公开(公告)号：US20100071946A1

公开(公告)日：2010-03-25

申请号：US12561526

申请日：2009-09-17

Applicant: Nobuaki HASHIMOTO

Inventor： Nobuaki HASHIMOTO

IPC: H05K1/16 ,  H05K1/02

CPC classification number: H05K3/305 ,  G02F1/13458 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02373 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/0331 ,  H01L2224/0332 ,  H01L2224/03515 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/03831 ,  H01L2224/0519 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/0569 ,  H01L2224/05691 ,  H01L2224/061 ,  H01L2224/06155 ,  H01L2224/06505 ,  H01L2224/08058 ,  H01L2224/08238 ,  H01L2224/09055 ,  H01L2224/2731 ,  H01L2224/2732 ,  H01L2224/27515 ,  H01L2224/2761 ,  H01L2224/27825 ,  H01L2224/27831 ,  H01L2224/29008 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29017 ,  H01L2224/29023 ,  H01L2224/29082 ,  H01L2224/29101 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29563 ,  H01L2224/2957 ,  H01L2224/29582 ,  H01L2224/29624 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/29664 ,  H01L2224/29666 ,  H01L2224/29671 ,  H01L2224/29684 ,  H01L2224/301 ,  H01L2224/30155 ,  H01L2224/30505 ,  H01L2224/32058 ,  H01L2224/32238 ,  H01L2224/33055 ,  H01L2224/80194 ,  H01L2224/80203 ,  H01L2224/80385 ,  H01L2224/80424 ,  H01L2224/80444 ,  H01L2224/80447 ,  H01L2224/80488 ,  H01L2224/8085 ,  H01L2224/80862 ,  H01L2224/8088 ,  H01L2224/80902 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/834 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83902 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/00 ,  H01L2924/01022 ,  H01L2924/01028

Abstract: An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.

Abstract translation: 电子部件安装结构包括：电子部件，包括多个突起电极，所述突起电极包括设置在所述电子部件的有效面上的基体树脂和覆盖所述基础树脂的表面的一部分的多个导电膜， 并且电耦合到设置在有源面上的多个电极端子; 以及包括多个端子的基板。 在该结构中，电子部件安装在基板上，基体树脂包括：围绕多个电极端子的第一开口; 所述多个导电膜的一端的一部分被设置在所述基体树脂的表面上的连接部，所述导电膜的另一端与所述电极端子连接; 以及接合部，其接合到所述基板，并且形成在除了所述第一开口和所述连接部之外的区域中，并且所述基部树脂在所述连接部处的弹性变形使得所述接合部分接合所述基板以便保持 导电膜和处于接合状态的基板上的多个端子。

公开(公告)号：US20100052153A1

公开(公告)日：2010-03-04

申请号：US12512277

申请日：2009-07-30

Applicant: Naoyuki Koizumi ,  Akihiko Tateiwa

Inventor： Naoyuki Koizumi ,  Akihiko Tateiwa

IPC: H01L23/538 ,  H01L21/50

CPC classification number: H05K3/284 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/4682 ,  H05K2201/091 ,  H05K2201/10318 ,  H05K2201/10977 ,  H01L2224/0401

Abstract: A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin is provided and having a projection-shaped resin portion which projects locally around the lead pin and covers a side surface of a base portion side of the lead pin. The projection-shaped resin portion has a top surface extending from an outer peripheral portion of the lead pin to an outside, and a side surface constituting a non-identical surface to the top surface.

Abstract translation: 本发明的半导体封装包括布线基板，通过焊料固定在布线基板的一个表面侧的连接焊盘的引线引脚，以及形成在布线基板的表面上的强化树脂层，引线引脚 并且具有突出形状的树脂部分，其突出在引线销周围局部，并且覆盖引脚的基部侧的侧表面。 突起状树脂部分具有从引脚的外周部分延伸到外部的顶表面和与顶表面构成不相同表面的侧表面。

公开(公告)号：US07660126B2

公开(公告)日：2010-02-09

申请号：US11107979

申请日：2005-04-18

Applicant: Jin-woo Cho ,  Seong-woon Booh ,  Dong-woo Lee ,  Ki-taek Kim ,  Yun-mi Seo ,  Dong-ok Kwak

Inventor： Jin-woo Cho ,  Seong-woon Booh ,  Dong-woo Lee ,  Ki-taek Kim ,  Yun-mi Seo ,  Dong-ok Kwak

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H01R35/02 ,  H05K2201/091

Abstract: A flexible printed circuit board is robust to a repeated twisting and consists of a minute circuit printed on a flexible insulated material sheet, and has the bent parts of the opposite edges symmetrical in structure. The bent parts are straightened out when twisting occurs. In the flexible printed circuit board, the opposite edges are longer in length than the middle part such that the tensile deformation at the opposite edges at the time of twisting does not occur or is minimized.

