Abstract:
A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.
Abstract:
A gas sensor device with temperature uniformity is presented herein. In an implementation, a device includes a complementary metal-oxide semiconductor (CMOS) substrate layer, a dielectric layer and a gas sensing layer. The dielectric layer is deposited on the CMOS substrate layer. Furthermore, the dielectric layer includes a temperature sensor and a heating element coupled to a heat transfer layer associated with a set of metal interconnections. The gas sensing layer is deposited on the dielectric layer.
Abstract:
A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves. The MEMS device also includes a second substrate coupled to and facing the diaphragm, and including circuitry, wherein the second substrate includes a recess region forming an integrated back cavity in the MEMS device. The MEMS device also includes an electrical connection electrically coupling the first substrate and the second substrate and configured to transmit an electrical signal indicative of the deflection of the diaphragm.
Abstract:
Microelectromechanical microphones include structures that permit differential capacitive sensing. In certain structures, a movable plate is disposed between a rigid plate and a substrate. A first capacitor is formed between the movable plate and the substrate and a second capacitor is formed between the movable plate and the rigid plate. Respective bias voltages can be applied to the rigid plate and the substrate, and a differential capacitive signal can be probed in response to displacement of the movable plate caused by a pressure wave. The movable plate and the rigid plate are mechanically coupled to first and second portions of the substrate, respectively. A dielectric member mechanically couples the movable plate and the rigid plate, thus providing mechanical stability.
Abstract:
A MEMS device includes a MEMS substrate with a movable element. Further included is a CMOS substrate with a cavity, the MEMS substrate disposed on top of the CMOS substrate. Additionally, a back cavity is connected to the CMOS substrate, the back cavity being formed at least partially by the cavity in the CMOS substrate and the movable element being acoustically coupled to the back cavity.
Abstract:
A piezoelectric acoustic resonator based sensor is presented herein. A device can include an array of piezoelectric transducers and an array of cavities that has been attached to the array of piezoelectric transducers to form an array of resonators. A resonator of the array of resonators can be associated with a first frequency response corresponding to a first determination that the resonator has been touched, and a second frequency response corresponding to a second determination that the resonator has not been touched. The array of piezoelectric transducers can include a piezoelectric material; a first set of electrodes that has been formed a first side of the piezoelectric material; and a second set of electrodes that has been formed on second side of the piezoelectric material.
Abstract:
A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone.
Abstract:
A microphone system includes a diaphragm suspended by springs and including a sealing layer that seals passageways which, if left open, would degrade the microphone's frequency response by allowing air to pass from one side of the diaphragm to the other when the diaphragm is responding to an incident acoustic signal. In some embodiments, the sealing layer may include an equalization aperture to allow pressure to equalize on both sides of the diaphragm.
Abstract:
A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone.