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    Door assembly and electronic device
    1.
    发明授权
    Door assembly and electronic device 有权
    门组件和电子设备

    公开(公告)号：US09459663B2

    公开(公告)日：2016-10-04

    申请号：US14054837

    申请日：2013-10-16

    Applicant: HTC Corporation

    Inventor： Chi-Jer Wang ,  Chien-Hung Chen

    IPC: G06F1/16 ,  H04M1/02

    CPC classification number: G06F1/1658 ,  G06F1/1656 ,  H04M1/0214 ,  H04M1/0274

    Abstract: A door assembly disposed at an opening of a casing of an electronic device is provided. An insertion hole provided at a side of the casing close to the opening for an pin to be inserted into the casing through the insertion hole. The door assembly includes a door cap and a rejecting module. The door cap is at least partially connected to the casing and corresponding to the opening. The rejecting module is disposed in the casing and corresponding to the door cap. The rejecting module is configured to push the door cap to expose the opening when the pin is inserted into the casing through the insertion hole. An electronic device is also provided, which includes a casing and the door assembly.

    Abstract translation: 提供了一种设置在电子设备的壳体的开口处的门组件。 插入孔设置在壳体的靠近开口的一侧，用于插入通过插入孔插入到壳体中的销。 门组件包括门盖和拒收模块。 门盖至少部分地连接到壳体并对应于开口。 拒收模块设置在壳体中并对应于门盖。 拒绝模块构造成当销通过插入孔插入壳体时推动门帽以露出开口。 还提供一种电子设备，其包括壳体和门组件。

    ELECTRONIC MODULE
    2.
    发明申请
    ELECTRONIC MODULE 有权
    电子模块

    公开(公告)号：US20140168908A1

    公开(公告)日：2014-06-19

    申请号：US13714424

    申请日：2012-12-14

    Applicant: HTC CORPORATION

    Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Chih-Hung Li ,  Cheng-Te Chen

    IPC: H05K7/06

    CPC classification number: G06F1/1658 ,  G06F1/16 ,  H04M1/00 ,  H04M1/0274 ,  H05K1/0218 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0723 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y02P70/611

    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

    Abstract translation: 电子模块包括具有第一表面的第一电路板，具有第二表面的第二电路板，第一表面上的第一电子部件，第二表面上的第二电子部件，第一导电栅栏和第二导电栅栏。 第一导电围栏包围第一电子部件，并具有暴露第一电子部件的第一开口。 第二导电围栏包围第二电子部件，并具有暴露第二电子部件的第二开口。 第一导电栅栏的第一开口接合第二导电栅栏的第二开口，使得第一电子元件和第二电子元件被第一电路板，第二电路板，第一导电栅栏和第二导电栅栏围绕 导电栅栏 第一电子部件中的至少一个比第一导电栅栏高。

    Electronic assembly and electronic apparatus
    3.
    发明授权
    Electronic assembly and electronic apparatus 有权
    电子组装和电子设备

    公开(公告)号：US09411364B2

    公开(公告)日：2016-08-09

    申请号：US14064221

    申请日：2013-10-28

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Cheng-Te Chen

    IPC: H05K7/02 ,  G06F1/16 ,  H04M1/02

    CPC classification number: G06F1/16 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/1658 ,  H04M1/0262 ,  H04M1/0266 ,  H05K7/023

    Abstract: An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board.

    Abstract translation: 电子设备包括后壳体，前盖和包括显示模块，主机模块，电池模块和扩展模块的电子组件。 后壳体具有前开口。 前盖位于前开口; 前盖和后壳一起构成容纳空间。 显示模块安装在住宿空间内并堆叠在前盖上。 主机模块安装在住宿空间内并堆叠在显示模块上。 电池模块安装在容纳空间内，堆叠在显示模块上，与主机模块并排布置。 扩展模块安装在容纳空间内并堆放在电池模块上。 扩展模块包括堆叠在电池模块上的扩展电路板和安装在扩展电路板上的多个卡连接器。

    ELECTRONIC ASSEMBLY AND ELECTRONIC APPARATUS
    4.
    发明申请
    ELECTRONIC ASSEMBLY AND ELECTRONIC APPARATUS 有权
    电子装配和电子设备

    公开(公告)号：US20150116957A1

    公开(公告)日：2015-04-30

    申请号：US14064221

    申请日：2013-10-28

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Cheng-Te Chen

    IPC: H05K7/02

    CPC classification number: G06F1/16 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/1658 ,  H04M1/0262 ,  H04M1/0266 ,  H05K7/023

    Abstract: An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board.

