公开(公告)号：US20030209954A1

公开(公告)日：2003-11-13

申请号：US10460315

申请日：2003-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroaki Kaida

IPC: H01L041/053

CPC classification number: H03H9/0509 ,  H01L41/053 ,  H03H9/1014 ,  H05K1/111 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes a case substrate. Substrate electrodes having a substantially spherical outer surface are disposed on at least a first principal surface of the case substrate. A piezoelectric resonator is mounted on the case substrate such that the piezoelectric resonator is bonded to the outer surfaces of the substrate electrodes by a conductive bonding material and is supported by the substrate electrodes in a point-contact manner. Also, the formula, Lknull2We

公开(公告)号：US06641406B1

公开(公告)日：2003-11-04

申请号：US09705368

申请日：2000-11-03

Applicant: Alexander I. Yatskov ,  Stephen V. R. Hellriegel

Inventor： Alexander I. Yatskov ,  Stephen V. R. Hellriegel

IPC: H01R1200

CPC classification number: H01R12/62 ,  H05K1/11 ,  H05K3/243 ,  H05K3/28 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0949

Abstract: The flexible connector for high density circuit applications comprises a multilayer flexible substrate upon which are formed a plurality of contact pads, in a density required by a particular application. This density may exceed two hundred contact pads per square inch. Contact pads of similar size and configuration are formed on the surface of another device, i.e., circuit board, and provision made to align the contact pads of the connector with those of the circuit board. Micro-pads are formed on the surface of the contact pads on the connector such, that when the connector is brought into contact with the circuit board, and sufficient pressure is applied, the micro-pads make actual electrical contact with the pads of the circuit board. Since the total surface area in contact, namely the sum of the surface areas of the micro-pads, is a small fraction of the total area of the connector, a large pressure is provided at the electrical contact interface even when low pressure is provided to the connector as a whole.

Abstract translation: 用于高密度电路应用的柔性连接器包括多层柔性基板，其上形成有特定应用所需的密度的多个接触焊盘。 该密度可能超过每平方英寸200个接触垫。 具有相似尺寸和构造的接触垫形成在另一装置即电路板的表面上，并且使连接器的接触垫与电路板的接触垫对齐。 微焊盘形成在连接器上的接触焊盘的表面上，即当连接器与电路板接触并施加足够的压力时，微焊盘与电路板的实际电接触 板。 由于接触的总表面积，即微焊盘的表面积的总和，是连接器总面积的一小部分，所以即使在提供低压时也在电接触界面处提供大的压力 连接器作为一个整体。

公开(公告)号：US20030201242A1

公开(公告)日：2003-10-30

申请号：US10403024

申请日：2003-04-01

Applicant: Sony Chemicals Corporation

Inventor： Yutaka Kaneda ,  Keiichi Naito ,  Toshihiro Shinohara

IPC: H01B013/00

CPC classification number: H05K3/4007 ,  H05K3/06 ,  H05K3/20 ,  H05K2201/0367 ,  H05K2203/0369

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1nullt2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

公开(公告)号：US06616864B1

公开(公告)日：2003-09-09

申请号：US09651629

申请日：2000-08-30

Applicant: Tongbi Jiang ,  Edward A. Schrock

Inventor： Tongbi Jiang ,  Edward A. Schrock

IPC: H01B102

CPC classification number: H01L24/83 ,  H01L24/31 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2203/167 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49181 ,  Y10T29/49204 ,  H01L2924/00

Abstract: A Z-axis electrical contact may be formed using a resinous deposit containing conductive particles which may align along surface regions to form an electrical conduction path over the resinous material. If the resinous material is thermoplastic, the material may be heated to mechanically bond to contact surfaces. Advantageously, the resinous material may be formed by forcing a resinous matrix containing conductive particles through an annular opening in a stencil. The resulting member allows surfaces to be contacted which may be irregular or may be covered by native oxide layers.

