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191.发明授权
公开(公告)号：US4674182A
公开(公告)日：1987-06-23
申请号：US865006
申请日：1986-05-20
Applicant: Yutaka Igarashi
Inventor： Yutaka Igarashi
CPC classification number: H05K3/225 , H05K1/0281 , H05K1/141 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K3/305 , H05K3/3447 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139
Abstract: A printed wiring board comprising a main printed wiring board provided with a first wiring pattern, and an auxiliary flexible printed wiring board, provided with a second wiring pattern for modifying the first wiring pattern and bonded to the main printed wiring board so as to electrically connect the second wiring pattern to a desired part of the first wiring pattern. The auxiliary board may be affixed to the main board with a pressure-sensitive adhesive or thermosetting adhesive. The auxiliary board may be provided with marks for facilitating alignment, holes to provide access to the main board, a dummy pattern for preventing tears of the flexible auxiliary board, and a second dummy pattern to prevent warping from uneven stresses applied to the flexible auxiliary board by differences in thermal expansion of the auxiliary board and the pattern printed thereon. A method of making the board is also disclosed and claimed.
Abstract translation: 一种印刷电路板，包括设置有第一布线图案的主印刷布线板和辅助柔性印刷布线板，其具有用于修改第一布线图案并结合到主印刷布线板以便电连接的第二布线图案 第二布线图案到第一布线图案的期望部分。 辅助板可以用压敏粘合剂或热固性粘合剂固定在主板上。 辅助板可以设置有用于便于对准的标记，用于提供对主板的通路的孔，用于防止柔性辅助板的撕裂的虚拟图案，以及第二虚设图案，以防止由于施加到柔性辅助板的不均匀的应力而翘曲 通过辅助板的热膨胀差异和印刷在其上的图案。 公开并要求保护板的方法。
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公开(公告)号：US4567543A
公开(公告)日：1986-01-28
申请号：US466466
申请日：1983-02-15
Applicant: Jay J. Miniet
Inventor： Jay J. Miniet
CPC classification number: H05K1/189 , H05K3/3415 , H05K2201/042 , H05K2201/0909 , H05K2201/096 , H05K2201/1034 , H05K2201/10462 , H05K2201/10636 , H05K2201/10651 , H05K2201/10977 , H05K2201/2009 , H05K2201/2036 , H05K2203/1311 , H05K2203/1572 , H05K3/0058 , H05K3/281 , H05K3/284 , H05K3/305 , H05K3/306 , H05K3/3447 , H05K3/386 , Y02P70/611 , Y02P70/613
Abstract: A double-sided flexible electronic circuit module is provided having a flexible printed circuit board. The flexible circuit board has a plurality of conductive paths on each surface and a plurality of conductively plated-through apertures being connected to the conductive paths. One side of the flexible circuit board is adapted to carry components with leads; the other side of the flexible circuit board is adapted to receive components without leads. A carrier member, larger than the flexible circuit board and of a size and shape sufficient to accommodate the placement of at least one flexible circuit board, is also provided. The carrier member has a plurality of apertures which are in alignment with the apertures of the flexible circuit board, and a plurality of elongated slots in predetermined positions which extend the entire width of the flexible circuit board which is temporarily affixed onto the carrier member. All of the components are soldered to the flexible circuit board, the carrier member acting as a support member to the components having leads.
Abstract translation: 提供具有柔性印刷电路板的双面柔性电子电路模块。 柔性电路板在每个表面上具有多个导电路径，并且多个电导通孔与导电路径连接。 柔性电路板的一侧适用于携带带导线的部件; 柔性电路板的另一侧适于接收不带引线的部件。 还提供了大于柔性电路板的载体构件以及足以容纳至少一个柔性电路板的放置的尺寸和形状。 载体构件具有与柔性电路板的孔对准的多个孔，以及在预定位置上的多个细长槽，其延伸柔性电路板的整个宽度，该柔性电路板临时固定在承载构件上。 所有的部件被焊接到柔性电路板上，承载部件用作具有引线的部件的支撑部件。
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公开(公告)号：US4411982A
公开(公告)日：1983-10-25
申请号：US338907
申请日：1982-01-12
Applicant: Chuji Shibuya , Satoshi Kaneda , Takashi Kanehisa , Masatoshi Kondo , Kenji Nogawa , Fumio Hasuike
Inventor： Chuji Shibuya , Satoshi Kaneda , Takashi Kanehisa , Masatoshi Kondo , Kenji Nogawa , Fumio Hasuike
CPC classification number: H05K3/064 , H05K3/0097 , H05K3/02 , H05K1/0393 , H05K2201/09781 , H05K2201/2009 , H05K2203/058 , H05K2203/1394 , H05K2203/1545 , H05K3/0094 , H05K3/28 , H05K3/427 , Y10T29/49155
Abstract: A disclosed method of continuous making flexible printed circuits for use in radio set or the like appliances, includes punching holes in a continuous copper-film clad insulating substrate, forming photopolymer films on the faces of the copper films exposing the photopolymer film to photochemical light of a predetermined pattern, developing the exposed photopolymer film, etching the copper film utilizing remaining parts of the photopolymer film as etching masks, removing the remaining photopolymer films 40 and printing solder-resist films on selected parts. The improvement is to provide and retain selected oblong parts of said conductor metal film disposed on and parallel to longitudinal direction of the continuous substrate by, for example, covering these parts by etching-resist films. The retained oblong parts of the metal film serve to prevent shrinkage of the substrate during the conduct of further manufacturing steps thereby assuring registration of the patterns of the printed circuits and the printed solder-resist films.
