公开(公告)号：US11744022B2

公开(公告)日：2023-08-29

申请号：US17536429

申请日：2021-11-29

Applicant: Kyocera AVX Components (San Diego), Inc.

Inventor： Seung Hyuk Choi ,  Hyun Jun Hong ,  Tae Wook Kim ,  Cheong Ho Ryu ,  Young Sang Kim ,  Sung Jun Kim

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  H05K3/42

CPC classification number: H05K3/0026 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/188 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0582 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.

公开(公告)号：US11689082B2

公开(公告)日：2023-06-27

申请号：US17885333

申请日：2022-08-10

Applicant: Black & Decker Inc.

Inventor： Madhur M. Purohit ,  Joshua M. Lewis ,  Marcell E. Coates ,  Michael D. Grove ,  Victor A. Dorado

IPC: H02K11/215 ,  B25F5/00 ,  H02K9/22 ,  H02K11/33 ,  B25F5/02 ,  H02K5/08 ,  H02K5/22 ,  H02K7/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K5/00 ,  H05K7/20 ,  H05K3/28 ,  H05K5/02 ,  H05K5/06 ,  H05K7/14 ,  H02K29/08

CPC classification number: H02K11/215 ,  B25F5/008 ,  B25F5/02 ,  H02K5/08 ,  H02K5/22 ,  H02K5/225 ,  H02K7/145 ,  H02K9/22 ,  H02K9/227 ,  H02K11/33 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/181 ,  H05K3/284 ,  H05K5/0073 ,  H05K5/0247 ,  H05K5/061 ,  H05K7/1427 ,  H05K7/209 ,  H05K7/2039 ,  H02K9/223 ,  H02K29/08 ,  H02K2203/03 ,  H02K2211/03 ,  H05K5/0086 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: A power tool including an electric motor is provided. The tool includes a substantially disc-shaped printed circuit board (PCB), power switches mounted on the PCB; magnetic sensors mounted on the PCB facing the motor; a heat sink in thermal communication with the power switches disposed between the PCB and the electric motor; and a molded casing structurally securing the heat sink relative to the PCB. The molded casing includes a center opening, at least one first opening provided at a first radial distance from the center opening arranged to receive the magnetic sensors therein, and at least one second opening provided at a second radial distance from the center opening arranged to securely receive the heat sink therein.

公开(公告)号：US20230199961A1

公开(公告)日：2023-06-22

申请号：US17702814

申请日：2022-03-24

Applicant: Industrial Technology Research Institute

Inventor： Yu-Lin Hsu ,  Kuan-Chu Wu ,  Ting-Yu Ke ,  Min-Hsiung Liang ,  Yu-Ming Peng

IPC: H05K1/11 ,  H01L23/538 ,  H01L23/13 ,  H05K3/00 ,  H01L21/48

CPC classification number: H05K1/119 ,  H01L23/5386 ,  H01L23/13 ,  H05K3/0014 ,  H01L21/4846 ,  H05K2201/09018 ,  H05K2201/09118 ,  H01L23/3121

Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.

公开(公告)号：US20180310366A1

公开(公告)日：2018-10-25

申请号：US15767745

申请日：2016-09-01

Applicant: EXATEC, LLC

Inventor： Mark Kevin Nelson ,  Stephen Shuler ,  Richard Schouwenaar

IPC: H05B3/84 ,  B41M5/00 ,  B41M1/12 ,  H05K3/12 ,  H05K1/02 ,  H05K1/09 ,  C09D11/52

CPC classification number: H05B3/84 ,  B41M1/12 ,  B41M1/30 ,  B41M1/34 ,  B41M5/0023 ,  B41M5/0047 ,  B41M5/0064 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H01B1/22 ,  H05K1/0212 ,  H05K1/0284 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/125 ,  H05K3/1283 ,  H05K2201/09018 ,  H05K2201/10098 ,  H05K2201/10272 ,  H05K2203/013 ,  H05K2203/0139

Abstract: In an embodiment, a printing method for forming a conductive line on a plastic substrate for use in an automobile, comprises one or both of inkjet printing and screen printing the conductive line on the plastic substrate while the plastic substrate is fixed in a fixture of an automatic printing machine; the conductive mixture comprises a conductive paste; a solvent; and an adhesion agent; and wherein the conductive line is a busbar, a grid line, or an antenna line in the automobile.

公开(公告)号：US10064303B2

公开(公告)日：2018-08-28

申请号：US14282248

申请日：2014-05-20

Applicant: The Boeing Company

Inventor： Hardik Dalal ,  Jeffrey Lynn Duce ,  Yelina Rosillo ,  Brent A. Robbins ,  Breana K. Merriweather

IPC: H05K7/06 ,  C23C4/08 ,  H05K1/02 ,  B64D45/00 ,  C23C4/01 ,  C23C4/134 ,  H05K3/14 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K7/06 ,  B64D45/00 ,  B64F5/00 ,  C23C4/01 ,  C23C4/08 ,  C23C4/134 ,  H05K1/0284 ,  H05K3/14 ,  H05K3/388 ,  H05K3/4673 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2203/0528 ,  H05K2203/095 ,  H05K2203/1344

Abstract: A method for manufacturing a composite part. Layers of composite material are cured to form the composite part. A primer is depicted on a surface of the composite part. A group of conductive elements is deposited on the primer to form an electronic device on the primer.

