公开(公告)号：US11963293B2

公开(公告)日：2024-04-16

申请号：US17460586

申请日：2021-08-30

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee

IPC: H05K1/02 ,  G02B6/13 ,  H01P3/12 ,  H05K3/46

CPC classification number: H05K1/0274 ,  G02B6/13 ,  H01P3/121 ,  H05K1/0298 ,  H05K3/4644 ,  H05K2201/10121

Abstract: A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a first substrate unit, a second substrate unit, a third substrate unit, and two adhesive layers, the first substrate unit including a first dielectric layer and a first conductive layer, the first conductive layer including a first shielding area and two first artificial magnetic conductor areas disposed on two sides of the first shielding area; the second substrate unit including a second dielectric layer and a second conductive layer, the second conductive layer including a second shielding area; the third substrate unit defining a first slot, and the adhesive layer defining a second slot; stacking the first substrate unit, one of the adhesive layers, the third substrate unit, another one of the adhesive layers, and the second substrate unit in that order; pressing the intermediate body.

公开(公告)号：US11129283B2

公开(公告)日：2021-09-21

申请号：US16356425

申请日：2019-03-18

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee ,  Chung-Hsing Liao

IPC: H05K3/42 ,  H05K1/11

Abstract: An electroplating method of a circuit board includes: providing a multi-layer board having a conductive layer embedded therein; penetratingly forming a thru-hole and at least one penetrating hole in the multi-layer board, and forming a conductive portion on an inner wall defining the thru-hole and connected to the conductive layer, wherein the at least one penetrating hole is located at one side of the thru-hole, and an annular portion of the conductive layer exposed from the at least one penetrating hole is defined as an electroplated region; and electroplating the electroplated region to be formed with a metal post by applying a current to the conductive portion, wherein the metal post is filled in the at least one penetrating hole and is connected to the electroplated region.

公开(公告)号：US11063333B2

公开(公告)日：2021-07-13

申请号：US16517318

申请日：2019-07-19

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Wen-Feng Cheng ,  Chien-Cheng Lee

IPC: H01P3/12 ,  H05K9/00

Abstract: An electromagnetic wave transmission board includes a composite board and a plated metal layer. The composite board has a plurality of inner walls surroundingly defining an elongated channel in an interior of the composite board. The plated metal layer is formed on at least part of the inner walls so as to jointly form an inner channel structure in the channel. The inner channel structure surroundingly defines a predetermined space filled with air, and the inner channel structure has two entrances in air communication with the predetermined space. The predetermined space of the inner channel structure is configured to receive and output an electromagnetic wave signal through the two entrances, respectively, and the electromagnetic wave transmission board is configured to transmit the electromagnetic wave signal by using the air in the predetermined space of the inner channel structure as a conductive medium.

公开(公告)号：US20200170124A1

公开(公告)日：2020-05-28

申请号：US16356425

申请日：2019-03-18

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： CHIEN-CHENG LEE ,  CHUNG-HSING LIAO

IPC: H05K3/42 ,  H05K1/11

Abstract: An electroplating method of a circuit board includes: providing a multi-layer board having a conductive layer embedded therein; penetratingly forming a thru-hole and at least one penetrating hole in the multi-layer board, and forming a conductive portion on an inner wall defining the thru-hole and connected to the conductive layer, wherein the at least one penetrating hole is located at one side of the thru-hole, and an annular portion of the conductive layer exposed from the at least one penetrating hole is defined as an electroplated region; and electroplating the electroplated region to be formed with a metal post by applying a current to the conductive portion, wherein the metal post is filled in the at least one penetrating hole and is connected to the electroplated region.

公开(公告)号：US09860990B1

公开(公告)日：2018-01-02

申请号：US15393633

申请日：2016-12-29

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee ,  Wen-Feng Cheng ,  Chung-Hsing Liao

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/02 ,  H05K3/40 ,  H05K3/32 ,  H05K3/06 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/24247 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0268 ,  H05K1/0298 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/32 ,  H05K3/40 ,  H05K3/4641 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/066 ,  H05K2201/10522 ,  H05K2203/0228 ,  H05K2203/16

Abstract: A circuit board structure with chips embedded therein includes a multi-layer board and a power module embedded in the multi-layer board. The power module includes an insulating material, a power unit covered by the insulating material, and a circuit layer disposed on the insulating material. The power unit includes an electrically and thermally conductive carrier and a plurality of power chips. The electrically and thermally conductive carrier includes a transmitting portion and a carrying portion perpendicularly connected to the transmitting portion. Each power chip has a first electrode layer and an opposite second electrode layer. The first electrode layers are fixed on and electrically connected to the carrying portion in parallel, and the power chips are disposed at one side of the transmitting portion. The circuit layer is electrically connected to the electrically and thermally conductive carrier and the second electrode layers.

公开(公告)号：US20170298530A1

公开(公告)日：2017-10-19

申请号：US15099695

申请日：2016-04-15

Applicant: BOARDTEK ELECTRONICS CORPORATION.

