公开(公告)号：US20160187530A1

公开(公告)日：2016-06-30

申请号：US14975036

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ruei-Bin MA ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: G01V8/12 ,  H01L31/18 ,  H01L31/167 ,  H01L25/16 ,  H01L31/0232

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.

Abstract translation: 光学模块包括载体，设置在载体上的发光部件，设置在载体上的光学传感器，壳体和透镜。 壳体设置在载体上并且包围发光部件和光学传感器。 壳体限定第一容纳空间，其包括第一孔和位于第一孔下方的第二孔。 壳体包括围绕第一孔的第一侧壁，围绕第二孔的第二侧壁和第一支撑部分，其中第一侧壁的底端和第二侧壁的顶端相交。 透镜位于第一孔中并由第一支撑部分支撑。 发光组件或光学传感器中的一个位于第一容纳空间中。

公开(公告)号：US20240219641A1

公开(公告)日：2024-07-04

申请号：US18092146

申请日：2022-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Ying-Chung CHEN

IPC: G02B6/293

CPC classification number: G02B6/29301

Abstract: An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.

公开(公告)号：US20240096864A1

公开(公告)日：2024-03-21

申请号：US17949139

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng TSAI ,  Ying-Chung CHEN

IPC: H01L25/16 ,  G01J1/04

CPC classification number: H01L25/167 ,  G01J1/0403

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

公开(公告)号：US20240096862A1

公开(公告)日：2024-03-21

申请号：US17950041

申请日：2022-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN

IPC: H01L25/16 ,  G01F1/66 ,  G01L11/02 ,  G01N33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L25/165 ,  G01F1/662 ,  G01L11/02 ,  G01N33/0022 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/486 ,  H01L33/60 ,  G01L27/002 ,  G01N33/0006

Abstract: A semiconductor package and a lid structure are disclosed. The semiconductor package includes a carrier, a lid structure, a first die, and a second die. The lid structure is disposed over the carrier and includes a gas inlet and a gas outlet. The first die is disposed over the carrier. The second die is disposed over the carrier. The lid structure includes a first protrusion pattern protruding toward the carrier and extending between the first die and the second die.

公开(公告)号：US20230063405A1

公开(公告)日：2023-03-02

申请号：US17465713

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Ying-Chung CHEN

IPC: G02B6/42

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US20210082791A1

公开(公告)日：2021-03-18

申请号：US16570841

申请日：2019-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ying-Chung CHEN ,  Hui-Chung LIU

IPC: H01L23/495 ,  H01L21/48

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.

公开(公告)号：US20180358501A1

公开(公告)日：2018-12-13

申请号：US15619414

申请日：2017-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  A61B5/00 ,  A61B5/0408

CPC classification number: H01L31/16 ,  A61B5/0082 ,  A61B5/0408 ,  A61B2562/0209 ,  A61B2562/0238 ,  A61B2562/06 ,  A61B2562/185

Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.

公开(公告)号：US20160178366A1

公开(公告)日：2016-06-23

申请号：US14975083

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08 ,  G01C25/00

Abstract: An optical module includes a carrier, a light source disposed on an upper side of the carrier, an optical sensor disposed on the upper side of the carrier, and a housing disposed on the upper side of the carrier over the light source and the optical sensor. The housing defines a first aperture exposing at least a portion of the light source and a second aperture exposing at least a portion of the optical sensor. An outer sidewall of the housing includes at least one singulation portion adjacent to the upper side of the carrier and perpendicular to the upper side of the carrier.

Abstract translation: 光学模块包括载体，设置在载体的上侧的光源，设置在载体的上侧的光学传感器和设置在载体上的光源上的壳体和光学传感器 。 壳体限定暴露光源的至少一部分的第一孔和暴露光学传感器的至少一部分的第二孔。 壳体的外侧壁包括至少一个与载体的上侧相邻且垂直于载体的上侧的单个部分。

公开(公告)号：US20240427092A1

公开(公告)日：2024-12-26

申请号：US18830534

申请日：2024-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Ying-Chung CHEN

IPC: G02B6/42

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US20240264377A1

公开(公告)日：2024-08-08

申请号：US18105705

申请日：2023-02-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN

IPC: G02B6/293

CPC classification number: G02B6/29301

Abstract: An optical package device and a method of manufacturing the same are disclosed. The optical package device includes an optical component and an optical guiding component. The optical component is configured to change a phase of an input optical signal from a first state to a second state, and to output a first beam with a phase of the second state. The optical guiding component is disposed adjacent to the optical component, the first beam propagating from the optical component toward the optical guiding component. The physical axis of the optical component perpendicular thereto is not parallel with a physical axis of the optical guiding component perpendicular thereto.