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公开(公告)号：US20110253431A1
公开(公告)日：2011-10-20
申请号：US12801724
申请日：2010-06-22
Applicant: Hyung Wook Park , Young Chang Joo , Hong Seok Min , Young Gwan Ko , Chang Sup Ryu , Ho Young Lee , Shin Bok Lee , Min Suk Jung
Inventor： Hyung Wook Park , Young Chang Joo , Hong Seok Min , Young Gwan Ko , Chang Sup Ryu , Ho Young Lee , Shin Bok Lee , Min Suk Jung
CPC classification number: H05K3/244 , H05K2201/0338 , H05K2201/0769 , Y10T29/49126 , Y10T29/49155
Abstract: Disclosed herein are a printed circuit substrate and a method of manufacturing the same. The printed circuit substrate includes an insulating layer, and a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover at least one surface of the circuit pattern and suppresses electrochemical migration from the circuit pattern, thereby making it possible to achieve high-density and secure reliability, and the method of manufacturing the same.
Abstract translation: 这里公开了印刷电路基板及其制造方法。 印刷电路基板包括绝缘层和电路层，该电路层包括布置在绝缘层上的电路图案和阻挡层，该阻挡层设置成覆盖电路图案的至少一个表面并抑制电路从电路图案的电化学迁移，由此 使得可以实现高密度和可靠性的可靠性及其制造方法。
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公开(公告)号：US08030577B2
公开(公告)日：2011-10-04
申请号：US12146105
申请日：2008-06-25
Applicant: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
Inventor： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC: H05K1/09
CPC classification number: C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
Abstract translation: 本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。 本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。
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公开(公告)号：US08020291B2
公开(公告)日：2011-09-20
申请号：US12146165
申请日：2008-06-25
Applicant: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
Inventor： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
CPC classification number: C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
Abstract translation: 本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。 本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。
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公开(公告)号：US08006377B2
公开(公告)日：2011-08-30
申请号：US12146204
申请日：2008-06-25
Applicant: Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
Inventor： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
CPC classification number: C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
Abstract translation: 本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。 本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。
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公开(公告)号：US07972710B2
公开(公告)日：2011-07-05
申请号：US11891044
申请日：2007-08-08
Applicant: John Pereira
Inventor： John Pereira
CPC classification number: H01R43/0235 , B23K1/0008 , B23K2101/38 , B23K2103/10 , B23K2103/12 , H01R4/022 , H01R4/625 , H01R13/03 , H01R13/22 , H01R43/16 , H05B3/06 , H05B3/84 , H05K3/341 , H05K3/4015 , H05K2201/0338 , Y10S428/929 , Y10T29/49204 , Y10T29/49213 , Y10T428/12597 , Y10T428/12715 , Y10T428/1275 , Y10T428/24917
Abstract: An electrical connector including a base pad formed of aluminum and having a bottom surface. An electrical contact can be connected to the base pad. A layer of copper can be on the bottom surface of the base pad.
Abstract translation: 一种电连接器，包括由铝形成并具有底表面的基座。 电触点可以连接到基座。 一层铜可以在底座的底面上。
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Patent Agency Ranking
公开(公告)号：US07895741B2
公开(公告)日：2011-03-01
申请号：US12219599
申请日：2008-07-24
Applicant: Katsutoshi Kamei
Inventor： Katsutoshi Kamei
CPC classification number: H05K1/056 , G11B5/486 , H05K3/061 , H05K3/28 , H05K3/44 , H05K2201/0338 , H05K2201/09845 , H05K2201/0989 , H05K2203/0323 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49156 , Y10T29/49165 , Y10T29/4919
Abstract: A method of producing a wired circuit board includes preparing a metal supporting board, forming a metal foil on the metal supporting board, forming an insulating layer on the metal foil to expose an unneeded portion of the metal foil, etching the unneeded portion using the insulating layer as an etching resist, and forming a plurality of wires on the insulating layer.
