公开(公告)号：US09659884B2

公开(公告)日：2017-05-23

申请号：US15298234

申请日：2016-10-20

Applicant: Powertech Technology Inc.

Inventor： Yuan-Fu Lan ,  Hsien-Wen Hsu

IPC: H05K1/09 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H05K1/18 ,  H05K2201/10204

Abstract: A carrier substrate includes an insulation encapsulation, first conductive patterns, second conductive patterns, at least one first dummy pattern, and at least one second dummy pattern. The carrier substrate has a first layout region and a second layout region. The first conductive patterns and the first dummy pattern are located in the first layout region. The second conductive patterns and the second dummy pattern are located in the second layout region. The first and second conductive patterns and the first and second dummy patterns are embedded in the insulation encapsulation. The insulation encapsulation exposes top surfaces of the first and second conductive patterns and the first and second dummy patterns. The first dummy pattern and the second dummy pattern are insulated from the first conductive patterns and the second conductive patterns. An edge profile of the first dummy pattern facing the second dummy pattern is non-linear.

公开(公告)号：US09549468B1

公开(公告)日：2017-01-17

申请号：US14798384

申请日：2015-07-13

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Li-Chuan Tsai ,  Chih-Cheng Lee

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/16 ,  H05K7/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/36 ,  H05K3/00 ,  H05K3/22 ,  H05K3/40

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/17 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0266 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0017 ,  H05K3/0026 ,  H05K3/0047 ,  H05K3/22 ,  H05K3/36 ,  H05K3/40 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0158 ,  H05K2201/09472 ,  H05K2201/09527 ,  H05K2201/10204 ,  H05K2203/166 ,  Y02P70/611

Abstract: The present disclosure relates to a semiconductor substrate, a semiconductor module and a method for manufacturing the same. The semiconductor substrate includes a first dielectric structure, a second dielectric structure, a first patterned conductive layer and a second patterned conductive layer. The first dielectric structure has a first surface and a second surface opposite the first surface. The second dielectric structure has a third surface and a fourth surface opposite the third surface, where the fourth surface is adjacent to the first surface. The second dielectric structure defines a through hole extending from the third surface to the fourth surface. A cavity is defined by the through hole and the first dielectric structure. The first patterned conductive layer is disposed on the first surface of the first dielectric structure. The second patterned conductive layer is disposed on the second surface of the first dielectric structure.

Abstract translation: 本公开涉及半导体衬底，半导体模块及其制造方法。 半导体衬底包括第一电介质结构，第二电介质结构，第一图案化导电层和第二图案化导电层。 第一电介质结构具有与第一表面相对的第一表面和第二表面。 第二电介质结构具有与第三表面相对的第三表面和第四表面，其中第四表面与第一表面相邻。 第二电介质结构限定了从第三表面延伸到第四表面的通孔。 空腔由通孔和第一电介质结构限定。 第一图案化导电层设置在第一电介质结构的第一表面上。 第二图案化导电层设置在第一介电结构的第二表面上。

公开(公告)号：US20170006711A1

公开(公告)日：2017-01-05

申请号：US15106634

申请日：2014-11-10

Applicant: ROBERT BOSCH GMBH

Inventor： Uwe Liskow

IPC: H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K3/328 ,  H01R12/51 ,  H01R12/57 ,  H01R12/62 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/30 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/3421 ,  H05K5/0082 ,  H05K2201/09063 ,  H05K2201/10204 ,  H05K2201/1028 ,  H05K2201/10628 ,  H05K2201/10962 ,  H05K2203/107 ,  Y02P70/613

Abstract: An electronic control module includes a printed circuit board and an electrical component. The circuit board has a contact area arranged on a component side. The electrical component has an electrical connection element with a connection section running parallel to the component side and is electrically connected to the contact area. An adapter is arranged on the circuit board independently of the electrical component and has a holding body fastened to the circuit board outside the contact area and a metal web. The web is arranged on the holding body and has a contact section running parallel to the component side. The contact section and the connection section lie atop another and are welded to one another in a covering area. The web or the connection element makes electrical contact with the contact area by an electrically conductive material applied to the contact area.

