公开(公告)号：US08314467B1

公开(公告)日：2012-11-20

申请号：US12710108

申请日：2010-02-22

Applicant: Jonathan Hale Hammond ,  Jan Vandemeer

Inventor： Jonathan Hale Hammond ,  Jan Vandemeer

IPC: H01L29/84

CPC classification number: B81B7/0019 ,  B81B2201/014 ,  H01H59/0009 ,  H01H2001/0084 ,  Y10T29/49105

Abstract: A micro-electromechanical systems (MEMS) switch having a thermally tolerant anchor configuration is provided. The MEMS switch includes a substrate onto which first and second conductive pads are formed. A conductive cantilever beam having a first end portion, a middle portion, a second end portion, a top surface, and a bottom surface includes an internal surface that defines an open space through the first end portion. A conductive anchor coupled to the internal surface of the first end portion extends through the open space and is coupled to the first conductive pad such that the bottom surface of the second end portion of the conductive cantilever beam is suspended above the second conductive pad by a predetermined distance. The MEMS switch also includes a conductive actuator plate formed on the substrate at a location beneath the middle portion of the conductive cantilever beam and between the first and second conductive pads.

Abstract translation: 提供了具有耐热锚定构造的微机电系统（MEMS）开关。 MEMS开关包括其上形成有第一和第二导电焊盘的基板。 具有第一端部，中间部分，第二端部，顶部表面和底部表面的导电悬臂梁包括限定通过第一端部的开放空间的内表面。 耦合到第一端部分的内表面的导电锚定件延伸穿过开放空间并且耦合到第一导电焊盘，使得导电悬臂梁的第二端部的底表面悬挂在第二导电焊盘的上方 预定距离。 MEMS开关还包括在导电悬臂梁的中间部分下方以及第一和第二导电焊盘之间的位置处形成在基板上的导电致动器板。

公开(公告)号：US08274200B2

公开(公告)日：2012-09-25

申请号：US12274312

申请日：2008-11-19

Applicant: Huantong Zhang ,  Daniel Hyman

Inventor： Huantong Zhang ,  Daniel Hyman

IPC: H01L41/08

CPC classification number: H01H1/0036 ,  B81B3/0013 ,  B81B2201/014 ,  H01H59/0009 ,  H01H2059/0072

Abstract: Mechanical springs and sliders as used in microfabricated actuators to provide an asymmetric spring constant are described. The asymmetric spring constant provides a propensity for deflection towards one direction, and a propensity for separation (i.e. restoration) towards the other direction. The asymmetry and slider system provides a passive mechanical means to achieve faster switching times and higher switch restoring forces.

Abstract translation: 描述了用于微加工致动器中的机械弹簧和滑块以提供非对称弹簧常数。 不对称弹簧常数提供向一个方向偏转的倾向，以及朝着另一个方向分离（即恢复）的倾向。 不对称和滑块系统提供了一种无源机械装置，以实现更快的切换时间和更高的开关恢复力。

公开(公告)号：US08264054B2

公开(公告)日：2012-09-11

申请号：US10291125

申请日：2002-11-08

Applicant: Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Richard Gilbert

Inventor： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Richard Gilbert

IPC: H01L31/058

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract translation: 具有电热驱动和释放的MEMS器件和制造方法。 根据一个实施例，提供微型开关，并且可以包括形成在基板上的基板和固定电极和固定触点。 开关还可以包括悬浮在基板上方的可移动的微型部件。 微组件可以包括包括相对于基底固定的至少一个端部的结构层。 微型部件还可以包括与固定电极间隔开的可动电极和与固定电极间隔开的可动触头。 微组件可以包括附接到结构层的电热组件，并且可操作以产生用于产生用于移动结构层的力的加热。

公开(公告)号：US20120175715A1

公开(公告)日：2012-07-12

申请号：US13348277

申请日：2012-01-11

Applicant: Jonathan Hale Hammond ,  Julio Costa

Inventor： Jonathan Hale Hammond ,  Julio Costa

IPC: H01L29/84 ,  H01L21/02

CPC classification number: H01H49/00 ,  B81B2201/014 ,  B81C1/0023 ,  B81C2203/0145 ,  H01H1/0036 ,  H01H59/0009

Abstract: Encapsulated MEMS switches are disclosed along with methods of manufacturing the same. A non-polymer based sacrificial layer is used to form the actuation member of the MEMS switch while a polymer based sacrificial layer is used to form the enclosure that encapsulates the MEMS switch. The first non-polymer based sacrificial layer allows for highly reliable MEMS switches to be manufactured while also protecting the MEMS switch from carbon contamination. The polymer based sacrificial layer allows for the manufacture of more spatially efficient encapsulated MEMS switches.

