Abstract:
A system including a detector array configured to receive electromagnetic (EM) radiation from a target object, the detector array having one or more detectors is disclosed. The system also includes a readout integrated circuit and one or more processors. The readout integrated circuit has a circuit comprising a number of detector boundary selection components, each one of the number of detector boundary selection components configured to select or adjust a detector boundary from least one of a sub-column boundary or an adjustable boundary.
Abstract:
According to one aspect, embodiments herein provide a unit cell comprising a photodiode, a MOSCap having an input node coupled to the photodiode, a reset switch selectively coupled between the MOSCap and a reset voltage, and a transistor coupled to the input node of the MOSCap, wherein, in a first mode of operation of the unit cell, the reset switch is configured in an open state and charge generated by light incident on the photodiode accumulates at the input node of the MOSCap in response to voltage at the input node being less than a threshold voltage, and wherein, in a second mode of operation of the unit cell, the reset switch is configured in the open state and the charge generated by the light incident on the photodiode accumulates on the MOSCap in response to the voltage at the input node being greater than the threshold voltage.
Abstract:
A focal plane array having: an imaging array section, comprising: an array of electromagnetic radiation detectors; and an address section providing outputs from selectively enabled detectors. The imaging array section comprises a plurality of circuit blocks, each one of the circuit blocks having a primary circuit and a redundant circuit. Test circuitry is for provided for supplying test signals to test each one of the primary circuits and determining whether a response from the test signals is proper or improper and for storing in the test circuitry in response to such determining select signals associated with each one of the tested circuit blocks. An array controller is provided for, during a subsequent normal operating mode, providing timing pulses to the address section wherein the address section selectively enables the detectors using either the primary or redundant circuits in the plurality of circuit blocks selectively in accordance with the stored select signals.
Abstract:
A focal plane array having: a plurality of detectors; a plurality of unit cell sections, each section being fed by charge produced by corresponding detector for producing a sequence of frames; and a plurality of sets of storage sections, each section being coupled to a corresponding one of the unit cells. Each set of storage sections includes a plurality of storage units for sequentially storing the frames. A region of interest selector section examines the frames of the plurality of unit calls, to detect at least one of the frames having a predetermined characteristic. A processor: (i) identifies a sub-set of the plurality of unit cells proximate the detected unit cells having the predetermined characteristic to establish a region of interest; and (ii) sequentially reads the plurality of storage units in the storage sections coupled to the sub-set of unit cells in the established region of interest.
Abstract:
A device includes multiple row power lines and multiple row control lines arranged in rows, where each row control line corresponds to one of the row power lines. The device also includes multiple column power lines arranged in columns. The device further includes multiple unit cells, where each unit cell is coupled to one of the row power lines and one of the row control lines and selectively coupled to one of the column power lines. In addition, the device includes multiple row power switches and multiple column power switches arranged in pairs, where each pair includes one of the row power switches and one of the column power switches. Each pair is configured to selectively (i) connect a corresponding one of the rows and a corresponding one of the columns or (ii) isolate the corresponding one row and the corresponding one column from each other.
Abstract:
An analog counter circuit for use with a digital pixel includes: an input; an output; a first stage electrically coupled to the input that is charged to an initial charge voltage; a second stage that includes an accumulating charge storage device; and a charge transfer device between the first and second stages that includes a transfer voltage. The charge transfer device allows charge from the first stage to pass to the second stage and be accumulated on the accumulating charge storage device as long as a voltage at a node in the first stage is greater than the transfer voltage.
Abstract:
A TDI scanner including a dynamically programmable focal plane array including a two-dimensional array of detectors arranged in a plurality of columns and a plurality of rows, the array being divided into a plurality of banks separated from one another by gap regions, each bank including a plurality of sub-banks, and each sub-bank including at least one row of detectors, a ROIC coupled to the focal plane array and configured to combine in a TDI process outputs from detectors in each column of detectors in each sub-bank, and a controller configured to program the focal plane array to selectively and dynamically set characteristics of the focal plane array, the characteristics including a size and a location within the two-dimensional array of each of the plurality of sub-banks and the gap regions, the size corresponding to a number of rows of detectors included in the respective sub-bank or gap region.
Abstract:
A system including a detector array configured to receive electromagnetic (EM) radiation from a target object, the detector array having one or more detectors is disclosed. The system also includes a readout integrated circuit and one or more processors. The readout integrated circuit has a circuit comprising a number of detector boundary selection components, each one of the number of detector boundary selection components configured to select or adjust a detector boundary from least one of a sub-column boundary or an adjustable boundary.
Abstract:
Aspects and examples described herein provide a hybrid imaging sensor chip assembly for reducing undesired radiative transfer between a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC) and an optical detector, and methods of manufacturing a hybrid imaging sensor chip assembly. In one example, a hybrid imaging sensor chip assembly includes an optical detector configured to collect electromagnetic radiation incident thereon, a complementary metal-oxide semiconductor (CMOS) read-out integrated circuit (ROIC), and a radiation-shielding wafer interposed between the optical detector and the CMOS ROIC, the radiation-shielding wafer including a plurality of through wafer vias (TWVs) electrically coupled to the optical detector and the CMOS ROIC, the radiation-shielding wafer being positioned to prevent radiative transfer between the CMOS ROIC and the optical detector.
Abstract:
According to one aspect, embodiments herein provide a unit cell circuit comprising a photodetector configured to generate a photo-current in response to receiving light, a first integration capacitor configured to accumulate charge corresponding to the photo-current, a second integration capacitor configured to accumulate charge corresponding to the photo-current, a charge diverting switch coupled to the photodetector and configured to selectively couple the first integration capacitor to the second integration capacitor and divert the photo-current to the second integration capacitor in response to a voltage across the first integration capacitor exceeding a threshold level, and read-out circuitry coupled to the first integration capacitor and the charge diverting switch and configured to read-out a first voltage sample from the first integration capacitor corresponding to charge accumulated on the first integration capacitor and to read-out a second voltage sample from the second integration capacitor corresponding to charge accumulated on the second integration capacitor.