公开(公告)号：US06917299B2

公开(公告)日：2005-07-12

申请号：US10377188

申请日：2003-02-28

Applicant: Shuzhen Fu ,  David C. Hanley ,  Raymond A. DeBruin ,  Jack R. Grenfell

Inventor： Shuzhen Fu ,  David C. Hanley ,  Raymond A. DeBruin ,  Jack R. Grenfell

IPC: G06F1/00 ,  G06F21/00 ,  G07F7/10 ,  G08B21/00

CPC classification number: G07F7/1008 ,  G06F21/86 ,  G06F2221/2143 ,  G06Q20/341 ,  G07F7/082 ,  H01H2239/032 ,  H05K1/0275 ,  H05K1/144 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y04S40/24

Abstract: A security system for electronic circuits (e.g. electronic circuits contained within a secure POS terminal) is provided that is both more tamper resistant, and tamper responsive and less expensive than the prior art epoxy potting. This is achieved by inserting an electrical connector between a first and a second circuit board contained within a case of the POS terminal. The first and the second circuit boards are any type of circuit board known in the art, including both not limited to, rigid circuit boards, flexible circuit boards, printed circuit boards, etc. If the case is opened the connector no longer provides an electrical connection between the first and the second circuit boards, triggering a tamper detection circuit. In some embodiments of the invention, a flexible conductive film is wrapped around the circuit boards and the connector. If a tamperer attempts to penetrate the case of the POS terminal to disable the tamper detection circuit, the circuit on the flexible security film is interrupted, in turn triggering the tamper detection circuit. As a result, the secure POS terminal of the present invention overcomes the limitations of prior art potted terminals. By eliminating the potting process, in fact, the cost of manufacturing the terminal is reduced and there is no need for a special ventilation system. In addition, the circuitry within the terminal can be accessed for repair and maintenance purposes.

Abstract translation: 提供了一种用于电子电路（例如，包含在安全POS终端内的电子电路）的安全系统，其比现有技术的环氧树脂灌封更具抗篡改性和防篡改响应性并且便宜。 这通过在包含在POS终端的壳体内的第一和第二电路板之间插入电连接器来实​​现。 第一和第二电路板是本领域已知的任何类型的电路板，包括但不限于刚性电路板，柔性电路板，印刷电路板等。如果壳体被打开，连接器不再提供电气 第一和第二电路板之间的连接，触发篡改检测电路。 在本发明的一些实施例中，柔性导电膜缠绕在电路板和连接器周围。 如果打印机尝试渗透POS终端的情况以禁用篡改检测电路，则柔性安全膜上的电路被中断，从而触发篡改检测电路。 结果，本发明的安全POS终端克服了现有技术的封装终端的限制。 通过消除灌封过程，实际上降低了终端制造成本，不需要特殊的通风系统。 此外，可以访问终端内的电路以进行维修和维护。

公开(公告)号：US20050070163A1

公开(公告)日：2005-03-31

申请号：US10892880

申请日：2004-07-15

Applicant: Frank Redmond ,  Frank Redmond

Inventor： Frank Redmond ,  Frank Redmond

IPC: H01R13/514 ,  H05K1/14 ,  H01R13/66

CPC classification number: H05K1/142 ,  H01R13/514 ,  H05K2201/09963 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10S439/928

Abstract: A circuit comprises a first circuit portion that includes an electrically insulative first body having a first connector and a first circuit element coupled to the first body. The circuit further comprises a second circuit portion that includes an electrically insulative second body having a second connector coupled to the first connector and a second circuit element coupled to the second body. The circuit further comprises a first electrical conductor coupled to the first and second circuit elements.

Abstract translation: 电路包括第一电路部分，其包括具有第一连接器的电绝缘的第一主体和耦合到第一主体的第一电路元件。 电路还包括第二电路部分，其包括电绝缘的第二主体，其具有耦合到第一连接器的第二连接器和耦合到第二主体的第二电路元件。 电路还包括耦合到第一和第二电路元件的第一电导体。

公开(公告)号：US20050015976A1

公开(公告)日：2005-01-27

申请号：US10861256

申请日：2004-06-04

Applicant: Koji Hirano

Inventor： Koji Hirano

IPC: G02F1/1345 ,  G09F9/00 ,  H05K1/14 ,  H05K3/28 ,  H05K3/36 ,  H05K3/30 ,  H01R12/24

CPC classification number: H05K3/361 ,  H05K3/284 ,  H05K2201/10136 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/0126 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: The present invention discloses a method for reinforcing the connection between a wire formed on a substrate and a flat cable member with a reinforcing material. The method includes the step of supplying fluid and the step of hardening the fluid to form the reinforcing material. The step of supplying the fluid includes the step of bringing the substrate connecting to the flat cable member close to a jig and then supplying the fluid to a region in which the reinforcing material is to be formed while preventing the outflow of the fluid with the jig.

