公开(公告)号：US20140133115A1

公开(公告)日：2014-05-15

申请号：US13922349

申请日：2013-06-20

Applicant: FUJI XEROX Co., Ltd.

Inventor： Daisuke IGUCHI

IPC: H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/162 ,  H05K1/181 ,  H05K2201/041 ,  H05K2201/09309 ,  H05K2201/09327 ,  H05K2201/09345 ,  H05K2201/09663

Abstract: A multilayer wiring board includes a signal electrode, a first power supply electrode, and a ground electrode, which are connected to a first element that outputs a signal, an electrode connected to a second element that receives the signal, a ground layer that serves as a return path for a return current of the signal, a first power supply layer that is disposed adjacent to the ground layer with a dielectric layer interposed therebetween and supplies electric power to the first element, and a second power supply layer that is provided independently of the first power supply layer and supplies electric power to the second element. The first power supply layer causes the return current to return to the first element through the first power supply electrode as a displacement current between the ground layer and the first power supply layer.

Abstract translation: 多层布线板包括信号电极，第一电源电极和接地电极，它们连接到输出信号的第一元件，连接到接收信号的第二元件的电极，用作 用于所述信号的返回电流的返回路径，与所述接地层相邻设置有电介质层并且向所述第一元件提供电力的第一电源层和与所述第一电源层独立地设置的第二电源层， 第一电源层并且向第二元件供电。 第一电源层使返回电流通过第一电源电极返回到第一元件，作为接地层和第一电源层之间的位移电流。

公开(公告)号：US20140104800A1

公开(公告)日：2014-04-17

申请号：US14050872

申请日：2013-10-10

Applicant: Freescale Semiconductor, Inc. ,  STMicroelectronics S.r.l.

Inventor： MARIO ROTIGNI ,  Richard Moseley ,  Piyush Bhatt ,  Gregory Edgington

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H05K1/0262 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A printed circuit board including a first outer layer, a second outer layer and an integrated circuit mounted on the second outer layer. The integrated circuit has a single exposed pad electrically connected to a ground reference, a first supply pin electrically connected to a first power supply and a second supply pin electrically connected to a second power supply, wherein the first power supply is configured to generate a first supply current with frequency components higher than the frequency components of a second supply current generated by the second power supply.

Abstract translation: 一种印刷电路板，包括第一外层，第二外层和安装在第二外层上的集成电路。 集成电路具有电连接到接地基准的单个裸焊盘，电连接到第一电源的第一电源引脚和与第二电源电连接的第二电源引脚，其中第一电源被配置为产生第一 提供具有高于由第二电源产生的第二电源电流的频率分量的频率分量的电流。

公开(公告)号：US20140048325A1

公开(公告)日：2014-02-20

申请号：US14113597

申请日：2012-04-17

Applicant: Angelika Schingale ,  Frank Baur

Inventor： Angelika Schingale ,  Frank Baur

IPC: H05K1/11

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H05K1/0272 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/09781 ,  Y02P70/611 ,  H01L2924/00

Abstract: A contact area is provided on a carrier for connection to a mating contact area on a further carrier using an adhesive containing conductive particles. The contact area includes at least one recess forming a drain channel for the adhesive, extending from one edge of the contact area to an opposing edge and having a width being less than an average diameter of the particles. Alternatively, the contact area includes boreholes extending from a main surface to an opposing main surface and having diameters being approximately equal to or smaller than the average diameter of the particles in at least one direction and a cavity is formed in the carrier beneath the contact area. Alternatively, integral moldings forming a turf structure are provided on the contact area and distances between the moldings are equal to or smaller than the average diameter of the particles in at least one direction.

Abstract translation: 接触区域设置在载体上，用于使用含有导电颗粒的粘合剂连接到另一载体上的配合接触区域。 接触区域包括形成用于粘合剂的排出通道的至少一个凹部，从接触区域的一个边缘延伸到相对的边缘并且具有小于颗粒的平均直径的宽度。 或者，接触区域包括从主表面延伸到相对的主表面的钻孔，并且其直径在至少一个方向上大约等于或小于颗粒的平均直径，并且空腔形成在接触区域下方的载体中 。 或者，形成草皮结构的整体模制品设置在接触区域上，并且模制品之间的距离等于或小于颗粒在至少一个方向上的平均直径。

公开(公告)号：US20140014981A1

公开(公告)日：2014-01-16

申请号：US14026183

申请日：2013-09-13

Applicant: Samsung Display Co., Ltd.

