公开(公告)号：US20110129964A1

公开(公告)日：2011-06-02

申请号：US13018451

申请日：2011-02-01

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L21/58

CPC classification number: H01L21/6835 ,  H01L27/1214 ,  H01L27/1266 ,  H01L2221/6835 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

Abstract: The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The IC integrated substrate has a first dielectric layer attached to the carrier. The materials of the carrier and the first dielectric layer are selected to prevent the IC integrated substrate from peeling off the carrier during processing and to allow the IC integrated substrate to naturally separate from the carrier after being cut, through the adhesion between the carrier and the first dielectric layer. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electrical devices using the above structure.

Abstract translation: 本发明提供一种结合IC集成基板和载体的结构，其包括载体和形成在载体上的IC集成基板。 IC集成基板具有附接到载体的第一介电层。 选择载体和第一介电层的材料以防止IC集成基板在加工过程中从载体上剥离，并且通过载体和载体之间的粘附使IC集成基板在被切割后自然地与载体分离 第一电介质层。 本发明还提供一种制造上述结构的方法和使用上述结构制造电气装置的方法。

公开(公告)号：US20110124154A1

公开(公告)日：2011-05-26

申请号：US13015725

申请日：2011-01-28

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L21/50

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

公开(公告)号：US07931973B2

公开(公告)日：2011-04-26

申请号：US12553604

申请日：2009-09-03

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: B32B15/08 ,  H01B5/14

CPC classification number: H05K3/244 ,  H05K3/048 ,  H05K3/107 ,  H05K2201/09036 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.

Abstract translation: 公开了多层基板中的金属结构体的制造方法及其结构。 本发明的制造方法包括以下步骤：在电介质层的表面上涂覆至少一层光致抗蚀剂层，然后使光致抗蚀剂介电层曝光以限定金属结构的预定位置; 因此，在形成金属结构体的表面上的至少一个顶盖金属层之前，在预定位置移除光致抗蚀剂层并在预定位置处形成金属结构。 本发明可以通过一个单一的光掩模形成覆盖在金属结构的顶表面和两个侧表面甚至金属结构的下表面上的覆盖金属层。 此外，可以制造具有更高可靠性的更精细的金属结构。 此外，也可以使用金属结构作为同轴结构。

公开(公告)号：US20090321115A1

公开(公告)日：2009-12-31

申请号：US12553604

申请日：2009-09-03

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H05K3/244 ,  H05K3/048 ,  H05K3/107 ,  H05K2201/09036 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric layer to define a predetermined position of the metal structure; therefore, removing the photoresist layer at the predetermined position and forming the metal structure at the predetermined position before forming at least one top-cover metal layer on a surface of the metal structure. The present invention can form a cover metal layer covering over the top surface and the two side surfaces, even the under surface of the metal structure, by one single photomask. Moreover, a finer metal structure with higher reliability can be manufactured. Furthermore, a metal structure can be used as a coaxial structure is also realized.

Abstract translation: 公开了多层基板中的金属结构体的制造方法及其结构。 本发明的制造方法包括以下步骤：在电介质层的表面上涂覆至少一层光致抗蚀剂层，然后使光致抗蚀剂介电层曝光以限定金属结构的预定位置; 因此，在形成金属结构体的表面上的至少一个顶盖金属层之前，在预定位置移除光致抗蚀剂层并在预定位置处形成金属结构。 本发明可以通过一个单一的光掩模形成覆盖在金属结构的顶表面和两个侧表面甚至金属结构的下表面上的覆盖金属层。 此外，可以制造具有更高可靠性的更精细的金属结构。 此外，也可以使用金属结构作为同轴结构。

公开(公告)号：US20090314524A1

公开(公告)日：2009-12-24

申请号：US12549289

申请日：2009-08-27

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H05K1/02 ,  B32B15/04

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/142 ,  H05K3/361 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  Y10T428/31678 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Disclosed is a method of manufacturing a hybrid structure of multi-layer substrates. The method comprises steps of: separating a border district of at least one metal layer connecting with a border district of the corresponding dielectric layer from adjacent metal layers and adjacent dielectric layers for each multi-layer substrate and connecting a separated border of a metal layer of one multi-layer substrate with a separated border district of a metal layer of another multi-layer substrate to form a connection section. The hybrid structure comprises at least a first multi-layer substrate and a second multi-layer substrate. At least one first metal layer is connected with at least one second metal layer to form a connection section.