Abstract translation: 柔性印刷电路板对于重复的扭转是坚固的，并且由打印在柔性绝缘材料片上的微小电路组成，并且相对边缘的弯曲部分在结构上对称。 弯曲部分在发生扭曲时被拉直。 在柔性印刷电路板中，相对边缘的长度比中间部分长，使得扭曲时的相对边缘处的拉伸变形不发生或最小化。

公开(公告)号：US07624502B2

公开(公告)日：2009-12-01

申请号：US10546730

申请日：2005-01-21

Applicant: Toshihiro Nishii

Inventor： Toshihiro Nishii

IPC: H01K3/10 ,  B32B37/00 ,  H01R12/04

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract translation: 导电部分形成在材料片中形成的孔中。 将金属箔放置在材料片的表面上以提供层压片。 将层压片材加热并加压以提供电路形成板。 金属箔包括压力吸收部分和与压力吸收部分相邻的硬部分。 压力吸收部的厚度根据施加到其上的压力而变化。 通过该方法提供的电路形成板提供了具有可靠的电连接的高质量的高密度电路板。

公开(公告)号：US07593085B2

公开(公告)日：2009-09-22

申请号：US11383622

申请日：2006-05-16

Applicant: Kenichi Watanabe ,  Hiroshi Ueda ,  Hiroshi Tachibana ,  Shigeaki Noumi

Inventor： Kenichi Watanabe ,  Hiroshi Ueda ,  Hiroshi Tachibana ,  Shigeaki Noumi

IPC: G02F1/1345

CPC classification number: H01R12/62 ,  G02F1/13452 ,  G02F2001/133388 ,  H01R4/04 ,  H01R12/7076 ,  H05K1/117 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/091 ,  H05K2201/09145

Abstract: The present invention provides a flexible printed circuit that is less likely to suffer from erosion (corrosion) of electrode terminals even in severe environments and a display device using the flexible printed circuit. According to the present invention, a flexible printed circuit includes a flexible FPC film, FPC interconnections formed of a given pattern on the FPC film, a solder resist covering the FPC interconnections, and FPC terminals provided at ends of the FPC interconnections to make external connection. According to the invention, the FPC terminals include at least one terminal that has an end located inside of an outline of the FPC film.

Abstract translation: 本发明提供一种柔性印刷电路，其即使在恶劣的环境中也不太可能遭受电极端子的腐蚀（腐蚀），并且使用柔性印刷电路的显示装置。 根据本发明，柔性印刷电路包括柔性FPC膜，FPC膜上的给定图案形成的FPC互连，覆盖FPC互连的阻焊剂和设置在FPC互连端部的FPC端子，以进行外部连接 。 根据本发明，FPC端子包括至少一个终端，其端部位于FPC膜的轮廓内部。

公开(公告)号：US20090218117A1

公开(公告)日：2009-09-03

申请号：US12291892

申请日：2008-11-14

Applicant: Nobuyuki Sakai

Inventor： Nobuyuki Sakai

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K3/0061 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/005 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/44 ,  H05K2201/091 ,  H05K2201/09554 ,  H05K2203/063 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.

Abstract translation: 单面FPC的绝缘基底侧向模具侧转动，接地电路的安装面侧向上侧转动，将FPC放置在模具（a）上。 当实现导通的接地电路的部分和金属加强板用冲孔冲压成冲孔材料厚度的50％至95％时，将形成孔下垂（b） 。 将绝缘基体1侧翻转，依次层压导电性粘合剂和金属加强板，用层叠（c）的金属加强板用加压装置进行加压加压。 由此形成层叠FPC（d）。 此时，由于通过压制将导电性粘合剂注入到孔下垂中，所以可以通过导电性粘合剂进行层间导电，可以实现金属加强板与接地电路的电连接，也不会有残留空气。

