公开(公告)号：US20250053237A1

公开(公告)日：2025-02-13

申请号：US18806448

申请日：2024-08-15

Applicant: Liquid Wire Inc.

Inventor： Trevor Antonio Rivera ,  Jorge E. Carbo, JR. ,  Mark William Ronay ,  Michael Adventure Hopkins ,  Katherine M. Nelson ,  Iheanyi Eronini Marike ,  Jerry Gene Sewell, JR. ,  Michael Scott Amos

IPC: G06F3/01 ,  G06F1/16

Abstract: A system configured to characterize a physical motion performed by a user is disclosed herein. The system can include a wearable article including a first flexible circuit, that includes a first trace formed from a deformable conductor. The first flexible circuit is positioned in a first location of interest on the wearable article. The system can further include a computing device configured to receive a first signal generated by the first flexible circuit, determine a first electrical parameter based on the first signal, determine a physical condition of the first flexible circuit based on the first electrical parameter, compare the physical condition of the first flexible circuit to previously determined physical conditions associated with the wearable article, and characterize the physical motion performed by the user based on the comparison.

公开(公告)号：US20240389225A1

公开(公告)日：2024-11-21

申请号：US18683738

申请日：2022-08-15

Applicant: Liquid Wire Inc.

Inventor： Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Charles J. Kinzel ,  Mark William Ronay

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46

Abstract: An apparatus comprises a metal layer 102, a fluid phase conductor 202 configured to overlap at least a portion of the metal layer, a stencil layer 204 having vias or channels containing the fluid phase conductor, and an encapsulation layer 206 configured to encapsulate the fluid phase conductor within the apparatus.

公开(公告)号：US20230317314A1

公开(公告)日：2023-10-05

申请号：US18331637

申请日：2023-06-08

Applicant: Liquid Wire Inc.

Inventor： Jesse Michael Martinez ,  Michael Adventure Hopkins ,  Charles J. Kinzel ,  Trevor Antonio Rivera ,  Mark William Ronay ,  Edward Martin Godshalk

IPC: H01B5/02

CPC classification number: H01B5/02

Abstract: Systems, structures, and methods include a structure formed from a plurality of layers of matrix material. A bus is secured between adjacent layers of the plurality of layers of the matrix material. The bus includes a conductive gel configured to propagate an electrical signal through the structure.

公开(公告)号：US20220377885A1

公开(公告)日：2022-11-24

申请号：US17663764

申请日：2022-05-17

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Jorge E. Carbo, JR. ,  Trevor Antonio Rivera ,  Charles J. Kinzel ,  Michael Adventure Hopkins ,  Sai Srinivas Desabathina

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/42

Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

公开(公告)号：US20220068787A1

公开(公告)日：2022-03-03

申请号：US17395130

申请日：2021-08-05

Applicant: Liquid Wire Inc.

Inventor： Mark William Ronay ,  Trevor Antonio Rivera ,  Michael Adventure Hopkins ,  Edward Martin Godshalk ,  Charles J. Kinzel

IPC: H01L23/498 ,  H01L23/31

Abstract: A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.