Abstract translation: 布线电路板的制造方法包括：准备金属支撑板，在金属支撑板上形成金属箔，在金属箔上形成绝缘层，露出金属箔的不需要的部分，使用绝缘体 层作为抗蚀剂，并在绝缘层上形成多根导线。
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公开(公告)号：US20100186227A1
公开(公告)日：2010-07-29
申请号：US12662108
申请日：2010-03-31
Applicant: Jun ISHII , Yasunari OOYABU
Inventor： Jun ISHII , Yasunari OOYABU
IPC: H05K3/10
CPC classification number: H05K1/056 , G11B5/484 , G11B5/486 , H05K3/4641 , H05K3/4644 , H05K2201/0317 , H05K2201/0338 , Y10T29/49002 , Y10T29/4902 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.
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公开(公告)号：US20100164362A1
公开(公告)日：2010-07-01
申请号：US12600377
申请日：2008-05-14
Applicant: Takeshi Miyakawa , Kenji Miyata , Taiki Nishi , Yoshihiko Okajima
Inventor： Takeshi Miyakawa , Kenji Miyata , Taiki Nishi , Yoshihiko Okajima
CPC classification number: H05K1/0274 , H01L33/60 , H05K1/056 , H05K3/28 , H05K2201/0209 , H05K2201/0227 , H05K2201/0266 , H05K2201/0338 , H05K2201/09909 , H05K2201/10106 , H05K2201/2054
Abstract: Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.
Abstract translation: 提供除了用于安装电子部件的常规印刷电路板功能之外，还具有具有光反射的新功能的金属基底电路板。 金属基电路板具有通过绝缘层设置在金属板上的电路。 绝缘层至少布置有白色膜。
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公开(公告)号：US07723617B2
公开(公告)日：2010-05-25
申请号：US11892052
申请日：2007-08-20
Applicant: Jun Ishii , Yasunari Ooyabu
Inventor： Jun Ishii , Yasunari Ooyabu
IPC: H05K1/00
CPC classification number: H05K1/056 , G11B5/484 , G11B5/486 , H05K3/4641 , H05K3/4644 , H05K2201/0317 , H05K2201/0338 , Y10T29/49002 , Y10T29/4902 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.
Abstract translation: 布线电路板具有金属支撑板，金属箔形成在金属支撑板上以具有小于2.0μm的厚度，形成在金属支撑板上以覆盖金属箔的第一绝缘层和形成的导电图案 在第一绝缘层上。
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230.发明申请公开(公告)号：US20090226665A1
公开(公告)日：2009-09-10
申请号：US12045523
申请日：2008-03-10
Applicant: Patrick C. P. CHEUNG
Inventor： Patrick C. P. CHEUNG
CPC classification number: H05K3/4092 , H05K3/062 , H05K3/326 , H05K2201/0338 , H05K2201/0397 , H05K2201/10083 , H05K2203/1184 , Y10T428/24331
Abstract: A printed circuit board includes a multiple-layer electrical circuit board and a nickel arm, wherein the nickel arm has an unconnected end located opposite to the connected end of the nickel arm, wherein the nickel arm has a front side and a backside located opposite to the front side of the nickel arm, wherein the backside of the nickel arm is located adjacent to the multiple layer electrical circuit board. A dimple is formed at the unconnected end of the nickel arm and on the front side of the nickel arm. An air gap is formed between the backside of the arm and the multiple layer electrical circuit board, wherein the air gap permits the arm to flex within the air gap. A lead zirconium titanate element is laminated to the printed circuit board, wherein the dimple on the front side of the arm contacts a surface of the lead zirconium titanate element, wherein a restoring spring force of the nickel arm maintains electrical contactivity between the dimple and the lead zirconium titanate element.
Abstract translation: 印刷电路板包括多层电路板和镍臂，其中镍臂具有与镍臂的连接端相对的未连接端，其中镍臂具有正面和背面， 镍臂的前侧，其中镍臂的背面位于多层电路板附近。 在镍臂的未连接的端部和镍臂的前侧形成凹坑。 在臂的背面和多层电路板之间形成气隙，其中气隙允许臂在气隙内弯曲。 钛酸铅元素层压到印刷电路板上，其中臂的正面上的凹坑接触钛酸铅锆酸盐元件的表面，其中镍臂的恢复弹簧力保持凹坑和凹部之间的电接触性 锆钛酸铅元素。
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