Abstract translation: 本发明公开了一种用于加强形成在基底上的线与具有增强材料的扁平电缆部件之间的连接的方法。 该方法包括供给流体的步骤和使流体硬化以形成增强材料的步骤。 供给流体的步骤包括使连接到扁平电缆部件的基板靠近夹具的步骤，然后将流体供给到要形成增强材料的区域，同时防止流体与夹具流出 。

公开(公告)号：US06727718B2

公开(公告)日：2004-04-27

申请号：US10298640

申请日：2002-11-19

Applicant: Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

Inventor： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

IPC: G01R3126

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

Abstract translation: 一种球栅阵列（BGA）电子部件封装，其具有能够提高安装效率以及防止在电子部件封装的电路连接部分处的占用空隙的构造。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。 因此，即使在BGA封装的外部或周边部分对BGA封装施加冲击，对于这种冲击最为敏感，冲击也被不受电连接的加强凸起和加强覆盖物吸收 电子部件封装的电路。 因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。

公开(公告)号：US06710256B2

公开(公告)日：2004-03-23

申请号：US09957432

申请日：2001-09-20

Applicant: Kenichi Kato ,  Hiroaki Ugawa ,  Toshiki Kita

Inventor： Kenichi Kato ,  Hiroaki Ugawa ,  Toshiki Kita

IPC: H05K103

CPC classification number: H01R12/62 ,  H01R13/2414 ,  H05K1/0219 ,  H05K3/365 ,  H05K3/368 ,  H05K2201/056 ,  H05K2201/2018

Abstract: An apparatus and a method for connecting high-frequency circuit boards, and for providing an electrical connection between respective electrodes of two high-frequency circuit boards includes an electrode connecting member including a bar-shaped member having a predetermined sectional shape, and having connecting electrodes formed on a part of an outer periphery of the bar-shaped member. The connecting electrodes are located so as to provide an inter-connection between the respective electrodes of the two high-frequency circuit boards through the connecting electrodes and to be sandwiched between the respective electrodes thereof. The connecting electrodes are preferably composed of a plurality of electrode lines formed so as to be spaced at a predetermined interval on the outer periphery of the bar-shaped member.

Abstract translation: 一种用于连接高频电路板并且用于在两个高频电路板的各个电极之间提供电连接的装置和方法包括：电极连接构件，其包括具有预定截面形状的棒状构件，并具有连接电极 形成在棒状构件的外周的一部分上。 连接电极被定位成通过连接电极提供两个高频电路板的各个电极之间的相互连接，并且夹在其各自的电极之间。 连接电极优选由在棒状部件的外周隔开规定间隔而形成的多个电极线构成。

公开(公告)号：US20040053489A1

公开(公告)日：2004-03-18

申请号：US10454530

申请日：2003-06-05

Applicant: NGK SPARK PLUG CO., LTD. ,  NEC ELECTRONICS CORPORATION

Inventor： Keiichiro Kata ,  Hirokazu Honda ,  Kazuhiro Baba ,  Tadanori Shimoto ,  Katsumi Kikuchi ,  Rokuro Kambe ,  Satoshi Hirano ,  Shinya Miyamoto

IPC: H01L021/4763

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2924/19041 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4682 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376

Abstract: A method of producing a multilayer wiring substrate is disclosed. The multilayer wiring substrate is free from a core substrate and includes a build up layer which includes an insulator layer and a wiring layer. One of a first main surface and a second main surface of the build up layer is formed with a metal supporting frame body. The method includes the steps of: forming a first insulator layer on a first main surface of a metal supporting plate, where the first insulator layer is included in the insulator layer and becomes a first resist layer which is positioned on the first main surface's side of the build up layer, and forming a first metal pad layer in a given position on a first main surface of the first insulator layer, where the first metal pad layer is included in the wiring layer and becomes a metal pad layer.

Abstract translation: 公开了一种制造多层布线基板的方法。 多层布线基板不含芯基板，并且包括包含绝缘体层和布线层的堆积层。 构建层的第一主表面和第二主表面之一形成有金属支撑框体。 该方法包括以下步骤：在金属支撑板的第一主表面上形成第一绝缘体层，其中第一绝缘体层包含在绝缘体层中，并成为位于第一绝缘体层的第一主表面侧的第一抗蚀剂层 并且在第一绝缘体层的第一主表面上的给定位置形成第一金属焊盘层，其中第一金属焊盘层包括在布线层中并且变成金属焊盘层。

公开(公告)号：US06700074B2

公开(公告)日：2004-03-02

申请号：US10012796

申请日：2001-10-19

Applicant: Kurt Michel ,  Stefan Ehmann ,  Roland Friedl ,  Günter Bauer

Inventor： Kurt Michel ,  Stefan Ehmann ,  Roland Friedl ,  Günter Bauer

IPC: H05K116

CPC classification number: H05K3/0064 ,  H05K1/141 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/09127 ,  H05K2201/10598 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1327 ,  H05K2203/167 ,  H05K2203/302