Inventor： Seong-Yong Hwang ,  An-Na PARK ,  Weon-Sik OH ,  Jin-Kwan KIM ,  Sung-Lak CHOI ,  Kyung-Lae RHO ,  Hyo-Hwi CHOI ,  Ju-Yong KIM ,  Dong-Ha LEE

IPC: G02F1/1362

CPC classification number: G02F1/136286 ,  G02F1/13452 ,  G02F2202/28 ,  G09G3/3648 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09663 ,  H05K2201/0969

Abstract: A display apparatus including a display panel including a pixel electrode and a plurality of first signal lines transmitting a driving signal to the pixel electrode, a conductive member on the first signal lines, the conductive member having a resin, and a second signal line on the conductive member, the second signal line having an opening through which the resin travels to couple the second signal line with one of the first signal lines.

Abstract translation: 一种显示装置，包括显示面板，包括像素电极和向像素电极传输驱动信号的多个第一信号线，第一信号线上的导电部件，具有树脂的导电部件和第二信号线 第二信号线具有开口，树脂通过该开口将第二信号线与第一信号线之一耦合。

公开(公告)号：US20130327563A1

公开(公告)日：2013-12-12

申请号：US13908865

申请日：2013-06-03

Applicant: FUJITSU LIMITED

Inventor： Takahiro KITAGAWA

IPC: H05K13/04 ,  H05K1/18

CPC classification number: H05K13/04 ,  H05K1/116 ,  H05K1/181 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/099 ,  H05K2203/045 ,  H05K2203/046

Abstract: There is provided a printed wiring board which includes a substrate, and a soldering portion disposed on the substrate, an electronic component being to be soldered to the solder portion. The soldering portion includes a first conductor to which a solder paste is applied, and a plurality of second conductors extends in a direction away from the first conductor, where the plurality of second conductors extend parallel to each other and linearly.

Abstract translation: 提供一种印刷电路板，其包括基板和设置在基板上的焊接部分，要焊接到焊料部分的电子部件。 焊接部分包括施加焊膏的第一导体，并且多个第二导体沿远离第一导体的方向延伸，其中多个第二导体彼此平行延伸并线性延伸。

公开(公告)号：US08590146B2

公开(公告)日：2013-11-26

申请号：US12938208

申请日：2010-11-02

Applicant: Thomas Kinsley

Inventor： Thomas Kinsley

IPC: H05K3/34 ,  H05K3/20 ,  H05K3/30

CPC classification number: B23K1/0016 ,  G01R31/048 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2203/163 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method comprising coupling a device to a printed circuit board, one of the device or the printed circuit board having a first connection pad and a second connection pad. The first and second connection pads are directly electrically coupled to one another, without any intervening components between the first and second connection pads, via a test path. The method further comprises performing a continuity test across the first and second connection pads and the test path and disabling the test path between the first and second connection pads.

Abstract translation: 一种方法，包括将装置耦合到印刷电路板，所述装置或印刷电路板中的一个具有第一连接焊盘和第二连接焊盘。 第一和第二连接焊盘通过测试路径彼此直接电耦合，而在第一和第二连接焊盘之间没有任何中间部件。 该方法还包括跨越第一和第二连接焊盘和测试路径执行连续性测试，并禁用第一和第二连接焊盘之间的测试路径。

公开(公告)号：US20130299224A1

公开(公告)日：2013-11-14

申请号：US13872297

申请日：2013-04-29

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

IPC: H01G4/30 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/09663 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: In an electronic component, a first outer electrode is provided on a first side surface and a second outer electrode is provided on a second side surface. Each of the first and second outer electrodes includes first and second electrode portions that are arranged at positions other than end portions and a center of the first or second side surface in a first direction.