Abstract translation: 公开的连续制造用于无线电设备或类似设备的柔性印刷电路的方法包括在连续的铜膜包覆绝缘基板中的冲孔，在将光聚合物膜暴露的铜膜的表面上形成光聚合物膜， 曝光的光聚合物膜显影，利用剩余部分的光聚合物膜作为蚀刻掩模蚀刻铜膜，除去剩余的光聚合物膜40并在选定的部分上印刷阻焊膜。 改进之处在于通过例如通过抗蚀剂膜覆盖这些部分来提供并保持设置在连续基板的纵向方向上且与其平行的所述导体金属膜的选定的长方形部分。 金属膜的保留的长方形部分用于在进一步制造步骤期间防止基板的收缩，从而确保印刷电路图案和印刷的阻焊膜的配准。
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公开(公告)号：US4251683A
公开(公告)日：1981-02-17
申请号：US032115
申请日：1979-04-23
Applicant: Ray L. Oughton, Jr. , Willis A. Larson
Inventor： Ray L. Oughton, Jr. , Willis A. Larson
IPC: H01H13/702 , H01H13/785 , H05K1/09 , H05K1/11 , H05K1/14 , H05K3/00 , H05K3/28 , H01R9/09
CPC classification number: H01H13/785 , H01H13/702 , H05K1/118 , H01H2201/024 , H01H2203/056 , H01H2207/004 , H05K1/095 , H05K1/142 , H05K2201/053 , H05K2201/0769 , H05K2201/09063 , H05K2201/09172 , H05K2201/2009 , H05K3/0058 , H05K3/281
Abstract: A connecting tail for a switching device, for example a membrane switch, includes a substrate having a plurality of spaced parallel silver conductors formed thereon. To prevent migration of silver between the spaced conductors there are a plurality of parallel notches, one between adjacent silver conductors. At least a portion of the conductors are covered by an adhesive, with the notches extending into the adhesive.
Abstract translation: 用于开关装置（例如薄膜开关）的连接尾部包括其上形成有多个间隔开的平行银导体的基板。 为了防止银在间隔开的导体之间迁移，存在多个平行的凹口，一个在相邻的银导体之间。 导体的至少一部分被粘合剂覆盖，其中凹口延伸到粘合剂中。
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公开(公告)号：US4149219A
公开(公告)日：1979-04-10
申请号：US879925
申请日：1978-02-22
Applicant: Robert W. Kraft
Inventor： Robert W. Kraft
CPC classification number: H05K7/1434 , H05K1/189 , H05K7/20445 , H05K2201/042 , H05K2201/2009 , H05K3/0058 , H05K3/301 , H05K3/4691
Abstract: A flexible printed circuitry board assembly having a plurality of rigid pted circuit boards spaced apart but mechanically and electrically connected by a thin flexible printed circuitry board which is bonded to one side of each rigid board. The assembled board is reverse-bonded to align the rigid boards in stacked, parallel positions and are held in position by a pair of metallic support plates. A heat sink, having a plurality of resilient fingers, is attached to each support plate and the resilient fingers support the assembled board within a metallic housing and transfer heat from the assembled board to the housing.
