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    MOLDED CASING, MOLD ASSEMBLY AND FORMING METHOD
    21.
    发明申请
    MOLDED CASING, MOLD ASSEMBLY AND FORMING METHOD 有权
    模具铸件，模具组装和成型方法

    公开(公告)号：US20140306585A1

    公开(公告)日：2014-10-16

    申请号：US13863389

    申请日：2013-04-16

    Applicant: HTC Corporation

    Inventor： Chih-Kai Hu ,  Yu-Jing Liao ,  I-Cheng Chuang

    IPC: H05K5/02 ,  B29C43/02

    CPC classification number: H05K5/0243 ,  B29C33/42 ,  B29C43/02 ,  B29C43/021 ,  B29C2043/022 ,  B29L2031/3481 ,  G06F1/1626 ,  G06F1/1656

    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.

    Abstract translation: 提供了适用于手持电子设备的模制套管。 手持电子设备包括主体和模制外壳，并且主体的至少一部分被模制外壳覆盖。 成型壳体的厚度均匀且具有连续的马赛克表面。 镶嵌表面由多个非共面多边形组成，其中在任何两个相邻的多边形之间形成交线。 交叉线中的任何一个的端部连接到另一交叉线的一端或马赛克面的边缘，并且每个交叉线处的顶角的等效半径小于或等于0.1毫米。 还提供了用于制造模制壳体的模具组件和成形方法。

    ELECTRONIC MODULE
    22.
    发明申请
    ELECTRONIC MODULE 有权
    电子模块

    公开(公告)号：US20140168908A1

    公开(公告)日：2014-06-19

    申请号：US13714424

    申请日：2012-12-14

    Applicant: HTC CORPORATION

    Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Chih-Hung Li ,  Cheng-Te Chen

    IPC: H05K7/06

    CPC classification number: G06F1/1658 ,  G06F1/16 ,  H04M1/00 ,  H04M1/0274 ,  H05K1/0218 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0723 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y02P70/611

    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

    Abstract translation: 电子模块包括具有第一表面的第一电路板，具有第二表面的第二电路板，第一表面上的第一电子部件，第二表面上的第二电子部件，第一导电栅栏和第二导电栅栏。 第一导电围栏包围第一电子部件，并具有暴露第一电子部件的第一开口。 第二导电围栏包围第二电子部件，并具有暴露第二电子部件的第二开口。 第一导电栅栏的第一开口接合第二导电栅栏的第二开口，使得第一电子元件和第二电子元件被第一电路板，第二电路板，第一导电栅栏和第二导电栅栏围绕 导电栅栏 第一电子部件中的至少一个比第一导电栅栏高。

    Electronic device
    23.
    发明授权
    Electronic device 有权

    公开(公告)号：US10440841B2

    公开(公告)日：2019-10-08

    申请号：US15878422

    申请日：2018-01-24

    Applicant: HTC Corporation

    Inventor： Chun Tseng ,  Shih-Po Chien ,  Yi-Ting Liu ,  Yu-Jing Liao ,  I-Cheng Chuang ,  Chi-Jer Wang ,  Wen-Shian Lin

    IPC: H05K5/00 ,  H05K5/03 ,  H04M1/02

    Abstract: An electronic device including a housing, a display component and an electronic component is provided. The housing includes a transparent cover and a middle frame, and the transparent cover is assembled to the middle frame. The display component is disposed in the housing. The electronic component is disposed in the housing, wherein the transparent cover has a flat portion and a connecting portion. The connecting portion curvingly extends from a side of the flat portion and includes at least one bonding surface, and a thickness of the flat portion is different from a thickness of the connecting portion.