Abstract translation: 公开了一种制造多层基板的混合结构的方法。 该方法包括以下步骤：将与相应电介质层的边界区连接的至少一个金属层的边界区域与相邻的金属层和相邻的电介质层分别用于每个多层基板并连接金属层的金属层的分离边界 一个多层基板，具有另一多层基板的金属层的分离边界区域，以形成连接部分。 所述混合结构至少包括第一多层基板和第二多层基板。 至少一个第一金属层与至少一个第二金属层连接以形成连接部分。

公开(公告)号：US09398704B2

公开(公告)日：2016-07-19

申请号：US13541664

申请日：2012-07-04

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01R9/00 ,  H05K3/40 ,  H05K1/11 ,  H05K3/04

CPC classification number: H05K3/4007 ,  H05K1/111 ,  H05K1/118 ,  H05K3/048 ,  H05K2201/0367 ,  H05K2201/098 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/0594 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.

Abstract translation: 一种用于多层基板的金属结构制造方法包括在第一介电层上涂覆光致抗蚀剂层; 对光致抗蚀剂层进行光刻工艺以限定第一金属层的特定位置; 在特定位置去除光致抗蚀剂层; 以及在所述特定位置形成所述第一金属层，其特征在于，所述第一金属层的基极面积比所述第一金属层的顶面积大，并且嵌入基体和所述主体以相同的工序形成并且是整体形成的。 所述制造方法可以用于制造柔性多层基板的焊盘或金属线，并且所制造的金属结构不容易从接触的介电层分层或分离。

公开(公告)号：US09107315B2

公开(公告)日：2015-08-11

申请号：US12582647

申请日：2009-10-20

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/03 ,  H05K3/04

CPC classification number: H05K1/116 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/048 ,  H05K3/4076 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09645 ,  H05K2201/09827 ,  Y10T29/49204

Abstract: Disclosed is a via structure in a multi-layer substrate, comprising a first metal layer, a dielectric layer and a second metal layer. The first metal layer has an upper surface. The dielectric layer covers the first metal layer in which a via is opened to expose the upper surface. The second metal layer is formed in the via and contacts an upper surface and an inclined wall of the via. A contacting surface of the second metal layer has a top line lower than the upper edge of the inclined wall. Alternatively, the second metal layer can be formed on the dielectric layer as being a metal line simultaneously as formed in the via as being a pad. The metal line and the pad are connected electronically. The aforesaid metal second layer can be formed in the via and on the dielectric layer by a metal lift-off process.

Abstract translation: 公开了一种多层基板中的通孔结构，包括第一金属层，电介质层和第二金属层。 第一金属层具有上表面。 电介质层覆盖第一金属层，其中通孔被打开以暴露上表面。 第二金属层形成在通孔中并与通孔的上表面和倾斜壁接触。 第二金属层的接触表面具有比倾斜壁的上边缘低的顶线。 或者，第二金属层可以作为金属线形成在电介质层上，同时形成在通孔中作为焊盘。 金属线和焊盘以电子方式连接。 上述金属第二层可以通过金属剥离工艺在通孔和电介质层上形成。

公开(公告)号：US08815333B2

公开(公告)日：2014-08-26

申请号：US13447326

申请日：2012-04-16

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: B05D5/12 ,  C23C18/16 ,  C23C18/31 ,  H05K3/24 ,  H01L21/288 ,  G03F7/09

CPC classification number: B05D5/12 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/31 ,  G03F7/091 ,  H01L21/288 ,  H05K3/048 ,  H05K3/107 ,  H05K3/244 ,  H05K2201/09036

Abstract: Disclosed is a manufacturing method of metal structure in multi-layer substrate. The manufacturing method includes following steps: coating at least one photoresist layer on a surface of a dielectric layer; exposing the photoresist dielectric layer to define a predetermined position of the metal structure; removing the photoresist layer at the predetermined position to undercut an edge of the photoresist layer adjacent to the predetermined position by a horizontal distance of at least 0.1 μm between a top and a bottom of the edge; forming the metal structure at the predetermined position; and forming at least one top-cover metal layer to cover a top surface and two side surfaces of the metal structure. The present invention can form a cover metal layer covering the top surface and the two side surfaces by one single photomask.