Abstract translation: 公开了封装的MEMS开关及其制造方法。 使用非聚合物基牺牲层来形成MEMS开关的致动构件，而基于聚合物的牺牲层用于形成封装MEMS开关的外壳。 第一种基于非聚合物的牺牲层允许制造高可靠性MEMS开关，同时还保护MEMS开关免受碳污染。 基于聚合物的牺牲层允许制造更空间有效的封装MEMS开关。

公开(公告)号：US20120074527A1

公开(公告)日：2012-03-29

申请号：US13230035

申请日：2011-09-12

Applicant: Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

Inventor： Fabrice Casset ,  Lionel Cadix ,  Perceval Coudrain ,  Alexis Farcy ,  Laúrent-Lüc Chapelon ,  Yacine Felk ,  Pascal Ancey

IPC: H01L29/06 ,  H01L21/283

CPC classification number: B81C1/00246 ,  B81B2201/014 ,  B81B2201/0235 ,  B81B2201/0271 ,  B81B2203/0353 ,  B81B2207/012 ,  B81C1/005 ,  G01P15/125 ,  G01P2015/082 ,  H01L2924/0002 ,  H03H3/0073 ,  H03H9/2426 ,  H01L2924/00

Abstract: The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

Abstract translation: 集成电路包括具有相对的第一和第二主表面的支撑基板。 空腔通过支撑基板并连接第一和第二主表面。 集成电路包括具有移动元件的装置，移动元件和一对相关联的电极包括在空腔中。 移动元件的锚定节点位于第一主表面的水平面上。 集成电路包括布置在第一主表面的电平处的第一基本芯片，并与移动元件电连接到该装置。

公开(公告)号：US20110316097A1

公开(公告)日：2011-12-29

申请号：US12973147

申请日：2010-12-20

Applicant: Russell T. HERRIN ,  Christopher V. JAHNES ,  Anthony K. STAMPER ,  Eric J. WHITE

Inventor： Russell T. HERRIN ,  Christopher V. JAHNES ,  Anthony K. STAMPER ,  Eric J. WHITE

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B2201/01 ,  B81B2201/014 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00365 ,  B81C1/00476 ,  B81C1/00619 ,  B81C1/00626 ,  B81C1/00666 ,  B81C2201/0109 ,  B81C2201/013 ,  B81C2201/0167 ,  B81C2201/017 ,  B81C2203/0136 ,  B81C2203/0172 ,  G06F17/5068 ,  G06F17/5072 ,  H01H1/0036 ,  H01H57/00 ,  H01H59/0009 ,  H01H2057/006 ,  H01L41/1136 ,  H01L2924/0002 ,  Y10S438/937 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49105 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/5313 ,  H01L2924/00

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes forming an insulator layer over the first sacrificial cavity layer. The method further includes performing a reverse damascene etchback process on the insulator layer. The method further includes planarizing the insulator layer and the first sacrificial cavity layer. The method further includes venting or stripping of the first sacrificial cavity layer to a planar surface for a first cavity of the MEMS.

Abstract translation: 形成至少一个微机电系统（MEMS）空腔的方法包括在布线层和基板上形成第一牺牲腔层。 该方法还包括在第一牺牲腔层上形成绝缘体层。 该方法还包括在绝缘体层上执行反向镶嵌回蚀工艺。 该方法还包括平坦化绝缘体层和第一牺牲腔层。 该方法还包括将第一牺牲腔层排出或剥离到用于MEMS的第一腔的平坦表面。

公开(公告)号：US20110176252A1

公开(公告)日：2011-07-21

申请号：US13007255

申请日：2011-01-14

Applicant: Dana DeReus

Inventor： Dana DeReus

IPC: H01G5/16

CPC classification number: H01G5/18 ,  B81B3/007 ,  B81B2201/014 ,  H02N1/006

Abstract: The present subject matter relates to MEMS tunable capacitors and methods for operating such capacitors. The tunable capacitor can feature a primary stationary actuator electrode on a substrate, a secondary stationary actuator electrode on the substrate, a stationary RF signal capacitor plate electrode on the substrate, a sprung cantilever disposed over the substrate, a beam anchor connecting a first end of the sprung cantilever to the substrate, and one or more elastic springs or other biasing members connecting a second end of the sprung cantilever to the substrate, the second end being located distally from the first end. The spring cantilever can be movable between an OFF state defined by the potential difference between the stationary and moveable actuator electrodes being zero, and an ON state defined by a non-zero potential difference between the stationary and moveable actuator electrodes.