公开(公告)号：US10021778B2

公开(公告)日：2018-07-10

申请号：US14851795

申请日：2015-09-11

Applicant: AU OPTRONICS CORPORATION

Inventor： Ming-Sheng Lai ,  Pei-Ling Chiang

IPC: G02F1/1333 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A display module includes a display panel which includes a substrate and a periphery circuit. The substrate has a display area and a strip region beside the display area. The substrate is bent with respect to an axis to form a curved shape. The maximum value of the curvature of the display area in a direction perpendicular to the axis is a first curvature. The periphery circuit is disposed on the strip region. The strip region in a direction perpendicular to the axis has a second curvature smaller than the first curvature.

公开(公告)号：US20180097283A1

公开(公告)日：2018-04-05

申请号：US15567817

申请日：2015-11-09

Applicant: HANSOL TECHNICS INC.

Inventor： Jae-Ho BOO ,  Chi-Young CHOI

IPC: H01Q1/38 ,  H01Q1/24 ,  H05K1/03 ,  H05K3/06 ,  H05K3/22 ,  H05K3/40

CPC classification number: H01Q1/38 ,  H01Q1/243 ,  H05K1/032 ,  H05K1/119 ,  H05K3/0014 ,  H05K3/06 ,  H05K3/22 ,  H05K3/4038 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09018 ,  H05K2203/0759

Abstract: Provided is a curved-type rigid board. The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; and a pattern forming layer bonded onto the main sheet layer by the first adhesive layer.

公开(公告)号：US20180092180A1

公开(公告)日：2018-03-29

申请号：US15718111

申请日：2017-09-28

Applicant: VALEO VISION

Inventor： Vincent GODBILLON ,  Patrice COLLOT ,  Franck MILLON ,  Jean-Didier KINFACK ,  Lothar SEIF ,  Arnaud ABALA ,  Lingxuan ZHU ,  Natacha AUDY

IPC: H05B33/08 ,  F21S8/10

CPC classification number: H05B33/0845 ,  B60Q1/1407 ,  B60Q1/18 ,  B60Q1/20 ,  B60Q1/32 ,  B60Q3/80 ,  B60Q2400/30 ,  F21S41/147 ,  F21S41/153 ,  F21S41/19 ,  F21S41/28 ,  F21S41/285 ,  F21S41/663 ,  F21S43/14 ,  F21S43/15 ,  F21S43/19 ,  F21S43/195 ,  F21S43/26 ,  F21W2102/13 ,  F21W2102/30 ,  F21W2103/10 ,  F21W2103/35 ,  F21W2103/55 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: A light emission module, in particular for a motor vehicle. The module includes a substrate comprising a curved main portion extending in a longitudinal direction. A plurality of electroluminescent elements is arranged on the substrate and configured to emit light rays when supplied with electrical energy. The electroluminescent elements are distributed along tje longitudinal direction, and a control assembly suitable for regulating the electrical energy supplied to the electroluminescent elements. The control assembly has a mode of operation in which the control assembly is configured to supply the electroluminescent elements with respective electrical energies and/or powers determined at least as a function of respective main directions of light emission of the electroluminescent elements to obtain at least two maximum light intensities emitted by the electroluminescent elements in the corresponding main direction of emission which are different along the longitudinal direction of the substrate.

公开(公告)号：US20170359865A1

公开(公告)日：2017-12-14

申请号：US15477389

申请日：2017-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-min KIM ,  Ho-seong SHIN ,  Kyoung-hwan JANG

IPC: H05B33/04 ,  H05K1/18 ,  H05B33/12 ,  H05B33/10 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05B33/04 ,  H05B33/10 ,  H05B33/12 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/007 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

公开(公告)号：US20170252143A1

公开(公告)日：2017-09-07

申请号：US15451536

申请日：2017-03-07

Applicant: Wittenstein SE

Inventor： Michael Matthes ,  Sebastian Hammel

IPC: A61F2/02 ,  H01F38/14 ,  H02J50/10

CPC classification number: A61F2/02 ,  A61N1/37229 ,  H01F38/14 ,  H02J50/10 ,  H05K1/165 ,  H05K2201/09018 ,  H05K2201/09045

Abstract: Receiver (1), in particular an implantable receiver (1) for transmitting energy to an implant, with a multi-layer circuit board comprising a plurality of electrically conductive layers (11-16), wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, a coil which is integrally incorporated at least partially in the layers (11-16) of the circuit board in the coil area, wherein the number of the layers (11-16) of the circuit board is smaller within this inner area than in the coil area.