中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

42 records (took 0.027 seconds)

    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR
    21.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR 审中-公开

    公开(公告)号：US20190228914A1

    公开(公告)日：2019-07-25

    申请号：US16372469

    申请日：2019-04-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

    IPC: H01G4/40 ,  H01C1/14 ,  H01C1/012

    Abstract: A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR DEVICE
    23.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR DEVICE 审中-公开

    公开(公告)号：US20180075974A1

    公开(公告)日：2018-03-15

    申请号：US15697503

    申请日：2017-09-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

    IPC: H01G4/40 ,  H01G4/38

    CPC classification number: H01G4/40 ,  H01G4/385 ,  H01L21/84

    Abstract: A composite electronic component includes a capacitor device and a resistor device stacked together in a height direction. The capacitor device includes a capacitor body and first and second external electrodes. The resistor device includes a base, a resistive element, first and second upper surface conductors, first and second lower surface conductors, a first connection conductor, and a second connection conductor. The upper surface of the base of the resistor device faces the lower surface of the capacitor body of the capacitor device, the first upper surface conductor is electrically connected to the first external electrode, and the second upper surface conductor is electrically connected to the second external electrode.

    ELECTRONIC COMPONENT
    25.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20150270066A1

    公开(公告)日：2015-09-24

    申请号：US14731521

    申请日：2015-06-05

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H01G4/12 ,  H01G4/30 ,  H01G4/224

    CPC classification number: H01G4/12 ,  H01G2/06 ,  H01G4/01 ,  H01G4/224 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

    Abstract translation: 多层陶瓷电容器包括层叠的扁平状内部电极。 插入器包括比多层陶瓷电容器的轮廓大的绝缘基板。 安装多层陶瓷电容器的第一安装电极位于绝缘基板的第一主表面上，以及用于连接到位于第二主表面上的外部电路板的第一外部连接电极。 多层陶瓷电容器以这样的方式安装到内插器上，使得内部电极的主表面平行或基本上平行于中介层的主表面，即绝缘基板的第一和第二主表面。

    ELECTRONIC COMPONENT
    26.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20140116768A1

    公开(公告)日：2014-05-01

    申请号：US14147795

    申请日：2014-01-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/228 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.

    Abstract translation: 电子部件包括插入件和多层陶瓷电容器。 插入器包括包括彼此平行或基本平行的前表面和后表面的基板。 两个第一安装电极和两个第二安装电极位于基板的前表面上，在纵向上的相对端部上。 凹部位于绝缘基板的纵向侧面。 连接导体各自设置在每个凹部的侧壁表面中。 连接导体连接位于基板的背面的第一外部连接电极和第二外部连接电极以及第一安装电极和第二安装电极。

    MOUNTING LAND STRUCTURE AND MOUNTING STRUCTURE FOR LAMINATED CAPACITOR
    27.
    发明申请
    MOUNTING LAND STRUCTURE AND MOUNTING STRUCTURE FOR LAMINATED CAPACITOR 有权
    用于层压电容器的安装土地结构和安装结构

    公开(公告)号：US20140041914A1

    公开(公告)日：2014-02-13

    申请号：US13959949

    申请日：2013-08-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A mounting land structure and a mounting structure include land patterns to be bonded to outer electrodes of a laminated ceramic capacitor. Each of the land patterns includes a first conductor pattern and a second conductor pattern separated from each other in a width direction and a third conductor pattern connecting the first conductor pattern and the second conductor pattern. The first conductor pattern and the second conductor pattern include respective portions to be bonded to first ridgeline portions of the laminated ceramic capacitor provided with the outer electrodes. The third conductor pattern is arranged at a position overlapping the corresponding outer electrode as viewed in a height direction, when the laminated ceramic capacitor is mounted.

    Abstract translation: 安装平台结构和安装结构包括与层压陶瓷电容器的外部电极接合的焊盘图案。 每个焊盘图案包括在宽度方向上彼此分离的第一导体图案和第二导体图案，以及连接第一导体图案和第二导体图案的第三导体图案。 第一导体图案和第二导体图案包括要被接合到设置有外部电极的层叠陶瓷电容器的第一脊线部分的各个部分。 当安装层叠陶瓷电容器时，第三导体图案被布置在与高度方向相对的相应的外部电极重叠的位置。

    ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
    29.
    发明申请
    ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT 有权
    电子元件，电子元件嵌入式基板及其制造方法

    公开(公告)号：US20130299215A1

    公开(公告)日：2013-11-14

    申请号：US13888639

    申请日：2013-05-07

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yasunori TASEDA ,  Isamu FUJIMOTO

    IPC: H01G4/30 ,  H05K1/18

    CPC classification number: H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K1/185 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/43

    Abstract: An electronic component includes a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively.

    Abstract translation: 电子部件包括主体和布置在主体的外表面上的第一和第二外部电极。 第一外部电极的边缘部分和第二外部电极的边缘部分在主体上彼此面对。 第一外部电极和第二外部电极分别包括含铜金属层和覆盖第一和第二外部电极的边缘部分内的含铜金属层的保护性铜氧化物层。

    POWER SUPPLY APPARATUS
    30.
    发明申请
    POWER SUPPLY APPARATUS 有权
    电源设备

    公开(公告)号：US20130265025A1

    公开(公告)日：2013-10-10

    申请号：US13629754

    申请日：2012-09-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: G05F1/46

    CPC classification number: G05F1/46 ,  H02M3/1588 ,  H02M2001/0009 ,  Y02B70/1466

    Abstract: In a power supply apparatus that supplies direct current power to a load with a power supply unit, since a load power supply current is detected by a current detector from a voltage between both ends of a through electrode of a three-terminal capacitor provided on a power feed line extending from a power supply unit to a load, the three-terminal capacitor serving as a filter to reduce ripple noise can be used also as a detection resistor for detecting the load power supply current. Accordingly, it is possible to detect the load power supply current with a simple configuration that does not require a resistance element to detect the load power supply current, unlike in the related art. Consequently, it is not necessary to ensure an area where the resistance element for current detection can be mounted to reduce a power supply apparatus in size.

    Abstract translation: 在向电源单元向负载提供直流电力的电源装置中，由于电流检测器由设置在电源单元上的三端电容器的贯通电极的两端之间的电压检测出负载电源电流 供电线从电源单元延伸到负载，用作滤波器以减小纹波噪声的三端电容器也可以用作用于检测负载电源电流的检测电阻器。 因此，与现有技术不同，可以以不需要电阻元件的简单结构来检测负载电源电流来检测负载电源电流。 因此，不需要确保可以安装用于电流检测的电阻元件的区域，以减小电源装置的尺寸。

Patent Agency Ranking