公开(公告)号：US5532156A

公开(公告)日：1996-07-02

申请号：US133589

申请日：1993-10-08

Applicant: Neil Talbot ,  Caird E. Rexroad, Jr. ,  Vernon G. Pursel ,  Anne M. Powell

Inventor： Neil Talbot ,  Caird E. Rexroad, Jr. ,  Vernon G. Pursel ,  Anne M. Powell

IPC: C12N5/074 ,  C12N5/00

CPC classification number: C12N5/0672 ,  C12N2502/13

Abstract: Continuous cultures of pluripotent parenchymal hepatocytes were derived from the epiblasts of pig blastocysts. The cultures are feeder-dependent and grow slowly with doubling times of 3 to 4 days. They differentiate into large secretory duct-like structures or form small canaliculi. Alternatively, the cells accumulate droplets that stain intensely with oil red O, a lipid-specific stain. .alpha.-Fetoprotein and albumin mRNA expression increases as the cells differentiate in culture.

Abstract translation: 多能实质肝细胞的连续培养来自猪胚泡的表皮细胞。 培养物为饲料依赖型，生长缓慢，倍增时间为3〜4天。 它们分化成大分泌型管状结构或形成小小管。 或者，细胞积聚着油红色O（一种脂质特异性染色剂）剧烈染色的液滴。 α-Fetoprotein和白蛋白mRNA表达随培养细胞分化而增加。

公开(公告)号：US08615308B2

公开(公告)日：2013-12-24

申请号：US12718864

申请日：2010-03-05

Applicant: Andy Hung ,  Robert Greenberg ,  Dau Min Zhou ,  Jack Judy ,  Neil Talbot

Inventor： Andy Hung ,  Robert Greenberg ,  Dau Min Zhou ,  Jack Judy ,  Neil Talbot

IPC: A61N1/04

CPC classification number: A61N1/05 ,  A61N1/0526 ,  A61N1/0541 ,  A61N1/0543 ,  A61N1/0551

Abstract: The present invention is a micro-machined electrode for neural-electronic interfaces which can achieve a ten times lower impedance and higher charge injection limit for a given material and planar area.

Abstract translation: 本发明是用于神经 - 电子接口的微加工电极，其可以为给定材料和平面区域实现十倍低阻抗和更高电荷注入极限。

公开(公告)号：US08121697B2

公开(公告)日：2012-02-21

申请号：US12861729

申请日：2010-08-23

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/375 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3758 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  Y10T29/49155

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法，以及所得到的电子封装，其适于植入生物组织中，用于视网膜或皮质电极阵列，以使视力恢复到某些非 - 有个人 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07499754B2

公开(公告)日：2009-03-03

申请号：US11499536

申请日：2006-08-04

Applicant: Robert Greenberg ,  Neil Talbot ,  Brian V. Mech ,  James Little

Inventor： Robert Greenberg ,  Neil Talbot ,  Brian V. Mech ,  James Little

IPC: A61N1/00

CPC classification number: A61N1/0543 ,  A61N1/36046

Abstract: The invention is a retinal prosthesis with an improved configuration mounting necessary components within and surrounding the eye. The present invention better allows for the implantation of electronics within the delicate eye structure. The invention further limits the necessary width of a thin film conductor passing through the sclera by use of a multiplexer external to the sclera and a demultiplexer internal to the sclera.

Abstract translation: 本发明是具有改进的构造的视网膜假体，其将眼睛内部和周围的必要部件安装。 本发明更好地允许在精细的眼睛结构内植入电子装置。 本发明通过使用巩膜外部的多路复用器和巩膜内部的解复用器进一步限制穿过巩膜的薄膜导体的必要宽度。

公开(公告)号：US20080065208A1

公开(公告)日：2008-03-13

申请号：US11927315

申请日：2007-10-29

Applicant: Robert Greenberg ,  Jerry Ok ,  Neil Talbot ,  Jordan Neysmith ,  Kevin Wilkin

Inventor： Robert Greenberg ,  Jerry Ok ,  Neil Talbot ,  Jordan Neysmith ,  Kevin Wilkin

IPC: A61F2/14

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/375 ,  A61N1/3758 ,  A61N1/3787 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/19104 ,  H01L2924/19107

Abstract: The present invention is an improved package and configuration for an implantable retinal prosthesis. The retinal prosthesis of the present invention includes an electrode array suitable to be mounted in close proximity to a retina, an electronics package and inductive receiving coil mounted next to each other on a strap surrounding the sclera so that the height above the sclera of the prosthesis is minimized.

