Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing material
    22.
    发明授权
    Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing material 有权
    一种制造半导体器件的方法,包括用于除去含硅材料的清洁工艺

    公开(公告)号:US06436731B2

    公开(公告)日:2002-08-20

    申请号:US09737056

    申请日:2000-12-14

    Abstract: A method of producing a semiconductor device is described. The semiconductor device has a semiconductor chip with wiring terminals, conductor tracks for the electrical connection of the semiconductor chip, and a component of a housing configuration that contains organic, silicon-containing material. For this purpose, the semiconductor chip is applied to the component of the housing configuration and permanently connected to it. The conductor tracks and/or the wiring terminals are subsequently subjected to a cleaning process, in which silicon-containing material adhering to a surface is eliminated. The conductor tracks are subsequently connected in an electrically conducting manner to the wiring terminals. The contact quality of these electrical connections is noticeably improved by the cleaning process provided.

    Abstract translation: 对半导体装置的制造方法进行说明。 半导体器件具有带有接线端子的半导体芯片,用于半导体芯片的电连接的导体轨道以及包含有机含硅材料的壳体构造的部件。 为此,将半导体芯片应用于壳体配置的部件并且永久地连接到它。 导体轨迹和/或接线端子随后进行清洁处理,其中消除了附着在表面上的含硅材料。 导体轨道随后以导电方式连接到接线端子。 通过提供的清洁处理,这些电连接的接触质量显着提高。

    Protective device with spacer for subassemblies
    27.
    发明授权
    Protective device with spacer for subassemblies 失效
    保护装置带有子组件的垫片

    公开(公告)号:US06927487B2

    公开(公告)日:2005-08-09

    申请号:US10210666

    申请日:2002-08-01

    Abstract: A protective device is provided for subassemblies having a substrate and a component disposed thereon and needing to be protected. The component typically is a semiconductor component. The protective device includes a covering element, a spacer, and a guide. The covering element covers a subassembly. The spacer is disposed between the covering element and the substrate for maintaining a predefined spacing between the covering element and the component to be protected in the area of the spacer. The guide is used for fixing a free end of the spacer to the covering element and/or to the substrate in a predefined X and/or Y position.

    Abstract translation: 为具有衬底和设置在其上并且需要被保护的部件的子组件提供保护装置。 该组件通常是半导体组件。 保护装置包括覆盖元件,间隔件和引导件。 覆盖元件覆盖子组件。 间隔件设置在覆盖元件和基板之间,用于在间隔件的区域中保持覆盖元件和待保护元件之间的预定间隔。 引导件用于将预定义的X和/或Y位置中的间隔件的自由端固定到覆盖元件和/或基板上。

    Package for a semiconductor chip
    28.
    发明授权
    Package for a semiconductor chip 有权
    半导体芯片封装

    公开(公告)号:US06724076B1

    公开(公告)日:2004-04-20

    申请号:US10111294

    申请日:2003-06-26

    Abstract: The invention relates to a packaging for a semiconductor chip. A frame that directly surrounds the slot is provide on the carrier board on the side of the nubbins. Said frame is provided with the same height as the nubbins and the slot and the frame surrounding said slot are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip.

    Abstract translation: 本发明涉及半导体芯片的封装。 直接围绕槽的框架在载体板上提供在衬垫的侧面。 所述框架具有与所述凹槽和所述狭槽相同的高度,并且围绕所述狭槽的所述框架至少部分地填充有优选地适合所述半导体芯片的热膨胀系数的铸塑料。

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