Abstract translation: 可以使用含有导电颗粒的树脂沉积物形成Z轴电接触，所述导电颗粒可以沿着表面区域排列以在树脂材料上形成电传导路径。 如果树脂材料是热塑性的，则材料可以被加热以机械地结合到接触表面。 有利地，树脂材料可以通过强制含有导电颗粒的树脂基质通过模板中的环形开口形成。 所得到的构件允许接触表面，其可以是不规则的或可以被天然氧化物层覆盖。

公开(公告)号：US20030160339A1

公开(公告)日：2003-08-28

申请号：US10368461

申请日：2003-02-20

Applicant: NEC ELECTRONICS CORPORATION

Inventor： Gorou Ikegami ,  Tomonobu Sugimoto

IPC: H01L023/28

CPC classification number: H05K3/3442 ,  H01L21/561 ,  H01L23/051 ,  H01L23/4006 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K2201/0367 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component, in which an electronic element 9 fixed onto a first electrically conductive film 7 is electrically connected to second electrically conductive films 8 arranged in substantially the same plane as that of the first electrically conductive film 7 and the electronic element 9 including peripheries of the first and second electrically conductive films 7 and 8 is covered by an encapsulation resin portion 11, has electrically conductive protrusions 13 formed on an exposed surface of the first and second electrically conductive films exposed from the encapsulation resin portion 11.

Abstract translation: 电子部件，其中固定在第一导电膜7上的电子元件9电连接到布置在与第一导电膜7和电子元件9基本相同的平面上的第二导电膜8，电子元件9包括外围 第一和第二导电膜7和8被封装树脂部分11覆盖，在从封装树脂部分11露出的第一和第二导电膜的暴露表面上形成有导电突起13。

公开(公告)号：US06586685B2

公开(公告)日：2003-07-01

申请号：US09268320

申请日：1999-03-16

Applicant: Makoto Kinoshita

Inventor： Makoto Kinoshita

IPC: H01R1204

CPC classification number: H01L24/81 ,  B41M1/10 ,  H01L21/4853 ,  H01L21/4867 ,  H01L24/75 ,  H01L2224/10165 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/207 ,  H05K3/3468 ,  H05K2201/0367 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/074 ,  H05K2203/085 ,  H05K2203/086 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49155 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/81805

Abstract: A bump electrode is a bump made from a fused metal in a shape of one of a circular cylinder, a cone, a pyramid, a frustum of a cone, and a frustum of a pyramid, formed on a substrate. A printed circuit board has a substrate and a wiring pattern provided thereon. The wiring pattern is made from one of a paste and a fused metal and has a cross-section at right angles with respect to an extending direction of the wiring pattern with such an aspect ratio of a depth thereof to a width thereof that the depth thereof is greater than a depth with an aspect ratio of 1:5 and the width thereof is smaller than a width with an aspect ratio of 1:5.

Abstract translation: 凸起电极是由形成在基板上的圆柱体，圆锥体，锥体，锥形截头体和锥体的形状的熔融金属制成的凸块。 印刷电路板具有基板和设置在其上的布线图案。 布线图案由糊状物和熔融金属中的一种制成，并且具有相对于布线图案的延伸方向成直角的横截面，其深度与其宽度的深度比为其深度 大于纵横比为1:5的深度，其宽度小于纵横比为1:5的宽度。

公开(公告)号：US20030106209A1

公开(公告)日：2003-06-12

申请号：US08975549

申请日：1997-11-20

Inventor： WARREN FARNWORTH ,  ALAN WOOD

IPC: H05K003/30

CPC classification number: G01R31/2863 ,  G01R1/0466 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2867 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16145 ,  H01L2224/48463 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49126 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49764 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.