Abstract translation: 本发明是用于植入式视网膜假体的改进的包装和构造。 本发明的视网膜假体包括适于安装在视网膜附近的电极阵列，电子封装和感应接收线圈，其彼此相邻地安置在围绕巩膜的带上，使得假体巩膜上方的高度 被最小化。

公开(公告)号：US20080058895A1

公开(公告)日：2008-03-06

申请号：US11893939

申请日：2007-08-18

Applicant: Jerry Ok ,  Robert Greenberg ,  Neil Talbot ,  James Little ,  Rongqing Dai ,  Jordan Neysmith ,  Kelly McClure

Inventor： Jerry Ok ,  Robert Greenberg ,  Neil Talbot ,  James Little ,  Rongqing Dai ,  Jordan Neysmith ,  Kelly McClure

IPC: A61N1/04

CPC classification number: A61N1/36046 ,  A61F15/001 ,  A61N1/0529 ,  A61N1/0543 ,  A61N1/36125 ,  A61N1/375 ,  H01L23/055 ,  H01L23/06 ,  H01L23/08 ,  H01L23/10 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.

Abstract translation: 本发明是用于植入人体的改进的密封包装。 可植入装置包括非导电基底; 通过所述非导电衬底的多个导电通孔; 使用导电凸块连接到所述非导电衬底并电连接到所述多个导电通孔的第一子集的倒装芯片电路，其中所述倒装芯片电路包含一个或多个堆叠或折叠堆叠; 连接到所述非导电衬底并电连接到所述导电通孔的第二子集的引线键合电路; 以及盖，其结合到所述非导电衬底，所述盖，所述非导电衬底和所述导电通孔形成气密封装。

公开(公告)号：US20080058875A1

公开(公告)日：2008-03-06

申请号：US11928698

申请日：2007-10-30

Applicant: Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  James Little ,  Brian Mech

Inventor： Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  James Little ,  Brian Mech

IPC: A61N1/18

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09409 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49174 ,  Y10T29/49176

Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.

Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。

公开(公告)号：US20080057179A1

公开(公告)日：2008-03-06

申请号：US11926046

申请日：2007-10-28

Applicant: Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  Dilek Guven ,  James Little ,  Brian Mech ,  Mark Humayun

Inventor： Robert Greenberg ,  Neil Talbot ,  Jordan Neysmith ,  Dilek Guven ,  James Little ,  Brian Mech ,  Mark Humayun

IPC: B05D5/12

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, or cortical stimulation many purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

公开(公告)号：US20070173905A1

公开(公告)日：2007-07-26

申请号：US11728144

申请日：2007-03-23

Applicant: Robert Greenberg ,  Alfred Mann ,  James Little ,  Karl-Heinz Ihrig ,  Brian Mech ,  Neil Talbot ,  DaoMin Zhou

Inventor： Robert Greenberg ,  Alfred Mann ,  James Little ,  Karl-Heinz Ihrig ,  Brian Mech ,  Neil Talbot ,  DaoMin Zhou

IPC: A61N1/05

CPC classification number: A61N1/0543

Abstract: This invention is a retinal electrode array assembly and methods of using the same that facilitate surgical implant procedures by providing the operating surgeon with visual references and grasping means and with innovations that reduce actual and potential damage to the retina and the surrounding tissue.

Abstract translation: 本发明是一种视网膜电极阵列组件及其使用方法，其通过向操作外科医生提供视觉参考和抓握装置以及减少对视网膜和周围组织的实际和潜在损伤的创新来促进手术植入程序。

公开(公告)号：US07142909B2

公开(公告)日：2006-11-28

申请号：US10236396

申请日：2002-09-06

Applicant: Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.