Abstract translation: 公开了多层基板中的金属结构体的制造方法。 该制造方法包括以下步骤：在电介质层的表面上涂覆至少一层光致抗蚀剂层; 暴露所述光致抗蚀剂介电层以限定所述金属结构的预定位置; 在预定位置移除光致抗蚀剂层，以使邻近预定位置的光致抗蚀剂层的边缘在边缘的顶部和底部之间的水平距离为至少0.1μm; 在预定位置形成金属结构; 以及形成至少一个顶盖金属层以覆盖金属结构的顶表面和两个侧表面。 本发明可以通过单个光掩模形成覆盖顶表面和两个侧表面的覆盖金属层。

公开(公告)号：US08405223B2

公开(公告)日：2013-03-26

申请号：US13092895

申请日：2011-04-22

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L23/48

CPC classification number: H05K3/4679 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0362 ,  H01L2224/03632 ,  H01L2224/03903 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K1/0393 ,  H05K3/048 ,  H05K2201/096 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Disclosed is a multi-layer via structure, comprising a metal layer, a first via metal layer formed on a first open of a first dielectric layer and a second via metal layer formed on a second open of a second dielectric layer. The first and second via metal layers comprise first and second bottoms, first and second top portions, first and second inclined walls, respectively. The first and second inclined walls comprise first and second top edges, first and second bottom edges respectively. The second top edge has a point closest to a geometric center of the first bottom. A vertical projection of the point falls on the first inclined wall. Alternatively, a point of the second bottom edge, which is closest to the geometric center, has a vertical projection. The vertical projection is vertical to the metal layer and falls on the first inclined wall.

Abstract translation: 公开了一种多层通孔结构，包括金属层，形成在第一介电层的第一开口上的第一通孔金属层和形成在第二介电层的第二开口上的第二通孔金属层。 第一和第二通孔金属层分别包括第一和第二底部，第一和第二顶部，第一和第二倾斜壁。 第一和第二倾斜壁分别包括第一和第二顶部边缘，第一和第二底部边缘。 第二顶边具有最靠近第一底部的几何中心的点。 该点的垂直投影落在第一倾斜壁上。 或者，最靠近几何中心的第二底部边缘的点具有垂直投影。 垂直投影垂直于金属层并落在第一倾斜壁上。

公开(公告)号：US08294039B2

公开(公告)日：2012-10-23

申请号：US11950816

申请日：2007-12-05

Applicant: Chih-kuang Yang ,  Chieh-lin Hsing

Inventor： Chih-kuang Yang ,  Chieh-lin Hsing

IPC: H05K1/11 ,  H05K3/36

CPC classification number: H05K3/4007 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/243 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/099 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A surface finish structure of multi-layer substrate and manufacturing method thereof. The surface finish structure of the present invention includes a bond pad layer, at least one cover metal layer and a solder mask. The cover metal layer covers the bond pad layer. The solder mask has a hole to expose the cover metal layer. The present invention can form the cover metal layer to cover the bond pad layer and then forms the solder mask. Thereafter, the hole is made to the solder mask at the position of the cover metal layer to expose thereof. Because the bond pad layer is embedded in a dielectric layer of the multi-layer substrate, adhesion intensity between the bond pad layer and the dielectric layer can be enhanced. Meanwhile, contact of the bond pad layer with the solder can be prevented with the cover metal layer.

Abstract translation: 多层基板的表面处理结构及其制造方法。 本发明的表面光洁度结构包括接合焊盘层，至少一个覆盖金属层和焊接掩模。 覆盖金属层覆盖接合焊盘层。 焊接掩模具有用于露出覆盖金属层的孔。 本发明可以形成覆盖金属层以覆盖接合焊盘层，然后形成焊接掩模。 此后，在覆盖金属层的位置处将该孔制成焊料掩模以使其露出。 由于接合焊盘层嵌入在多层基板的电介质层中，所以可以提高接合焊盘层与电介质层之间的粘合强度。 同时，可以通过覆盖金属层来防止接合焊盘层与焊料的接触。