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公开(公告)号：US20240218152A1
公开(公告)日：2024-07-04
申请号：US18192466
申请日：2023-03-29
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
IPC: C08K5/01 , C08F212/08 , C08F212/36 , C08J5/24 , C08L23/16
CPC classification number: C08K5/01 , C08F212/08 , C08F212/36 , C08J5/24 , C08L23/16 , C08J2323/16 , C08J2325/08 , C08L2203/16 , C08L2203/20
Abstract: A resin composition includes a first compound and a second compound, wherein: the first compound has a structure of Formula (1); the second compound comprises bis(vinylphenyl) ethane, divinylbenzene-ethylstyrene-styrene copolymer, ethylene-propylene-ethylidenenorbornene copolymer or a combination thereof; and a weight ratio of the first compound and the second compound is between 1:5 and 5:1. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including varnish shelf life, temperature coefficient of dielectric constant, dielectric constant and solder floating thermal resistance of multi-layer board.
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公开(公告)号：US11840630B2
公开(公告)日：2023-12-12
申请号：US17746727
申请日：2022-05-17
Applicant: Elite Material Co., Ltd.
Inventor： Yu-Te Lin , Chien-Cheng Wang
CPC classification number: C08L71/12 , C08J5/24 , C08L53/02 , C08J2353/02 , C08J2371/12
Abstract: A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.
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公开(公告)号：US20230055543A1
公开(公告)日：2023-02-23
申请号：US17497359
申请日：2021-10-08
Applicant: Elite Material Co., Ltd.
Inventor： Rongtao WANG , Zhenfang SHANG , Ningning JIA
Abstract: A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US20220372284A1
公开(公告)日：2022-11-24
申请号：US17339566
申请日：2021-06-04
Applicant: Elite Material Co., Ltd.
Inventor： Ching-Hsien HSU , Tse-Hung LIU , Tsan-Hung TSAI
IPC: C08L71/12
Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US11453771B2
公开(公告)日：2022-09-27
申请号：US17203318
申请日：2021-03-16
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu Hsieh
IPC: C08L27/18
Abstract: A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.
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Patent Agency Ranking
公开(公告)号：US20220081559A1
公开(公告)日：2022-03-17
申请号：US17071322
申请日：2020-10-15
Applicant: Elite Material Co., Ltd.
Inventor： Ching-Hsien HSU
Abstract: A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US20210371655A1
公开(公告)日：2021-12-02
申请号：US16923315
申请日：2020-07-08
Applicant: Elite Material Co., Ltd.
Inventor： Ching-Hsien HSU
Abstract: A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US20210371627A1
公开(公告)日：2021-12-02
申请号：US16923283
申请日：2020-07-08
Applicant: Elite Material Co., Ltd.
Inventor： Kok-Sheng TAN , Ching-Hsien HSU
Abstract: A resin composition includes 100 parts by weight of a polybutadiene and 10 parts by weight to 40 parts by weight of a maleimide resin, wherein: the polybutadiene has a 1,2-vinyl content of greater than or equal to 85%; the polybutadiene has a lithium ion content of less than or equal to 100 ppm; and the resin composition is free from a polyphenylene ether resin. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
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公开(公告)号：US11174385B2
公开(公告)日：2021-11-16
申请号：US16550844
申请日：2019-08-26
Applicant: Elite Material Co., Ltd.
Inventor： Chenyu Shen , Yan Zhang , Jue Tan , Rongtao Wang
Abstract: A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.
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公开(公告)号：US20210130610A1
公开(公告)日：2021-05-06
申请号：US16713918
申请日：2019-12-13
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination type ionic compound with a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.
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