Abstract: The invention provides a carrier housing assembly holding a flexible foil having conductive tracks in which the housing assembly has a plurality of parts each having a respective securing mechanism, the securing mechanisms being mutually engageable to provide a predetermined spatial relationship between the part, thereby providing the flexible foil with a predetermined spatial arrangement. The housing assembly is particularly relevant to component housing assemblies where electrical components are held in place and connected to connecter pins via the flexible foil. In a further aspect of the invention, there is provided methods for manufacturing a foil carrier housing assembly out of a flexible foil comprising conductive tracks at least one electrical component, at least one electrical contact element, at least one component housing and a carrier housing.

Abstract translation: 本发明提供一种承载壳体组件，其保持具有导电轨道的柔性箔，其中壳体组件具有多个部件，每个部件各自具有相应的固定机构，所述固定机构可相互接合以在部件之间提供预定的空间关系， 具有预定空间布置的柔性箔。 壳体组件与部件壳体组件特别相关，其中电气部件保持就位并通过柔性箔片连接到连接器销。 在本发明的另一方面，提供了用于从柔性箔制造箔载体壳体组件的方法，所述柔性箔包括至少一个电气部件，至少一个电接触元件，至少一个部件壳体和载体壳体的导电轨道。

公开(公告)号：US06661163B2

公开(公告)日：2003-12-09

申请号：US10137327

申请日：2002-05-03

Applicant: Hyung Kon Kim

Inventor： Hyung Kon Kim

IPC: H01L41053

CPC classification number: H05K1/141 ,  H03H3/04 ,  H03H9/08 ,  H05K1/0201 ,  H05K2201/049 ,  H05K2201/10075 ,  H05K2201/10515 ,  H05K2201/2018

Abstract: A temperature compensated crystal oscillator is manufactured by placing a ring-shaped board on a main board to surround compensating components on the main board, and placing a crystal package on the ring-shaped board. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of a rectangular ring-shaped board.

Abstract translation: 温度补偿晶体振荡器是通过在主板上放置环形板来围绕主板上的补偿元件并将晶体封装放在环形板上来制造的。 主板上的部件安装区域减少，从而减小产品尺寸。 至少一个导电垫可以附接到环形板以将晶体封装连接到主板上的某个电路。 导电焊盘可以设置在矩形环形板的四个角中的每一个处。

公开(公告)号：US20030220129A1

公开(公告)日：2003-11-27

申请号：US10445087

申请日：2003-05-20

Applicant: BENQ CORPORATION

Inventor： Long-Jyh Pan ,  Hsiao-Wu Chen

IPC: H04M001/00

CPC classification number: H04M1/0277 ,  H04B15/02 ,  H05K1/144 ,  H05K2201/0715 ,  H05K2201/10689 ,  H05K2201/2018

Abstract: A mobile phone with a dual PCB structure. The mobile phone includes a first PCB with electronic elements disposed thereon. A conductive enclosure is disposed on the first printed circuit board. A second printed circuit board has a plurality of layers and contacts the conductive enclosure. The first printed circuit board, the conductive enclosure and the second printed circuit board form a closed space within which the electronic elements are disposed. The first layer next to the conductive enclosure is an exposed copper layer grounded to protect the electronic elements from EMI.

Abstract translation: 具有双PCB结构的手机。 移动电话包括其上设置有电子元件的第一PCB。 导电外壳设置在第一印刷电路板上。 第二印刷电路板具有多个层并且与导电外壳接触。 第一印刷电路板，导电外壳和第二印刷电路板形成封闭空间，电子元件设置在该封闭空间内。 导电外壳旁边的第一层是暴露的铜层，接地以保护电子元件免受EMI干扰。

公开(公告)号：US06634100B2

公开(公告)日：2003-10-21

申请号：US09843119

申请日：2001-04-26

Applicant: Salman Akram ,  Alan G. Wood ,  Warren M. Farnworth

Inventor： Salman Akram ,  Alan G. Wood ,  Warren M. Farnworth

IPC: H01R4316

CPC classification number: H05K7/1061 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/07378 ,  G01R3/00 ,  H01L23/32 ,  H01L23/49827 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Methods for fabricating an interposer, wherein the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of interposer substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the interposer substrates need not be precisely mechanically aligned.

Abstract translation: 用于制造插入件的方法，其中所述栅栏包括使用立体光刻和成型工艺。 当使用立体光刻制造栅栏时，可以使用包括与计算机可操作地相关联的至少一个照相机的机器视觉系统来控制立体光刻设备并且有助于识别材料在其上和周围的插入物基板的位置和取向 应用于一层或多层以形成栅栏。 结果，内插器基板不需要精确地机械对准。