    TOUCH PANEL ASSEMBLY AND PORTABLE ELECTRONIC DEVICE
    24.
    发明申请
    TOUCH PANEL ASSEMBLY AND PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20170262117A1

    公开(公告)日：2017-09-14

    申请号：US15068648

    申请日：2016-03-14

    Applicant: HTC Corporation

    Inventor： Po-Chin Huang ,  Shih-Po Chien ,  Yu-Jing Liao ,  I-Cheng Chuang

    IPC: G06F3/041 ,  F21V8/00 ,  G06F3/044

    CPC classification number: G02B6/0053 ,  G02B6/0031 ,  G06F1/1643 ,  G06F3/044 ,  G06F2203/04103

    Abstract: A touch panel assembly includes a touch panel, a flexible circuit board, an input element and a light emitting element. The touch panel includes sensing series and pads. The pads are disposed on bonding regions of the touch panel and electrically connected to the sensing series. The flexible circuit board includes bonding portions and a light guide portion. Each bonding portion is disposed at the bonding region and includes terminals electrically connecting the pads. The light guide portion includes a connecting portion connecting the corresponding bonding portion and an extending portion connecting the connecting portion and extended away from the touch panel. The input element is located right above the extending portion. The light emitting element is disposed at a light incident side of the light guide portion.

    Switch structure and electronic device using the same
    25.
    发明授权
    Switch structure and electronic device using the same 有权

    公开(公告)号：US09728352B2

    公开(公告)日：2017-08-08

    申请号：US14153090

    申请日：2014-01-13

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Yu-Jing Liao ,  Ying-Yen Cheng ,  Chih-Wei Tu ,  Hung-Wen Lin

    IPC: H01H13/14 ,  H01H13/02

    CPC classification number: H01H13/14 ,  H01H13/02 ,  H01H2207/04 ,  H01H2239/052

    Abstract: A switch structure and an electronic device using the same are provided. The electronic device has a casing, and the switch structure is disposed at an inner side of the key portion of the casing. The switch structure includes an elastic member, a force transmission member and a strain sensor. The elastic member is connected to the casing. The force transmission member is located inside the casing. The strain sensor is disposed on the elastic member, and the strain sensor and the force transmission member are disposed are two opposite sides of the elastic member respectively. The elastic member is configured to be deformed by the force transmission member when an external force is applied to an outside of the key portion.

    Electronic module and electronic device
    29.
    发明授权
    Electronic module and electronic device 有权
    电子模块和电子设备

    公开(公告)号：US09531853B2

    公开(公告)日：2016-12-27

    申请号：US14069392

    申请日：2013-11-01

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Yu-Jing Liao ,  Ying-Yen Cheng ,  Chih-Wei Tu

    IPC: H05K7/00 ,  H04M1/02

    CPC classification number: H04M1/0266

    Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.

    Abstract translation: 提供了包括后盖，透明前盖，第一电子元件，第二电子元件，导电带和弹性体的电子设备。 透明的前盖设置在后盖上。 第一电子元件设置在透明前盖和后盖之间。 第二电子元件设置在第一电子元件和后盖之间。 导电带设置在第一电子元件和第二电子元件之间，并且与第一电子元件和第二电子元件接触以将第一电子元件电连接到第二电子元件。 弹性体设置在第一电子元件和第二电子元件之间，并且在压力下附接到导电带。 提供了包括第一电子元件，第二电子元件，导电带和弹性体的电子模块。

    MOLDED CASING, MOLD ASSEMBLY AND FORMING METHOD
    30.
    发明申请
    MOLDED CASING, MOLD ASSEMBLY AND FORMING METHOD 审中-公开
    模具铸件，模具组装和成型方法

    公开(公告)号：US20160212870A1

    公开(公告)日：2016-07-21

    申请号：US15086070

    申请日：2016-03-31

    Applicant: HTC Corporation

    Inventor： Chih-Kai Wai Mun Hu ,  Yu-Jing Liao ,  I-Cheng Chuang

    IPC: H05K5/02 ,  B29C33/42

    CPC classification number: H05K5/0243 ,  B29C33/42 ,  B29C43/02 ,  B29C43/021 ,  B29C2043/022 ,  B29L2031/3481 ,  G06F1/1626 ,  G06F1/1656

    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface.

    Abstract translation: 提供了适用于手持电子设备的模制套管。 手持电子设备包括主体和模制外壳，并且主体的至少一部分被模制外壳覆盖。 成型壳体的厚度均匀且具有连续的马赛克表面。 镶嵌表面由多个非共面多边形组成，其中在任何两个相邻的多边形之间形成交线。 任何一个交叉线的端部连接到另一交叉线的一端或马赛克表面的边缘。

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