Abstract translation: 在电子部件中，第一外部电极设置在第一侧面上，第二外部电极设置在第二侧面上。 第一和第二外部电极中的每一个包括第一和第二电极部分，其布置在第一方向上的除了端部之外的位置和第一或第二侧表面的中心。

公开(公告)号：US20130286644A1

公开(公告)日：2013-10-31

申请号：US13563738

申请日：2012-08-01

Applicant: CHIH-CHEN LAI

Inventor： CHIH-CHEN LAI

IPC: F21V21/00

CPC classification number: H05K1/167 ,  F21S4/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0296 ,  H05K1/111 ,  H05K2201/0784 ,  H05K2201/09227 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611

Abstract: An LED light bar includes LED chips and a printed circuit board. A number of welding pads are disposed on the printed circuit board, and correspondingly connected to anodes and cathodes of the LED chips respectively. The welding pads connected to the anodes of the LED chips are connected by wire lines for connecting an anode of an electrical power source. The welding pads connected to the cathodes of the LED chips are connected by the wire lines for connecting a cathode of the electrical power source. The resistance of the wire lines connected to the LED chips increases from one near the electrical power source to the one far from the electrical power source. The resistance of the welding pads connected to the LED chips decreases from one near the electrical power source to the one far from the electrical power source.

Abstract translation: LED灯条包括LED芯片和印刷电路板。 多个焊盘设置在印刷电路板上，分别相应地连接到LED芯片的阳极和阴极。 连接到LED芯片的阳极的焊盘通过用于连接电源的阳极的线路连接。 连接到LED芯片的阴极的焊盘通过用于连接电源的阴极的电线连接。 连接到LED芯片的电线的电阻从电源附近的电阻增加到远离电源的电阻。 连接到LED芯片的焊盘的电阻从电源附近的电阻减小到远离电源的电阻。

公开(公告)号：US08513538B2

公开(公告)日：2013-08-20

申请号：US12957926

申请日：2010-12-01

Applicant: Kenji Hasegawa

Inventor： Kenji Hasegawa

IPC: H05K1/11

CPC classification number: H05K1/0206 ,  H05K3/3421 ,  H05K2201/0959 ,  H05K2201/09663 ,  H05K2201/10689 ,  H05K2201/10969

Abstract: According to one embodiment, a television apparatus includes a circuit board, a pad, a heat-transfer layer, and a block. The circuit board is mounted with an electronic component. The pad is provided on a surface of the circuit board. The heat-transfer layer is formed on the inner surface of a through hole in the circuit board. The through hole has an opening on the pad. The block contains a resin material and is located inside the heat-transfer layer to block the through hole.

Abstract translation: 根据一个实施例，电视设备包括电路板，垫，传热层和块。 电路板安装有电子元件。 焊盘设置在电路板的表面上。 传热层形成在电路板的通孔的内表面上。 通孔在垫上有一个开口。 该块包含树脂材料，并且位于传热层内部以阻挡通孔。

公开(公告)号：US20130194725A1

公开(公告)日：2013-08-01

申请号：US13878460

申请日：2011-10-20

Applicant: Manabu Ooishi ,  Maki Sugiura ,  Kazuhiro Yamamoto ,  Kenji Ogawa

Inventor： Manabu Ooishi ,  Maki Sugiura ,  Kazuhiro Yamamoto ,  Kenji Ogawa

IPC: H02B1/01

CPC classification number: H02B1/012 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/3447 ,  H05K3/44 ,  H05K7/026 ,  H05K2201/09663

Abstract: An electrical junction box for distributing electric power in a vehicle includes: a metal core substrate 1 provided with a core metal assembly having two core metal plates arranged with a gap, and an insulating layer embedded in the gap and covering surfaces of the metal core plates to integrate the metal core plates; and electronic components. Electric power from a battery is inputted into the core metal plate, and electric power from an alternator is inputted into the core metal plate. The electronic components are provided with a plurality of attaching portions soldered or screwed to the metal core substrate. At least one of the attaching portions is attached to the core metal plate, and at least one of the attaching portions is attached to the core metal plate.

Abstract translation: 一种用于在车辆中分配电力的电接线盒包括：金属芯基板1，其设置有具有间隙布置的两个芯金属板的芯金属组件，以及嵌入该间隙中的绝缘层和金属芯板的覆盖表面 整合金属芯板; 和电子元器件。 来自电池的电力被输入到芯金属板中，并且来自交流发电机的电力被输入到芯金属板中。 电子部件设置有多个焊接或螺纹连接到金属芯基板的附接部。 至少一个附着部分附着在芯金属板上，并且至少一个附接部分附着在芯金属板上。