公开(公告)号：US09553208B2

公开(公告)日：2017-01-24

申请号：US14027710

申请日：2013-09-16

Applicant: Infineon Technologies AG

Inventor： Gottfried Beer ,  Volker Strutz ,  Horst Theuss

IPC: H01L29/82 ,  G01R19/00 ,  G01R33/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/528

CPC classification number: H01L29/82 ,  G01R15/207 ,  G01R19/0092 ,  G01R33/0047 ,  G01R33/0052 ,  H01L21/561 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/528 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/19105

Abstract: A current sensor device for sensing a measuring current includes a semiconductor chip having a magnetic field sensitive element. The current sensor device further includes an encapsulant embedding the semiconductor chip. A conductor configured to carry the measuring current is electrically insulated from the magnetic field sensitive element. A redistribution structure includes a first metal layer having a first structured portion which forms part of the conductor.

Abstract translation: 用于感测测量电流的电流传感器装置包括具有磁场敏感元件的半导体芯片。 电流传感器装置还包括嵌入半导体芯片的密封剂。 构造成承载测量电流的导体与磁场敏感元件电绝缘。 再分布结构包括具有形成导体的一部分的第一结构化部分的第一金属层。

公开(公告)号：US09446944B2

公开(公告)日：2016-09-20

申请号：US14693902

申请日：2015-04-23

Applicant: Infineon Technologies AG

Inventor： Georg Ernst ,  Horst Theuss

IPC: H01L23/498 ,  B81B7/00 ,  B81C1/00 ,  G01L19/00 ,  G01L1/14 ,  G01L1/16

CPC classification number: B81B7/007 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/098 ,  B81C1/00301 ,  G01L1/148 ,  G01L1/16 ,  G01L19/0069 ,  G01L19/0084 ,  H01L23/49838 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Abstract translation: 在各种实施例中，提供了传感器装置。 传感器装置包括具有多个电触点的传感器装置; 壳体，具有多个侧壁; 以及金属载体结构，其以从多个侧壁穿过两个相互相对的侧壁的方式延伸到壳体中。 金属载体结构至少在金属载体结构延伸的侧壁的方向上以弹性方式实施。 具有多个电触头的传感器装置以弹性方式安装在金属载体结构上，并且通过多个触点与导电连接到金属载体结构。

公开(公告)号：US09346667B2

公开(公告)日：2016-05-24

申请号：US14287230

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl

IPC: G01L9/00 ,  H01L21/00 ,  B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0257 ,  B81C1/0023 ,  G01L9/0042 ,  H01L41/0825 ,  H01L41/0926 ,  H01L41/0973 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract translation: 公开了传感器结构。 传感器结构可以包括用于支撑MEMS传感器的引线框架，引线框架的表面中的凹部和耦合到引线框架的表面并布置在凹部上以形成腔室的MEMS传感器。 或者，引线框架可以具有通过其形成的穿孔，并且MEMS传感器可以联接到引线框架的表面并且布置在穿孔的开口上方。

公开(公告)号：US09164156B2

公开(公告)日：2015-10-20

申请号：US13629659

申请日：2012-09-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Georg Ernst ,  Horst Theuss

IPC: G01R33/02 ,  G01R33/06 ,  G01R33/07 ,  G01R33/09 ,  G01D5/14

CPC classification number: G01R33/072 ,  G01D5/147 ,  G01R33/06 ,  G01R33/091

Abstract: An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.

Abstract translation: 设备可以包括背偏磁体; 和半导体芯片元件; 其中所述半导体芯片元件具有用于测量磁场强度的传感器; 并且其中在所述背偏压磁体的接触侧和所述半导体芯片元件的接触侧上形成接触表面，并且其中所述半导体芯片元件的接触侧具有一个或多个结构，使得所述背面的接触表面 -bias磁体以对应于半导体芯片元件的结构的方式成形。

公开(公告)号：US20150249043A1

公开(公告)日：2015-09-03

申请号：US14193480

申请日：2014-02-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: H01L23/31 ,  B29C67/00 ,  H01L21/56

CPC classification number: H01L23/3135 ,  B29C64/00 ,  B29C64/10 ,  B29C64/106 ,  B29C70/72 ,  B29K2025/08 ,  B29K2033/04 ,  B29K2105/253 ,  B29L2031/3481 ,  B33Y40/00 ,  B33Y80/00 ,  B81C1/00309 ,  B81C2203/0136 ,  H01L21/4867 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.

