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    Electronic devices with drop protection
    22.
    发明授权
    Electronic devices with drop protection 有权

    公开(公告)号：US11762422B1

    公开(公告)日：2023-09-19

    申请号：US17322591

    申请日：2021-05-17

    Applicant: Apple Inc.

    Inventor： Aidan N. Zimmerman ,  Evan D. Christensen ,  Ivan S. Maric ,  Jason C. Sauers ,  John S. Camp

    IPC: G06F1/16

    CPC classification number: G06F1/163 ,  G06F1/1656

    Abstract: An electronic device may have a housing that separates an exterior region from an interior region. The housing may have a front layer on a front face of the housing and a rear layer on an opposing rear face of the housing. Sidewall structures may extend between the front and rear layers. The housing may form a head-mounted housing that is configured to be worn on a user's head. An internal frame may be mounted in the interior region. The internal frame may have a nose bridge structure that is coupled to the housing with a coupling member such as a coupling member formed from an elastomeric vibration damping material. Other portions of the frame such elongated laterally extending support members may not contact any portion of the housing and may therefore be isolated from the housing during drop events.

    Head-Mounted Device with Active Optical Foveation
    23.
    发明申请
    Head-Mounted Device with Active Optical Foveation 审中-公开

    公开(公告)号：US20200225489A1

    公开(公告)日：2020-07-16

    申请号：US16831306

    申请日：2020-03-26

    Applicant: Apple Inc.

    Inventor： Edward S. Huo ,  David A. Schmuck ,  Jason C. Sauers ,  Kevin A. Gross

    IPC: G02B27/01 ,  G06F3/01 ,  H04N5/225 ,  G02B27/10 ,  H04N5/232 ,  G02B26/08

    Abstract: A pass-through camera in a head-mounted device may capture image data for displaying on a display in the head-mounted device. However, only low-resolution image data may be needed to display low-resolution images in the periphery of the user's field of view on the display. Therefore, the pass-through camera may only capture high-resolution images that correspond to the portion of the user's field-of-view that is being directly viewed and may capture lower resolution image data that corresponds to the real-world objects in the user's peripheral vision. To enable the camera module to selectively capture high-resolution images, the pass-through camera may include an image sensor with two or more pixel densities, a distortion lens, and/or one or more planar or curved mirrors. Any of the components in the camera module may be adjusted to change which portion of a scene is captured with high-resolution image data.

    Self shielding coaxial capacitor structures
    26.
    发明授权
    Self shielding coaxial capacitor structures 有权

    公开(公告)号：US10199172B2

    公开(公告)日：2019-02-05

    申请号：US15275372

    申请日：2016-09-24

    Applicant: Apple Inc.

    Inventor： Paul A. Martinez ,  Jason C. Sauers ,  Cheung-Wei Lam ,  Federico P. Centola ,  Andro Radchenko ,  Martin Schauer

    IPC: H01G4/35 ,  H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  H01G4/12 ,  H01G4/008

    Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.

    SELF SHIELDING COAXIAL CAPACITOR STRUCTURES
    29.
    发明申请
    SELF SHIELDING COAXIAL CAPACITOR STRUCTURES 审中-公开

    公开(公告)号：US20170207028A1

    公开(公告)日：2017-07-20

    申请号：US15275372

    申请日：2016-09-24

    Applicant: Apple Inc.

    Inventor： Paul A. Martinez ,  Jason C. Sauers ,  Cheung-Wei Lam ,  Federico P. Centola ,  Andro Radchenko ,  Martin Schauer

    IPC: H01G4/35 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/012

    CPC classification number: H01G4/35 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/232

    Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.

    Electronic Device Structures Joined Using Shrinking and Expanding Attachment Structures
    30.
    发明申请
    Electronic Device Structures Joined Using Shrinking and Expanding Attachment Structures 有权
    使用收缩和扩展附件结构加入的电子设备结构

    公开(公告)号：US20150346782A1

    公开(公告)日：2015-12-03

    申请号：US14295051

    申请日：2014-06-03

    Applicant: Apple Inc.

    Inventor： Tyler S. Bushnell ,  Jason C. Sauers

    IPC: G06F1/18 ,  H05K3/00

    CPC classification number: G06F1/181 ,  G06F1/1679 ,  G06F1/183 ,  H01R4/726 ,  H05K13/00 ,  Y10T29/49119

    Abstract: An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.

    Abstract translation: 电子设备具有使用附接结构组装的结构。 附件结构改变形状以帮助将电子设备结构连接在一起。 可以连接在一起的结构可以包括电子设备外壳结构，显示结构，内部设备部件，电气部件以及电子设备的其它部分。 附接结构可以包括热激活附着结构，使用其他类型的施加能量激活的结构，以及由于施加化学物质或其它处理而改变形状的结构。

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