Abstract translation: 电子控制模块包括印刷电路板和电气部件。 电路板具有布置在部件侧的接触区域。 电气部件具有电连接元件，其连接部分平行于部件侧延伸并且电连接到接触区域。 电路板上独立于电气部件设置适配器，并且具有在接触区域外部紧固到电路板的保持体和金属网。 卷筒纸布置在保持体上，并且具有平行于部件侧延伸的接触部分。 接触部分和连接部分位于另一个顶部并且在覆盖区域中彼此焊接。 网或连接元件通过施加到接触区域的导电材料与接触区域电接触。

公开(公告)号：US09461221B2

公开(公告)日：2016-10-04

申请号：US14581474

申请日：2014-12-23

Applicant: LG Display Co., Ltd.

Inventor： Dong Hun Lee

IPC: H01L33/00 ,  H01L33/62 ,  H05K1/18 ,  F21V8/00

CPC classification number: H01L33/62 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H05K1/181 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10204 ,  Y02P70/611 ,  H01L2924/00014

Abstract: Disclosed is a light emitting diode (LED) package, which can be used for, for example, a light source module, a backlight unit and a display device, that may, for example, include an LED chip in a body portion of the LED package; first and second lead frames separated from each other in the body portion, each of the first and second lead frames including first and second leads that are electrically connected to the LED chip and are used as one of anode and cathode leads; and first and second dummy lead frames separated from each other in the body portion and electrically insulated from the first and second lead frames.

Abstract translation: 公开了一种发光二极管（LED）封装，其可以用于例如光源模块，背光单元和显示装置，其可以例如在LED的主体部分中包括LED芯片 包; 第一引线框架和第二引线框架在主体部分中彼此分离，第一引线框架和第二引线框架中的每一个包括电连接到LED芯片的第一引线和第二引线，并且用作阳极引线和阴极引线之一; 以及在主体部分彼此分离并与第一和第二引线框架电绝缘的第一和第二虚拟引线框架。

公开(公告)号：US09349674B2

公开(公告)日：2016-05-24

申请号：US14283642

申请日：2014-05-21

Applicant: NGK SPARK PLUG CO., LTD

Inventor： Kensuke Matsuhashi ,  Sadahiro Nishimura

IPC: H05K13/00 ,  H05K1/11 ,  H01L23/495 ,  H05K3/00 ,  H05K3/24 ,  H01L23/48 ,  H01L21/56

CPC classification number: H01L23/49503 ,  H01L21/561 ,  H01L23/49506 ,  H01L23/49531 ,  H01L23/49544 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49582 ,  H01L2224/48091 ,  H01L2924/15192 ,  H05K3/0097 ,  H05K3/244 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2203/0169 ,  H05K2203/304 ,  Y10T29/49147 ,  H01L2924/00014

Abstract: A wiring board unit includes: a polygonal wiring board having three or more sides in top view, a product insulating part comprising a plurality of external terminals, and a dummy insulating part at an outer edge of one of the at least three sides; and a lead frame including a frame having an inner edge defining an opening within which the wiring board is disposed in top view, and a plurality of leads, one end of each of the plurality of leads connected to the inner edge of the frame and the other end of each of the plurality of leads respectively connected to one of the plurality of external terminals of the wiring board, wherein a connection unit for connecting the frame of the lead frame and the dummy insulating part of the wiring board is arranged therebetween.