Inventor： Wen-Feng Cheng ,  Shun-Chang HSIAO ,  Huan-Hsin LO ,  Chi-Chang HSU ,  Shang-Pei Sun

IPC: C25D17/12

CPC classification number: C25D17/12 ,  C25D17/007 ,  C25D21/12

Abstract: An electroplating anode assembly includes primarily a bracket on which plural anode elements are disposed, with which anode element controlling the on or off of the circuit, respectively. The electroplating anode assembly enables a variety of distribution of the electric lines of force to be formed in an electroplating bath through energizing one or any number of anode elements. In particular, when the shape of the product to be electroplated or the configuration that the product is suspended and disposed is changed, the corresponding distribution of the electric lines of force can be formed only through a simple way of switching an electric current supplying loop, so as to secure the quality of electroplating of the product using a more aggressive and reliable means.

公开(公告)号：US09392687B2

公开(公告)日：2016-07-12

申请号：US14946764

申请日：2015-11-19

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： Chien-Cheng Lee

IPC: H05K1/16 ,  H05K1/00 ,  H05K1/02 ,  H05K7/00 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0204 ,  H05K1/183 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09036 ,  H05K2201/10106

Abstract: A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two opposite board surfaces thereof. The multi-layer structure includes a plurality of stacked plates and an adhesive connecting any two stacked plates. The ceramic member is arranged in the thru-hole of the multi-layer structure, and a surface of the ceramic member is approximately coplanar with a board surface of the multi-layer structure. The adhesive is adhered on the lateral surface of the ceramic member for connecting the ceramic member and the plates. The first conductive layer is formed on the board surface of the multi-layer structure and the surface of the ceramic member. Thus, the circuit board of the instant disclosure can be applied to a high-heat-generating product and is different from a conventional circuit board.

Abstract translation: 电路板包括多层结构，陶瓷构件和第一导电层。 多层结构具有通过其两个相对的板表面的通孔。 多层结构包括多个堆叠的板和连接任何两个堆叠的板的粘合剂。 陶瓷构件布置在多层结构的通孔中，并且陶瓷构件的表面与多层结构的板表面大致共面。 粘合剂粘附在陶瓷构件的侧表面上，用于连接陶瓷构件和板。 第一导电层形成在多层结构的板表面和陶瓷构件的表面上。 因此，本公开的电路板可以应用于高发热产品，并且与常规电路板不同。

公开(公告)号：US20160095197A1

公开(公告)日：2016-03-31

申请号：US14566687

申请日：2014-12-10

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： CHIEN-CHENG LEE

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066

Abstract: A circuit board module includes a circuit board structure, a heat generating element, and a cooling element. The circuit board structure has a plate component and a heat conductive component. The heat conductive component has a heat pipe and a resin excluding fiber glass. The heat pipe is disposed in the plate component and not protruding from the plate component. The resin fills a gap between the heat pipe and the plate component, and the resin substantially connects the heat pipe and the plate component without any gap. The heat generating element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the heat generating element is defined as a heat absorbing portion. The cooling element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the cooling element is defined as a heat dissipating portion.

Abstract translation: 电路板模块包括电路板结构，发热元件和冷却元件。 电路板结构具有板部件和导热部件。 导热部件具有热管和不含玻璃纤维的树脂。 热管设置在板部件中，不从板部件突出。 树脂填充热管和板部件之间的间隙，并且树脂基本上连接热管和板部件而没有任何间隙。 发热元件与导热部件接触，并且与发热元件相邻的导热部件的一部分被定义为吸热部。 冷却元件接触导热部件，并且与冷却元件相邻的导热部件的一部分被定义为散热部分。

公开(公告)号：US20150382472A1

公开(公告)日：2015-12-31

申请号：US14845597

申请日：2015-09-04

Applicant: BOARDTEK ELECTRONICS CORPORATION

Inventor： CHIEN-CHENG LEE

IPC: H05K3/00 ,  H05K1/09 ,  H05K1/02 ,  H05K3/06 ,  H05K3/46

CPC classification number: H05K3/4611 ,  H05K1/0265 ,  H05K3/022 ,  H05K3/06 ,  H05K3/10 ,  H05K3/427 ,  H05K3/429 ,  H05K2201/09736 ,  H05K2203/0723 ,  H05K2203/1476 ,  Y10T29/49155

Abstract: A printed circuit board includes a first substrate, two first circuits formed on a surface of the first substrate, and a thick copper circuit. The thickness of each first circuit is smaller than the thickness of the first substrate, and the first substrate and one of the first circuits cooperatively define a circuit trench. The thick copper circuit is arranged in the circuit trench and is integrally connected to the first circuit, which is corresponding to the groove. The thick copper circuit and the connected first circuit are defined as a thick circuit, and another first circuit is defined as a thin circuit. The length of the thick copper circuit connected to the corresponding first circuit is identical to or greater than 10% of the length of the thick circuit. Additionally, the instant disclosure also provides a method for manufacturing a printed circuit board.

Abstract translation: 印刷电路板包括第一基板，形成在第一基板的表面上的两个第一电路和粗铜电路。 每个第一电路的厚度小于第一衬底的厚度，并且第一衬底和第一电路中的一个协作地限定电路沟槽。 厚铜电路布置在电路沟槽中，并且与第一电路整体连接，第一电路对应于沟槽。 粗铜电路和连接的第一电路被定义为厚电路，另一第一电路被定义为薄电路。 连接到相应的第一电路的粗铜电路的长度等于或大于厚电路长度的10％。 此外，本公开还提供了一种用于制造印刷电路板的方法。