrates is flipped, to make the contact surface immersed by the immersing liquid.

    Abstract translation: 本发明公开了一种用于制备微机电结构的无粘合剂的方法，包括在第一基底上形成微机电结构，形成用于将液体浸渍在第一或第二基底上的封闭空间，并施加压力以固定 第一和第二基板。 在施加压力之前，将包括两个基板的组件翻转，以使接触表面浸入浸渍液体中。

    Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component
    194.
    发明授权
    Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component 有权
    微机械部件的制造方法，相应的复合部件和相应的微机械部件

    公开(公告)号：US08901684B2

    公开(公告)日：2014-12-02

    申请号：US13489124

    申请日：2012-06-05

    Applicant: Hubert Benzel ,  Frank Henning ,  Armin Scharping ,  Christoph Schelling

    Inventor： Hubert Benzel ,  Frank Henning ,  Armin Scharping ,  Christoph Schelling

    IPC: G01L9/00 ,  B81C3/00

    CPC classification number: B81C3/001 ,  B81B2201/0264 ,  B81C2201/019 ,  G01L9/0055

    Abstract: A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.

    Abstract translation: 一种微机械部件，包括多个半导体芯片的第一复合材料，所述第一复合材料具有第一正面和背面，相应的多个载体基板的第二复合材料，所述第二复合材料具有第二前表面和后表面; 其中所述第一前表面和所述第二前表面经由结构化粘合促进剂层连接，使得每个半导体芯片基本上不含空腔连接到对应于相应的微机械部件的对应的载体基板。

    MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same
    198.
    发明申请
    MEMS Pressure Sensor and Microphone Devices Having Through-Vias and Methods of Forming Same 有权
    具有通孔和形成方法的MEMS压力传感器和麦克风设备相同

    公开(公告)号：US20140264653A1

    公开(公告)日：2014-09-18

    申请号：US13955957

    申请日：2013-07-31

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Chun-Wen Cheng ,  Chia-Hua Chu

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2201/019 ,  B81C2203/0792

    Abstract: A method embodiment includes providing a MEMS wafer. A portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer. The carrier wafer is etched to expose the first membrane and a first surface of the second membrane to an ambient environment. A MEMS structure is formed in the MEMS wafer. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure and a second sealed cavity including a second surface of the second membrane for the pressure sensor device. The cap wafer comprises an interconnect structure. A through-via electrically connected to the interconnect structure is formed in the cap wafer.

    Abstract translation: 方法实施例包括提供MEMS晶片。 图案化MEMS晶片的一部分以提供用于麦克风装置的第一膜和用于压力传感器装置的第二膜。 载体晶片结合到MEMS晶片。 蚀刻载体晶片以将第一膜和第二膜的第一表面暴露于周围环境。 在MEMS晶片中形成MEMS结构。 帽晶片结合到与承载晶片相对的MEMS晶片的一侧，以形成包括MEMS结构的第一密封空腔和包括用于压力传感器装置的第二膜的第二表面的第二密封空腔。 盖晶片包括互连结构。 在盖晶片中形成电连接到互连结构的通孔。

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