CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20240199817A1

    公开(公告)日:2024-06-20

    申请号:US18285897

    申请日:2022-03-31

    Abstract: Provided is a curable organopolysiloxane composition that is in the form of a grease before curing, has an excellent workability and heat dissipation effect, and is capable of being turned into a cured product exhibiting no cracks and voids at the time of curing. The composition contains:



    (A) organopolysiloxanes (A-1) and (A-2) each having at least two silicon atom-bonded alkenyl groups per molecule, and exhibiting different viscosities which are 0.01 to 10 Pa·s for (A-1), and 11 to 1,000 Pa·s for (A-2);
    (B) an organohydrogenpolysiloxane;
    (C) gallium and/or gallium alloy(s) that have melting points of −20 to 70° C.;
    (D) a thermally conductive filler;
    (E) a platinum group metal catalyst; and
    (G-1) an organopolysiloxane represented by the following general formula (1),








    wherein R1s represent alkyl groups, R2 represents an alkyl group, a is an integer of 5 to 100, b is an integer of 1 to 3.

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