    Abstract translation: 电子设备包括后壳体，前盖和包括显示模块，主机模块，电池模块和扩展模块的电子组件。 后壳体具有前开口。 前盖位于前开口; 前盖和后壳一起构成容纳空间。 显示模块安装在住宿空间内并堆叠在前盖上。 主机模块安装在住宿空间内并堆叠在显示模块上。 电池模块安装在容纳空间内，堆叠在显示模块上，与主机模块并排布置。 扩展模块安装在容纳空间内并堆放在电池模块上。 扩展模块包括堆叠在电池模块上的扩展电路板和安装在扩展电路板上的多个卡连接器。

    Electronic module
    5.
    发明授权
    Electronic module 有权
    电子模块

    公开(公告)号：US09007776B2

    公开(公告)日：2015-04-14

    申请号：US13714424

    申请日：2012-12-14

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Chih-Hung Li ,  Cheng-Te Chen

    IPC: H05K7/00 ,  G06F1/16 ,  H04M1/00 ,  H05K1/02 ,  H05K1/14 ,  H04M1/02

    CPC classification number: G06F1/1658 ,  G06F1/16 ,  H04M1/00 ,  H04M1/0274 ,  H05K1/0218 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0723 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y02P70/611

    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

    Abstract translation: 电子模块包括具有第一表面的第一电路板，具有第二表面的第二电路板，第一表面上的第一电子部件，第二表面上的第二电子部件，第一导电栅栏和第二导电栅栏。 第一导电围栏包围第一电子部件，并具有暴露第一电子部件的第一开口。 第二导电围栏包围第二电子部件，并具有暴露第二电子部件的第二开口。 第一导电栅栏的第一开口接合第二导电栅栏的第二开口，使得第一电子元件和第二电子元件被第一电路板，第二电路板，第一导电栅栏和第二导电栅栏围绕 导电栅栏 第一电子部件中的至少一个高于第一导电围栏。

    DOOR ASSEMBLY AND ELECTRONIC DEVICE
    7.
    发明申请
    DOOR ASSEMBLY AND ELECTRONIC DEVICE 有权
    门组件和电子设备

    公开(公告)号：US20150103480A1

    公开(公告)日：2015-04-16

    申请号：US14054837

    申请日：2013-10-16

    Applicant: HTC Corporation

    Inventor： Chi-Jer Wang ,  Chien-Hung Chen

    IPC: G06F1/16 ,  H05K5/02

    CPC classification number: G06F1/1658 ,  G06F1/1656 ,  H04M1/0214 ,  H04M1/0274

    Abstract: A door assembly disposed at an opening of a casing of an electronic device is provided. An insertion hole provided at a side of the casing close to the opening for an pin to be inserted into the casing through the insertion hole. The door assembly includes a door cap and a rejecting module. The door cap is at least partially connected to the casing and corresponding to the opening. The rejecting module is disposed in the casing and corresponding to the door cap. The rejecting module is configured to push the door cap to expose the opening when the pin is inserted into the casing through the insertion hole. An electronic device is also provided, which includes a casing and the door assembly.

    Abstract translation: 提供了一种设置在电子设备的壳体的开口处的门组件。 插入孔设置在壳体的靠近开口的一侧，用于插入通过插入孔插入到壳体中的销。 门组件包括门盖和拒收模块。 门盖至少部分地连接到壳体并对应于开口。 拒收模块设置在壳体中并对应于门盖。 拒绝模块构造成当销通过插入孔插入壳体时推动门帽以露出开口。 还提供一种电子设备，其包括壳体和门组件。

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