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21.发明申请公开(公告)号：US20200239302A1
公开(公告)日：2020-07-30
申请号：US16850560
申请日：2020-04-16
Applicant: Infineon Technologies AG
Inventor： Johann Strasser , Alfons Dehe , Gerhard Metzger-Brueckl , Juergen Wagner , Arnaud Walther
Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.
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公开(公告)号：US10676346B2
公开(公告)日：2020-06-09
申请号：US16136986
申请日：2018-09-20
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser
Abstract: A production method for a MEMS component includes providing a layer arrangement on a carrier substrate, where the layer arrangement includes a first and second layer structure. A sacrificial material is arranged in an intermediate region between the first and second layer structures, an etch stop structure extending between the first and second layer structures subdivides the intermediate region into an exposure region and an edge region laterally adjoining the exposure region, and at least one of the first layer structure or the second layer structure has access openings to the exposure region. The method further includes removing the sacrificial material from the exposure region through the access openings using an etching process to expose the exposure region. The etch stop structure provides a lateral delimitation for the etching process, and the sacrificial material present in the edge region provides a mechanical connection between the first and second layer structures.
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公开(公告)号：US10575101B2
公开(公告)日：2020-02-25
申请号：US15897946
申请日：2018-02-15
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser , Carsten Ahrens
Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.
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公开(公告)号：US10539779B2
公开(公告)日：2020-01-21
申请号：US15674149
申请日：2017-08-10
Applicant: Infineon Technologies AG
Inventor： Ludwig Heitzer , Derek Debie , Klaus Elian , Cyrus Ghahremani , Johannes Lodermeyer , Oskar Neuhoff , Johann Strasser
Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.
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Patent Agency Ranking
25.发明申请公开(公告)号：US20190071305A1
公开(公告)日：2019-03-07
申请号：US16118055
申请日：2018-08-30
Applicant: Infineon Technologies AG
Inventor： Johann Strasser , Alfons Dehe , Gerhard Metzger-Brueckl , Juergen Wagner , Arnaud Walther
Abstract: A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.
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公开(公告)号：US10189699B2
公开(公告)日：2019-01-29
申请号：US15819767
申请日：2017-11-21
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Johann Strasser , Gerhard Metzger-Brueckl
Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
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公开(公告)号：US20180234774A1
公开(公告)日：2018-08-16
申请号：US15897946
申请日：2018-02-15
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser , Carsten Ahrens
CPC classification number: H04R19/04 , B81B3/001 , B81B3/0021 , B81B3/0072 , B81B2201/0257 , B81B2203/0127 , B81B2203/0163 , B81B2203/04 , B81C1/00182 , H04R19/005 , H04R31/003 , H04R2201/003
Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.
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公开(公告)号：US20170260040A1
公开(公告)日：2017-09-14
申请号：US15066741
申请日：2016-03-10
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Johann Strasser , Gerhard Metzger-Brueckl
CPC classification number: B81B3/0086 , B81B2201/0257 , B81B2203/0127 , H04R19/005 , H04R19/04 , H04R31/006 , H04R2201/003
Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.
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公开(公告)号：US20140242374A1
公开(公告)日：2014-08-28
申请号：US13774624
申请日：2013-02-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Johann Strasser , Thomas Kunstmann , Manfred Frank , Werner Robl , Maximilian Krug , Simon Faiss , Matthias Mueller
CPC classification number: H01L23/14 , B05D7/52 , B32B3/26 , C23C18/1644 , C23C18/1651 , C23C18/32 , C23C18/50 , C25D7/12 , C25D7/123 , H01L23/3733 , H01L23/49866 , H01L23/53238 , H01L2924/0002 , Y10T428/249956 , Y10T428/249957 , Y10T428/24997 , H01L2924/00
Abstract: Various methods, apparatuses and devices relate to porous metal layers on a substrate which are three-dimensionally coated. In one embodiment, a porous metal layer is deposited over a substrate. The porous metal layer can be three-dimensionally coated with a coating material.
Abstract translation: 各种方法，装置和装置涉及三维涂覆在基底上的多孔金属层。 在一个实施例中，多孔金属层沉积在衬底上。 多孔金属层可以用涂料三维涂覆。
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