Abstract translation: 布线板单元包括：顶视图中具有三个或更多边的多边形布线板，包括多个外部端子的产品绝缘部分和至少三个侧面之一的外边缘处的虚设绝缘部分; 以及引线框架，其包括框架，所述框架具有限定开口的内边缘，所述布线板在所述开口中以顶视图布置;多个引线，所述多个引线中的每一个的一端连接到所述框架的内边缘， 所述多个引线中的每一个的另一端分别连接到所述布线板的所述多个外部端子中的一个，其中，布置在所述引线框架的框架和所述布线板的所述虚拟绝缘部分之间的连接单元。

公开(公告)号：US09220167B2

公开(公告)日：2015-12-22

申请号：US14623689

申请日：2015-02-17

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Masato Tanaka ,  Toshinori Koyama ,  Akio Rokugawa

IPC: H01L23/12 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H01L23/15 ,  H01L23/538

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/12044 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K3/429 ,  H05K3/46 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0191 ,  H05K2201/045 ,  H05K2201/09409 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/10674 ,  Y10T29/49162 ,  H01L2924/00

Abstract: A wiring substrate includes a first wiring structure, a second wiring structure stacked on an upper surface of the first wiring structure, and an outermost insulating layer stacked on a lower surface of the first wiring structure. The outermost insulating layer covers a part of a bottom wiring layer of the wiring layers forming the first wiring structure. The second wiring structure has a wiring density higher than that of the first wiring structure. A volume ratio V1/V2 is from 0.8 to 1.5, where V1 represents the volume of the wiring layers forming the entire second wiring structure, and V2 represents the volume of the bottom wiring layer in the first wiring structure.

Abstract translation: 布线基板包括第一布线结构，堆叠在第一布线结构的上表面上的第二布线结构和堆叠在第一布线结构的下表面上的最外绝缘层。 最外层绝缘层覆盖形成第一布线结构的布线层的底部布线层的一部分。 第二布线结构具有比第一布线结构高的布线密度。 体积比V1 / V2为0.8〜1.5，其中V1表示形成整个第二布线结构的布线层的体积，V2表示第一布线结构中底布线层的体积。

公开(公告)号：US20150351248A1

公开(公告)日：2015-12-03

申请号：US14811848

申请日：2015-07-29

Applicant: GNE TECH CO., LTD.

Inventor： JAE KU KIM

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H01B17/14 ,  B81C2203/054 ,  C23F1/02 ,  C23F1/18 ,  G02F1/13452 ,  H01B19/00 ,  H05K1/02 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/3442 ,  H05K3/42 ,  H05K2201/10204 ,  H05K2201/2036 ,  Y10T29/303 ,  Y10T29/49227 ,  Y10T428/24488 ,  Y10T428/31678

Abstract: Disclosed is a method for manufacturing a substrate gap supporter. The method includes: a first step of forming metal foils on both sides of an insulating plate; a second step of etching the metal foils to expose the insulating plate so that a plurality of stripes are arranged on both sides of the insulating plate in parallel at constant intervals, wherein the stripes expose the insulating plate at constant widths; and a third step of cutting in direction in parallel with the stripes and in direction in vertical with the stripes along one edges of the stripes to complete the gap supporter.

Abstract translation: 公开了一种用于制造衬底间隙支架的方法。 该方法包括：在绝缘板的两侧形成金属箔的第一步骤; 蚀刻金属箔以露出绝缘板的第二步骤，使得多个条以均匀的间隔平行布置在绝缘板的两侧，其中条纹以恒定宽度暴露绝缘板; 以及第三步骤，沿着与条纹平行的方向并且沿条带的垂直方向沿着条的一个边缘切割以完成间隙支撑件。

公开(公告)号：US20150289367A1

公开(公告)日：2015-10-08

申请号：US14478883

申请日：2014-09-05

Applicant: Samsung Display Co., Ltd.