Abstract translation: 本主题涉及MEMS可调电容器和用于操作这种电容器的方法。 可调谐电容器可以在基板上具有主固定致动器电极，在基板上具有次级固定致动器电极，在基板上具有固定RF信号电容器板电极，设置在基板上的弹簧悬臂梁，连接第一端 弹簧悬臂连接到基板，以及一个或多个弹簧或其他偏置构件，将弹簧悬臂的第二端连接到基板，第二端位于远离第一端的位置。 弹簧悬臂可以在由静止和可动执行器电极之间的电位差为零定义的OFF状态和由固定和可动执行器电极之间的非零电位差限定的ON状态之间移动。

公开(公告)号：US07960200B2

公开(公告)日：2011-06-14

申请号：US11789578

申请日：2007-04-24

Applicant: Guillaume Bouche ,  Ralph N. Wall

Inventor： Guillaume Bouche ,  Ralph N. Wall

IPC: H01L21/00

CPC classification number: B81C1/0015 ,  B81B2201/014 ,  B81B2203/0384 ,  B81C1/00333 ,  B81C2201/0107 ,  B81C2201/0157 ,  B81C2203/0118

Abstract: In accordance with the present invention, accurate and easily controlled sloped walls may be formed using AlN and preferably a heated TMAH for such purpose as the fabrication of MEMS devices, wafer level packaging and fabrication of fluidic devices. Various embodiments are disclosed.

Abstract translation: 根据本发明，可以使用AlN和优选加热的TMAH来形成精确且易于控制的倾斜壁，用于MEMS器件的制造，晶片级封装和流体器件的制造。 公开了各种实施例。

公开(公告)号：US20100182120A1

公开(公告)日：2010-07-22

申请号：US12732752

申请日：2010-03-26

Applicant: Arman Gasparyan ,  John VanAtta Gates, II ,  Maria Elina Simon

Inventor： Arman Gasparyan ,  John VanAtta Gates, II ,  Maria Elina Simon

IPC: H01H61/01

CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/031 ,  H01H37/00 ,  H01H2001/0047 ,  H01H2037/008 ,  H01H2061/006 ,  H01H2061/008

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract translation: 本发明提供一种双向微电子机械元件，包括双向元件的微机电开关，以及减少双向元件中机械蠕变的方法。 在一个实施例中，双向微机电元件包括​​具有自由端的冷梁和连接到冷束锚的第一端。 冷梁锚附接到基板。 第一束对通过自由端系绳连接到冷束，并且被构造成在被加热时延伸到比冷束的温度更大的温度。 第二光束对位于与第一光束对的冷光束的相对侧上，并且通过自由端系绳耦合到第一光束对和冷光束。 第二束对被配置成在被加热时延长到更高的温度。

公开(公告)号：US20100181631A1

公开(公告)日：2010-07-22

申请号：US12357340

申请日：2009-01-21

Applicant: JOSEPH DAMIAN GORDON LACEY

Inventor： JOSEPH DAMIAN GORDON LACEY

IPC: H01L29/84 ,  H01L21/02

CPC classification number: B81B3/007 ,  B81B2201/014 ,  B81B2203/0118 ,  H01L41/094

Abstract: Embodiments discussed herein generally disclose novel alternative methods that can be employed to overcome the gradient stress formed in refractory materials to be used for thin film MEMS cantilever switches. The use of a ‘split layer’ cantilever fabrication method, as described herein enables thin film MEMS cantilever switches to be fabricated resulting in low operating voltage devices while maintaining the mechanical rigidity of the landing portion of the final fabricated cantilever switch.

Abstract translation: 本文讨论的实施方案通常公开了可用于克服在用于薄膜MEMS悬臂开关的难熔材料中形成的梯度应力的新型替代方法。 如本文所述使用“分裂层”悬臂制造方法，可以制造薄膜MEMS悬臂开关，从而产生低工作电压装置，同时保持最终制造的悬臂开关的着陆部分的机械刚性。