Abstract translation: 柔性印刷电路板组件具有多个刚性印刷电路板，这些印刷电路板间隔开，但通过薄的柔性印刷电路板机械地和电连接，该印刷电路板结合到每个刚性板的一侧。 组装的板反向粘合以将刚性板对准在堆叠的平行位置，并通过一对金属支撑板保持在适当位置。 具有多个弹性指状物的散热器附接到每个支撑板，并且弹性指状物将组装的板支撑在金属壳体内并将热量从组装板传递到壳体。
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Patent Agency Ranking
公开(公告)号：US4092057A
公开(公告)日：1978-05-30
申请号：US764980
申请日：1977-02-02
Applicant: Tommy L. Walton
Inventor： Tommy L. Walton
CPC classification number: H05K3/4691 , H01R12/62 , H05K2201/09109 , H05K2201/2009 , H05K2203/308 , H05K3/0058 , Y10T29/49155
Abstract: A flexible circuit assembly and a method of making it in which there are no separate electrical interconnections between the flexible interconnecting cable and the rigid connector. A flexible insulating film is bonded to a surface of the connector member and extends from the connector to provide a flexible interconnecting cable for external electrical connections. A plurality of conductors on the insulating film provides a continuous electrically conductive path thus providing an interfaceless electrical connection between the rigid connector and the flexible interconnecting cable. In the method, a metallic clad insulating film is placed on a surface of a rigid support member which includes a portion which will serve as the connector. The support member also includes a filler block portion in the space designated for the flexible interconnecting cable. The film is selectively bonded to the connector portion of the support member. Conductors are then formed on the insulating film. The filler block is then removed to leave a rigid connector and a flexible interconnecting cable which has a plurality of continuous conductors thereon thereby eliminating a separate electrical connection therebetween.
Abstract translation: 柔性电路组件及其制造方法，其中柔性互连电缆和刚性连接器之间不存在单独的电互连。 柔性绝缘膜结合到连接器构件的表面并从连接器延伸以提供用于外部电连接的柔性互连电缆。 绝缘膜上的多个导体提供连续的导电路径，从而在刚性连接器和柔性互连电缆之间提供无接触的电连接。 在该方法中，将金属包覆绝缘膜放置在刚性支撑构件的表面上，该刚性支撑构件包括将用作连接器的部分。 支撑构件还包括在为柔性互连电缆指定的空间中的填充块部分。 膜被选择性地结合到支撑构件的连接器部分。 然后在绝缘膜上形成导体。 然后移除填料块以留下刚性连接器和柔性互连电缆，其上具有多个连续的导体，从而消除它们之间的单独的电连接。
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公开(公告)号：US4081600A
公开(公告)日：1978-03-28
申请号：US709457
申请日：1976-07-28
Applicant: Joseph A. Kueneman , Kenneth W. Nestor , Adolph J. Miera
Inventor： Joseph A. Kueneman , Kenneth W. Nestor , Adolph J. Miera
CPC classification number: H05K3/4691 , H05K3/0014 , H05K3/281 , H05K1/0263 , H05K1/118 , H05K2201/2009 , H05K2203/0108 , H05K2203/0156 , H05K2203/1105 , H05K3/007 , H05K3/107 , H05K3/386 , Y10T156/1048 , Y10T156/1093 , Y10T428/24612 , Y10T428/31518 , Y10T428/31721
Abstract: Improvements are disclosed in the conventional process for the laminated packaging of etched circuitry consisting of:(1) A unitized form tool which is produced by photomasking a metal plate, with the same pattern master transparency that is used for producing the photoetched circuitry, followed by chemical milling of the exposed areas to a depth equal to the thickness of the circuitry,(2) the manufacturer's low pressure dwell cycle in the press for prepreg containing epoxy resin or polyimide resin is for either resin changed to 210.+-. 15 secs. at 10.+-. 1 psi and 340.degree. F. Thereafter the process returns to the manufacturer's specification for the specific resin for the remaining steps of the press and cure cycle, except that the cure is interrupted 60 minutes short of complete cure,(3) the cavity is preformed in the press in the precursor of the laminated board using the form tool of (1) and the conventional press cycle as modified per (2), and the interrupted post cure cycle per (2) is completed in the press under conditions specified for the specific resin by the manufacturer, to provide a completely bonded laminated circuit package.An improved process and, as new articles of manufacture, a laminated board with preformed cavity and a void-free laminated circuit package are disclosed.