Abstract translation: 提供了一种用于制造已知的良好半导体晶片的方法和装置。 该方法包括以下步骤：测试包含在半导体晶片上的骰子的总功能; 锯切晶片以切割模具; 然后通过组装在具有适于建立管芯上的接合焊盘与外部测试电路之间的电连通的互连的载体中来测试管芯。 用于载体的互连可以使用不同的接触技术形成，包括：刚性基板上的厚膜接触构件; 硅衬底上的自限制接触构件; 或具有纹理表面的微型块接触构件。 在载体的组装期间，芯片和互连件被光学对准并且被放置成与预定的接触力接触。 这就建立了互连上的接触构件和管芯的接合垫之间的电连接。 在组装的载体中，管芯和互连件通过包括桥夹，压板和弹簧夹的力分配机构偏压在一起。 在对模具进行测试之后，拆下载体并且移除被测试的模具。

公开(公告)号：US20030076665A1

公开(公告)日：2003-04-24

申请号：US10301990

申请日：2002-11-22

Inventor： Salman Akram ,  Warren M. Farnworth ,  Alan G. Wood ,  J. Michael Brooks ,  Eugene H. Cloud

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K3/4007 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/095 ,  H05K3/321 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10696 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

Abstract translation: 一种装置，包括电路，具有连接到所述电路并具有第二端的第一端的引线和连接到所述引线的第二端的可变形结构。 本发明可以实现在电路板上，使得电路板包括基板和连接到所述基板的可变形结构。

公开(公告)号：US06548909B2

公开(公告)日：2003-04-15

申请号：US09825512

申请日：2001-04-03

Applicant: Peter J. Brofman ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01L2144

CPC classification number: H01L24/81 ,  H01L23/49827 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.

Abstract translation: 一种通过使用第一电子部件的表面上的多个导电柱和在第二电子部件的表面上的多个对应的导电通孔来互连电子部件的方法。 可以通过用电介质涂覆表面来平衡电介质，并形成对应于其上的接触焊盘的导电通孔来克服电子部件表面上的弯曲。 导电柱基本上是无铅的，优选地包括铜。

公开(公告)号：US06543885B2

公开(公告)日：2003-04-08

申请号：US09894374

申请日：2001-06-27

Applicant: Surinder K. Bahl ,  James E. Harrison, Jr. ,  Richard W. Sexton

Inventor： Surinder K. Bahl ,  James E. Harrison, Jr. ,  Richard W. Sexton

IPC: B41J2085

CPC classification number: H05K3/4691 ,  B41J2/085 ,  H05K1/0306 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0367

Abstract: Metallic bumps are formed for electrical interconnection between the charge plate and the charge drive electronics. This is achieved by having improved electrical connection between an ink jet charge plate and associated charge leads is promoted. This is achieved by integrating the termination pads, electrical transmission lines, and charging leads. The termination bumps are formed as integral parts of the charge leads and are connected directly to the charge driver board electronics by pressure contact. The bumps can be formed by mechanically indenting the termination pads or by using an interposer that has raised metallic pads aligned to the integral nickel pads and the charge driver circuitry board. First, a mask is aligned to permit additive formation of the pads, conductors, and charge leads. Then the nickel circuitry thus formed is made into a rigid charge plate and an integrated flexible section having contact bumps. After bonding the rigid and flexible substrates to the electroformed circuitry the copper substrate is completely removed by selective etching, thus exposing the mechanically deformed bumps on the lead terminations, one for each charge lead. The bump thus formed is used to provide a high pressure point electrical connection to the charge plate.

Abstract translation: 金属凸点形成用于充电板和充电驱动电子器件之间的电互连。 这通过改善喷墨充电板和相关电荷引线之间的电连接来实现。 这通过集成终端焊盘，电气传输线和充电引线来实现。 端接凸块形成为充电引线的整体部分，并通过压力接触直接连接到充电驱动器板电子器件。 可以通过机械地缩进端接焊盘或通过使用已经将已经凸起的金属焊盘与内部镍焊盘和电荷驱动器电路板对准的插入件来形成凸点。 首先，将掩模对准以允许焊盘，导体和电荷引线的附加形成。 然后将如此形成的镍电路制成刚性充电板和具有接触凸块的集成柔性部分。 在将刚性和柔性基板结合到电铸电路之后，铜基板通过选择性蚀刻被完全去除，从而暴露引线端子上的机械变形的凸块，每个电荷引线一个。 这样形成的凸块用于提供与充电板的高压点电连接。