公开(公告)号：US20090199400A1

公开(公告)日：2009-08-13

申请号：US12385693

申请日：2009-04-16

Applicant: Masashi Yamasaki ,  Mutsumi Yoshino

Inventor： Masashi Yamasaki ,  Mutsumi Yoshino

IPC: H05K3/34

CPC classification number: H05K7/142 ,  H05K3/202 ,  H05K3/341 ,  H05K2201/091 ,  H05K2201/10598 ,  H05K2203/175 ,  Y10T29/49144

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract translation: 电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。 布线板固定在柱状部分上，使得布线电路与基部间隔开。 布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。 布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。 电子器件在热回流工艺中立即焊接到布线板上。

公开(公告)号：US07572500B2

公开(公告)日：2009-08-11

申请号：US11882396

申请日：2007-08-01

Applicant: Toshihiro Nishii

Inventor： Toshihiro Nishii

IPC: H01K1/00

CPC classification number: H05K3/4069 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0382 ,  H05K2201/091 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Abstract translation: 导电部分形成在材料片中形成的孔中。 将金属箔放置在材料片的表面上以提供层压片。 将层压片材加热并加压以提供电路形成板。 金属箔包括压力吸收部分和与压力吸收部分相邻的硬部分。 压力吸收部的厚度根据施加到其上的压力而变化。 通过该方法提供的电路形成板提供了具有可靠的电连接的高质量的高密度电路板。

公开(公告)号：US20090170243A1

公开(公告)日：2009-07-02

申请号：US12402267

申请日：2009-03-11

Applicant: James Douglas Wehrly, JR.

Inventor： James Douglas Wehrly, JR.

IPC: H01L21/98

CPC classification number: H05K1/189 ,  H01L23/13 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/147 ,  H05K1/182 ,  H05K3/326 ,  H05K2201/056 ,  H05K2201/091 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The present invention provides an improvement on the use of flexible circuit connectors for electrically coupling IC devices to one another in a stacked configuration by use of the flexible circuit to provide the connection of the stacked IC module to other circuits. Use of the flexible circuit as the connection of the IC module allows the flexible circuit to provide strain relief and allows stacked IC modules to be assembled with a lower profile than with previous methods. The IC module can be connected to external circuits through the flexible circuit connectors by a variety of means, including solder pads, edge connector pads, and socket connectors. This allows for IC devices to occupy less space then with previous methods, which is beneficial in modules such as memory modules with multiple, stacked memory devices.

Abstract translation: 本发明提供了使用柔性电路连接器来改进使用柔性电路将叠层IC模块连接到其它电路的层叠结构中的IC器件彼此电连接的柔性电路连接器。 使用柔性电路作为IC模块的连接允许柔性电路提供应变消除，并允许堆叠的IC模块以比以前的方法更低的轮廓组装。 IC模块可以通过各种方式通过柔性电路连接器连接到外部电路，包括焊盘，边缘连接器焊盘和插座连接器。 这允许IC器件占用较少的空间，然后使用先前的方法，这在诸如具有多个堆叠的存储器件的存储器模块的模块中是有益的。

公开(公告)号：US07540596B2

公开(公告)日：2009-06-02

申请号：US11113576

申请日：2005-04-25

Applicant: Shuhei Hiwada

Inventor： Shuhei Hiwada

IPC: B41J2/05 ,  B41J2/045

CPC classification number: B41J2/14209 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K3/0058 ,  H05K3/321 ,  H05K3/361 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/10977 ,  H05K2203/0195

Abstract: There is disclosed an electric device comprising: an actuator unit which includes a plurality of electrodes formed thereon; a printed wiring board which comprises: an electrically insulating flexible layer which has on one of its opposite sides protrusions for the respective electrodes, each of the protrusions forming a corresponding recess on the other side of the flexible layer; and a plurality of electrically conducting layers disposed on the respective protrusions to be in contact with the respectively corresponding electrodes; and a plurality of bonding parts each of which is in contact with one of the conducting layers and a corresponding one of the electrodes to completely cover a contact portion between the conducting layer and the electrode so as to maintain the contact therebetween.

Abstract translation: 公开了一种电气装置，包括：致动器单元，其包括形成在其上的多个电极; 一种印刷线路板，包括：电绝缘柔性层，其在相对侧的一个上相对于各个电极具有突起，每个突起在柔性层的另一侧上形成相应的凹部; 以及多个导电层，设置在各个突起上以与相应的电极接触; 以及多个接合部，其各自与导电层中的一个和相应的一个电极接触，以完全覆盖导电层和电极之间的接触部分，从而保持它们之间的接触。