Abstract translation: 一方面，一种封装半导体模块的方法包括提供具有第一表面，与第一表面相对的第二表面和在第一表面和第二表面之间延伸的边缘边的半导体模块。 至少部分地通过3D打印处理形成包装组件。 包装组件包括半导体模块和在第一表面上延伸的保护覆盖物。

公开(公告)号：US20150061045A1

公开(公告)日：2015-03-05

申请号：US14011621

申请日：2013-08-27

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Horst Theuss

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2207/07 ,  B81B2207/091 ,  B81C1/00238 ,  B81C1/00301 ,  H01L2224/16225

Abstract: A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged. The first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface. The mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip.

Abstract translation: MEMS器件包括第一芯片和MEMS芯片。 第一芯片具有安装表面并且至少包括集成电路。 MEMS芯片具有主表面，在该主表面上布置有用于接触MEMS器件的第一组接触焊盘和用于接触第一芯片的第二组接触焊盘。 第一芯片通过面向主表面的安装表面机械地附接并电连接到第二组接触焊盘。 第一芯片的安装表面比MEMS芯片的主表面小至少25％。

公开(公告)号：US20140264255A1

公开(公告)日：2014-09-18

申请号：US14289512

申请日：2014-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Klaus Elian ,  Guenther Ruhl ,  Horst Theuss ,  Irmgard Escher-Poeppel

IPC: H01L29/16

CPC classification number: H01L29/1606 ,  G01N27/127 ,  G01N33/0059 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.

Abstract translation: 在基板上产生石​​墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。

公开(公告)号：US20140231974A1

公开(公告)日：2014-08-21

申请号：US14266348

申请日：2014-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Daniel Kehrer ,  Ulrich Krumbein ,  Beng-Keh See ,  Horst Theuss ,  Helmut Wietschorke ,  Tze Yang Hin ,  Stefan Martens

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/495 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.

Abstract translation: 公开了一种用于制造模块的模块和方法。 模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，包括空腔的框架和布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。

公开(公告)号：US20140205128A1

公开(公告)日：2014-07-24

申请号：US13747496

申请日：2013-01-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Thomas Spoettl ,  Horst Theuss

IPC: H04R3/00

CPC classification number: H04R3/00 ,  H04R19/005 ,  H04R31/00

Abstract: In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

Abstract translation: 在各种实施例中，一种用于制造芯片布置的方法，所述方法包括将麦克风芯片接合到第一载体，麦克风芯片包括麦克风结构，沉积从麦克风结构侧向设置的粘合剂材料，以及将麦克风结构布置成腔 的第二载体，使得粘合剂材料将麦克风芯片固定到第二载体的空腔。

公开(公告)号：US20140151701A1

公开(公告)日：2014-06-05

申请号：US13705367

申请日：2012-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Edward Fuergut ,  Horst Theuss ,  Walter Diez

IPC: H01L23/488 ,  H01L23/48 ,  H01L21/67 ,  H01L21/56 ,  H01L29/84

CPC classification number: H01L23/488 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67242 ,  H01L23/48 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L29/84 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/82

Abstract: An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.

Abstract translation: 提供嵌入式芯片封装。 嵌入式芯片封装包括多个芯片; 封装材料嵌入多个芯片; 电连接到所述多个芯片的至少一个电再分配层; 以及连接到所述至少一个电再分配层的公共终端，其中所述公共终端为所述多个芯片和所述公共终端之间的公共电信号的发射和接收中的至少一个提供接口。