公开(公告)号：US20050278493A1

公开(公告)日：2005-12-15

申请号：US10864776

申请日：2004-06-09

Applicant: Tzu-How Lin ,  Sung-Yen Chang

Inventor： Tzu-How Lin ,  Sung-Yen Chang

IPC: G06F12/16

CPC classification number: G06F11/1458 ,  Y10S707/99953 ,  Y10S707/99955

Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.

Abstract translation: 提供了一种基于多个场景使用多个虚拟备份服务路径来动态地在存储设备之间切换的系统和方法。 在一个示例中，定义了多个备份服务组。 每个引用至少一个虚拟备份服务路径的多个场景也被定义。 每个虚拟备份服务路径可以由标识存储设备的至少一个网络地址来定义。 基于一个或多个存储设备的服务级别选择其中一个场景，并且选择由所选场景识别的虚拟备份服务路径作为至少一个服务组的备份目的地。

公开(公告)号：US20050156310A1

公开(公告)日：2005-07-21

申请号：US10757206

申请日：2004-01-14

Applicant: Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

Inventor： Alan Benner ,  How Lin ,  Frank Pompeo ,  Subhash Shinde

IPC: H01L31/0232

CPC classification number: G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

Abstract translation: 一种用于电子系统的光电组件包括具有第一表面和相对的第二表面的透明衬底，该透明衬底是导热的并且在表面上被金属化。 支持电子芯片组被配置用于提供多路复用，解复用，编码，解码和光电转换器驱动和接收功能中的至少一个并且被结合到透明基板的第二表面。 具有第一表面和相对的第二表面的第一基板经由金属化的第二表面和其间的支撑芯片与透明基板连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持电子芯片组进行信号通信; 并且限定有具有与光电换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面，其中来自支撑电子芯片组的电信号通过金属化的 所述透明基板的第二表面，并且其中所述支撑电子芯片组和所述光电转换器共享用于冷却的公共热路径。

公开(公告)号：US07512758B2

公开(公告)日：2009-03-31

申请号：US11867785

申请日：2007-10-05

Applicant: Tzu-How Lin ,  Sung-Yen Chang

Inventor： Tzu-How Lin ,  Sung-Yen Chang

IPC: G06F12/00

CPC classification number: G06F11/1458 ,  Y10S707/99953 ,  Y10S707/99955

Abstract: Provided are a system and method for using a plurality of virtual backup service paths to dynamically switch between storage devices based on a plurality of scenarios. In one example multiple backup service groups are defined. Multiple scenarios that each reference at least one virtual backup service path are also defined. Each virtual backup service path may be defined by at least one network address identifying a storage device. One of the scenarios is selected based on a service level of one or more storage devices, and the virtual backup service path identified by the selected scenario is chosen as a backup destination for at least one of the service groups.

Abstract translation: 提供了一种基于多个场景使用多个虚拟备份服务路径来动态地在存储设备之间切换的系统和方法。 在一个示例中，定义了多个备份服务组。 每个引用至少一个虚拟备份服务路径的多个场景也被定义。 每个虚拟备份服务路径可以由标识存储设备的至少一个网络地址来定义。 基于一个或多个存储设备的服务级别选择其中一个场景，并且选择由所选场景识别的虚拟备份服务路径作为至少一个服务组的备份目的地。

公开(公告)号：US20080020566A1

公开(公告)日：2008-01-24

申请号：US11902976

申请日：2007-09-27

Applicant: Frank Egitto ,  How Lin

Inventor： Frank Egitto ,  How Lin

IPC: H01L21/44

CPC classification number: H05K3/4007 ,  G01R1/06711 ,  G01R1/0735 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/10378

Abstract: A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.

Abstract translation: 一种制造其中至少两个电介质层彼此结合以夹在其间的多个导体的插入件的方法。 这些导体各自电耦合相应的一对相对的电触点，其形成在也作为该方法的一部分的电介质层内形成的开口内并从其中突出。 所得到的内插器非常适合用作测试装置的一部分，以将半导体芯片的高密度图案的焊球接触件与装置的印刷电路板上的较小致密的触点阵列相互连接。

公开(公告)号：US20060022310A1

公开(公告)日：2006-02-02

申请号：US10900386

申请日：2004-07-28

Applicant: Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

Inventor： Frank Egitto ,  John Lauffer ,  How Lin ,  Voya Markovich ,  David Thomas

IPC: H01L23/58

CPC classification number: G11C5/06 ,  B82Y10/00 ,  G02B6/43 ,  H01L23/48 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/16 ,  H05K1/181 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 一种电气组件，其包括由其上具有第一导电图案的有机电介质材料构成的电路化衬底。 电介质层和图案的至少一部分形成有机存储器件的第一基底部分，其余部分是形成在图案部分上的第二聚合物层和形成在聚合物层上的第二导电电路。 如果形成在第二导电电路上的第二电介质层和第一电路图案以包围有机存储器件。 该器件通过第二介电层电耦合到第一电气部件，并且该第一电气部件电耦合到第二电气部件。 还提供了制造电气组件的方法，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

公开(公告)号：US20060022303A1

公开(公告)日：2006-02-02

申请号：US10900385

申请日：2004-07-28

Applicant: Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

Inventor： Subahu Desai ,  How Lin ,  John Lauffer ,  Voya Markovich ,  David Thomas

IPC: H01L29/00 ,  H01L21/00

CPC classification number: G11C11/22 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K1/16 ,  H05K2201/0166 ,  H05K2201/0179 ,  H05K2201/09763 ,  H05K2201/10159 ,  H01L2224/0401

Abstract: A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.

Abstract translation: 一种电路化衬底，由至少一层具有导电图案的电介质材料构成。 图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成 设备。 衬底优选地与其它介电电路分层组件组合以形成多层衬底，在多层衬底上，可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其上以与之组合工作。 还提供了能够使用基板的电气组件，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。