Inventor： Rae Young KIM ,  Myoung Seok SON ,  Taek Sun SHIN ,  Sun Hee OH ,  Kwang Wook CHOI

IPC: H05K1/02 ,  F21V8/00 ,  H05K1/18

CPC classification number: G02B6/0065 ,  G02B6/0083 ,  G02B6/009 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10204 ,  H05K2201/10454

Abstract: Provided are a backlight unit and a liquid crystal display including the backlight unit. The backlight unit includes a light emitting package, and a light guide plate disposed at one side of the light emitting package. The light emitting package includes a printed circuit board including first regions that are spaced an interval apart from each other and second regions defined between the first regions, light source units disposed on the first regions of the printed circuit board, dummy wiring patterns disposed on the second regions of the printed circuit board, and wiring patterns disposed on the printed circuit board and electrically connected to the light source units.

Abstract translation: 提供背光单元和包括背光单元的液晶显示器。 背光单元包括发光封装和布置在发光封装的一侧的导光板。 发光封装包括印刷电路板，其包括彼此间隔开的间隔的第一区域和限定在第一区域之间的第二区域，布置在印刷电路板的第一区域上的光源单元，设置在印刷电路板上的虚设布线图案 印刷电路板的第二区域以及设置在印刷电路板上并电连接到光源单元的布线图案。

公开(公告)号：US20150245473A1

公开(公告)日：2015-08-27

申请号：US14623689

申请日：2015-02-17

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi SHIMIZU ,  Masato TANAKA ,  Toshinori KOYAMA ,  Akio ROKUGAWA

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/12044 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K3/429 ,  H05K3/46 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0191 ,  H05K2201/045 ,  H05K2201/09409 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/10674 ,  Y10T29/49162 ,  H01L2924/00

Abstract: A wiring substrate includes a first wiring structure, a second wiring structure stacked on an upper surface of the first wiring structure, and an outermost insulating layer stacked on a lower surface of the first wiring structure. The outermost insulating layer covers a part of a bottom wiring layer of the wiring layers forming the first wiring structure. The second wiring structure has a wiring density higher than that of the first wiring structure. A volume ratio V1/V2 is from 0.8 to 1.5, where V1 represents the volume of the wiring layers forming the entire second wiring structure, and V2 represents the volume of the bottom wiring layer in the first wiring structure.

Abstract translation: 布线基板包括第一布线结构，堆叠在第一布线结构的上表面上的第二布线结构和堆叠在第一布线结构的下表面上的最外绝缘层。 最外层绝缘层覆盖形成第一布线结构的布线层的底部布线层的一部分。 第二布线结构具有比第一布线结构高的布线密度。 体积比V1 / V2为0.8〜1.5，其中V1表示形成整个第二布线结构的布线层的体积，V2表示第一布线结构中底布线层的体积。

公开(公告)号：US09119300B2

公开(公告)日：2015-08-25

申请号：US13718473

申请日：2012-12-18

Applicant: MINEBEA CO., LTD.

Inventor： Hidetoshi Hijikata ,  Takayuki Matsui ,  Kazuo Takada ,  Haruka Miyaji

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/10204

Abstract: A motor control device includes a circuit board having a control circuit controlling electric power to be supplied to a motor, a base fixedly supporting the circuit board, a flexible printed circuit supplying electric power to the motor, a pin terminal disposed on the circuit board, being electrically connected with the control circuit, a dummy pin terminal disposed on the circuit board, being electrically free from the control circuit, a wiring pattern land disposed on the FPC, being electrically connected with the pin terminal, and a dummy wiring pattern land disposed on the FPC, being connected with the dummy pin terminal.

Abstract translation: 一种电动机控制装置，包括：电路板，其具有控制供给电动机的电力的控制电路;固定地支撑所述电路板的基座;向所述电动机供给电力的柔性印刷电路;配置在所述电路基板上的销子端子; 与所述控制电路电连接，设置在所述电路板上的虚拟针端子与所述控制电路电气相连，设置在所述FPC上的布线图案区域与所述引脚端子电连接，以及设置的虚拟布线图案区域 在FPC上，与虚拟针端子连接。