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公开(公告)号：US4072377A
公开(公告)日：1978-02-07
申请号：US684884
申请日：1976-05-10
Applicant: Harley J. Van de Loo , Hans J. Ziegler
Inventor： Harley J. Van de Loo , Hans J. Ziegler
CPC classification number: H05K1/118 , H01R12/58 , H01R9/2466 , H02G15/076 , H05K3/308 , H01R12/613 , H01R12/62 , H05K1/0393 , H05K2201/096 , H05K2201/10295 , H05K2201/1059 , H05K2201/1078 , H05K2201/2009 , H05K2201/2036 , H05K2203/1446 , H05K3/0058 , H05K3/306 , H05K3/3447
Abstract: A terminal block includes a printed circuit element which has conductive paths deposited on one of its surfaces, with each path extending from a terminal area surrounding an opening in the element to a centralized area. In one embodiment, the printed circuit element is a rigid board and terminals are mounted on the board and extend through each opening and project outwardly on the opposite surface of the board. The terminals are swedged at one end to physically retain them on the board and to electrically connect them to the conductive path. The rigid board is attached to an open box-like shell through which a cable carrying wire conductor extends and connects, interior to the block, to the conductive paths on the circuit board. In another embodiment, the circuit element is a flat, flexible sheet which is disposed against a support board provided with apertures aligned with the openings in the flexible sheet. The terminals extend through both the board and the sheet and may be swedged at one end to grip the support board and flexible element and to electrically connect the terminals to the conductive path. Alternately, the terminals may be soldered to the terminal area surrounding an opening of the flexible sheet. A back plate may be connected to the board to sandwich the flexible sheet therebetween.
Abstract translation: 端子块包括具有沉积在其表面之一上的导电路径的印刷电路元件，每个路径从围绕元件中的开口的端子区域延伸到集中区域。 在一个实施例中，印刷电路元件是刚性板，并且端子安装在板上并延伸穿过每个开口并在板的相对表面上向外突出。 端子在一端被摆动，以物理地将它们保持在板上并将它们电连接到导电路径上。 刚性板连接到敞开的箱状壳体上，电缆承载线导体通过该外壳延伸并连接到块体内部到电路板上的导电路径。 在另一个实施例中，电路元件是平坦的柔性片材，其被设置为抵靠设置有与柔性片材中的开口对准的孔的支撑板。 端子延伸穿过板和板，并且可以在一端被卷绕以夹持支撑板和柔性元件并且将端子电连接到导电路径。 或者，端子可以焊接到围绕柔性片的开口的端子区域。 背板可以连接到板以将柔性片夹在其间。
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公开(公告)号：US4053943A
公开(公告)日：1977-10-11
申请号：US651654
申请日：1976-01-22
Applicant: Lee Robert Galvin
Inventor： Lee Robert Galvin
CPC classification number: H05K7/00 , H05K1/0271 , H05K1/18 , H05K2201/0133 , H05K2201/2009 , H05K2201/2045
Abstract: A vibration damping system for a printed circuit board in which laminated damping elements are remotely positioned from the printed circuit board.The laminated damping elements are connected to the printed circuit board by post structural means fastened rigidly at each end to the printed circuit board and to the laminated damping element, respectively, for the purpose of transferring vibration energy from the printed circuit board to the damping element. The laminated damping elements comprise a high hysteresis bonding agent for bonding the laminate and for absorbing the vibration energy. The high hysteresis bonding agent is stressed in a shear mode for greatest energy absorption efficiency.
Abstract translation: 一种用于印刷电路板的振动阻尼系统，其中层压阻尼元件远离印刷电路板定位。
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公开(公告)号：US3971127A
公开(公告)日：1976-07-27
申请号：US611911
申请日：1975-09-10
Applicant: Winfield Joseph Giguere , David Richard Padnes
Inventor： Winfield Joseph Giguere , David Richard Padnes
CPC classification number: H05K1/189 , H05K2201/042 , H05K2201/0909 , H05K2201/10651 , H05K2201/2009 , H05K3/0058 , H05K3/301 , Y10T29/49121 , Y10T29/49158 , Y10T29/49165
Abstract: A method of fabricating a folded printed wiring board assembly includes the steps of cutting an aperture into a rigid board; bonding a flexible circuit tape to one side of the board so that the tape bridges the aperture; perforating a plurality of holes through the board and flexible tape; inserting leads of electrical components through the holes; conductively bonding the leads to conductors on the flexible circuit tape; cutting two edges of the board through the aperture; and folding the assembly in the area of the aperture.
Abstract translation: 制造折叠印刷线路板组件的方法包括将孔切割成刚性板的步骤; 将柔性电路带粘合到所述板的一侧，使得所述带桥接所述孔; 穿过板和柔性带穿孔多个孔; 通过孔插入电气元件的引线; 将引线导电地接合到柔性电路带上的导体上; 通过孔切割板的两个边缘; 并且在所述孔的区域中折叠所述组件。
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