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公开(公告)号：US20180110123A1
公开(公告)日：2018-04-19
申请号：US15844107
申请日：2017-12-15
Applicant: Ferric Inc.
Inventor： Noah Sturcken , David Jew , Joe Meyer , Ryan Davies , Hao Wu , Michael Lekas
CPC classification number: H05K1/181 , H01F27/24 , H01F27/2804 , H01F41/02 , H01F41/041 , H05K1/0233 , H05K1/0298 , H05K1/115 , H05K1/165 , H05K2201/086 , H05K2201/0929 , H05K2201/1003 , Y02P70/611 , Y10T29/4913
Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.
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22.发明申请公开(公告)号：US20170290157A1
公开(公告)日：2017-10-05
申请号：US15408096
申请日：2017-01-17
Applicant: Ferric Inc.
Inventor： Noah Sturcken , Ryan Davies , Hao Wu , Michael Lekas
IPC: H05K1/18 , H03H7/38 , H01F27/28 , H01L23/522 , H01L23/498
CPC classification number: H03H7/38 , H01F17/0013 , H01F17/0033 , H01F27/2823 , H01L23/49822 , H01L23/5227 , H05K1/0233 , H05K1/0298 , H05K1/0306 , H05K1/165 , H05K1/181 , H05K2201/086 , Y02P70/611
Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.
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23.发明申请公开(公告)号：US20160036330A1
公开(公告)日：2016-02-04
申请号：US14814033
申请日：2015-07-30
Applicant: Ferric Inc.
Inventor： Noah Sturcken , David Jew , Joe Meyer
IPC: H02M3/158
CPC classification number: H02M3/158 , H02M3/1584 , H02M2001/0045
Abstract: A DC-DC power converter includes a switched inductor power converter and a parallel linear voltage regulator. Two transistors are positioned in the switched inductor power converter to periodically set a bridge voltage thereby producing a square wave with a fixed frequency and variable duty cycle. An inductor and an output capacitor filter the bridge voltage so that only the average value of the bridge voltage is passed to the load. Parasitic impedance due to physical separation of the switched inductor power converter and the load is overcome by providing the parallel linear regulator with its own dedicated channel to the load.
Abstract translation: DC-DC电力转换器包括开关电感功率转换器和并联线性电压调节器。 两个晶体管位于开关电感功率转换器中，以周期性地设置桥电压，从而产生具有固定频率和可变占空比的方波。 电感器和输出电容器对桥接电压进行滤波，使桥接电压的平均值仅传递给负载。 由于开关电感功率转换器和负载的物理分离引起的寄生阻抗通过向负载提供其自己的专用通道的并联线性稳压器来克服。
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公开(公告)号：US12125713B2
公开(公告)日：2024-10-22
申请号：US17655832
申请日：2022-03-22
Applicant: Ferric Inc.
Inventor： Michael Lekas , Salahuddin Raju , Noah Sturcken , Ryan Davies , Denis Shishkov
IPC: H01L21/3205 , H01F17/00 , H01F41/32 , H01L21/02 , H01L21/324 , H01L21/78 , H01L23/522 , H01L49/02
CPC classification number: H01L21/3205 , H01F41/32 , H01L21/02172 , H01L21/324 , H01L21/7806 , H01L23/5227 , H01F17/0033 , H01L28/10
Abstract: A method for manufacturing a ferromagnetic-dielectric composite material comprises: (a) placing patterned ferromagnetic layer regions, in a patterning substrate assembly that includes a patterning substrate and a first dielectric layer, in physical contact with a second dielectric layer, the second dielectric layer in a receiving substrate assembly that includes a receiving substrate, (b) forming a bond between the patterned ferromagnetic layer regions and the second dielectric layer; (c) releasing the patterning substrate from the patterning substrate assembly to transfer the patterned ferromagnetic layer regions and the first dielectric layer from the patterning substrate assembly to the receiving substrate assembly; and (d) releasing the receiving substrate from the receiving substrate assembly to form the ferromagnetic-dielectric composite material.
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公开(公告)号：US11302469B2
公开(公告)日：2022-04-12
申请号：US16257392
申请日：2019-01-25
Applicant: Ferric Inc.
Inventor： Noah Sturcken , Ryan Davies , Michael Lekas
IPC: H01F41/04 , H01F27/24 , H01F17/00 , H01F1/147 , H01L49/02 , H01F41/14 , H01F41/06 , H01F13/00 , H01F27/38 , H01F27/255 , H01F17/06 , H01F27/28 , H01F17/04 , H01F41/26
Abstract: A method of fabricating an inductor includes (a) forming a ferromagnetic core on a semiconductor substrate, the ferromagnetic core lying in a core plane and (b) fabricating an inductor coil that winds around the ferromagnetic core, the inductor coil configured to generate an inductor magnetic field that passes through the ferromagnetic core in a first direction parallel to the core plane. While forming the ferromagnetic core, the method further includes (1) generating a bias magnetic field that passes through the ferromagnetic core in a second direction that is orthogonal to the first direction, and (2) inducing a magnetic anisotropy in the ferromagnetic core with the bias magnetic field.
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Patent Agency Ranking
公开(公告)号：US20210296048A1
公开(公告)日：2021-09-23
申请号：US17341643
申请日：2021-06-08
Applicant: Ferric Inc.
Inventor： Noah Sturcken , Ryan Davies , Michael Lekas
Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.
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公开(公告)号：US20210265915A1
公开(公告)日：2021-08-26
申请号：US16800276
申请日：2020-02-25
Applicant: Ferric Inc.
Inventor： Samira Zaliasl , Noah Sturcken , Denis Shishkov , Michael Lekas
Abstract: A power converter includes a primary circuit and a secondary circuit. The primary circuit includes two primary LC circuits that are in parallel electrically with each other. A first node of each primary LC circuit is electrically coupled to a high-voltage input. A second node of each primary LC circuit is coupled to a respective terminal of a primary inductor that forms a transformer with a secondary inductor in the secondary circuit. Each primary LC circuit is electrically coupled to a primary switch that operates at approximately the resonance frequency of the primary LC circuits to output an alternating current that passes through the primary inductor. The terminals of the secondary inductor are coupled to respective secondary switches. The switches operate at the resonance frequency of the primary LC circuit to rectify the power. A low-pass filter outputs the mean of the received voltage.
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公开(公告)号：US20200075541A1
公开(公告)日：2020-03-05
申请号：US16129305
申请日：2018-09-12
Applicant: Ferric Inc.
Inventor： Noah Sturcken , Ehsan Kalami , Joseph Meyer , Michael Lekas
IPC: H01L25/065 , H02M3/158 , H01L23/64 , H01L49/02 , H01L23/48
Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.
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公开(公告)号：US10367415B1
公开(公告)日：2019-07-30
申请号：US16114448
申请日：2018-08-28
Applicant: Ferric Inc.
Inventor： Noah Sturcken , Ehsan Kalami , Joseph Meyer , Michael Lekas
Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the power management module and the processor chip(s) are mounted on the same side of the processor package substrate.
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公开(公告)号：US10064277B2
公开(公告)日：2018-08-28
申请号：US15084046
申请日：2016-03-29
Applicant: Ferric Inc.
Inventor： Noah Sturcken , Ryan Davies , Hao Wu , Michael Lekas
IPC: H01L23/522 , H05K1/18 , H03H7/38 , H01L23/498
CPC classification number: H05K1/18 , H01F17/0013 , H01F2017/0066 , H01F2017/0086 , H01L23/49811 , H01L23/49822 , H01L23/5226 , H01L23/5227 , H03H1/00 , H03H7/38 , H05K1/165
Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.
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