公开(公告)号：US20220077051A1

公开(公告)日：2022-03-10

申请号：US17015012

申请日：2020-09-08

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Hsin-Hung Chou ,  Chun-Hung Lin

IPC: H01L23/498 ,  H01L23/13 ,  H01L23/00

Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.

公开(公告)号：US20210407946A1

公开(公告)日：2021-12-30

申请号：US17469868

申请日：2021-09-08

Applicant: Winbond Electronics Corp.

Inventor： Jin-Neng Wu ,  Yen-Jui Chu

IPC: H01L23/00

Abstract: Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.

公开(公告)号：US11145596B2

公开(公告)日：2021-10-12

申请号：US16716521

申请日：2019-12-17

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/495 ,  H01L21/50 ,  H01L23/528 ,  H01L21/60

Abstract: A package structure and method of forming the same are provided. The package structure includes a die, a redistribution structure and a conductive pad. The redistribution structure is disposed on and electrically connected to the die. The redistribution structure includes a dielectric film, a conductive line, an adhesive layer and a conductive via. The dielectric film has a first surface and a second surface opposite to each other. The conductive line and the adhesive layer are located between the first surface of the dielectric film and the die. The conductive line is electrically connected to the die, and the adhesive layer laterally surrounds the conductive line. The conductive via penetrates through the dielectric film and the adhesive layer to electrically connect to the conductive line. The conductive pad is electrically connected to the die through the redistribution structure.

公开(公告)号：US10818497B2

公开(公告)日：2020-10-27

申请号：US15681436

申请日：2017-08-21

Applicant: Winbond Electronics Corp.

Inventor： Yen-Jui Chu ,  Hsin-Hung Chou ,  Ming-Chih Tsai

IPC: H01L21/28 ,  H01L23/00 ,  H01L25/065 ,  B81C1/00 ,  H01L21/3213 ,  H01L29/49

Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.

公开(公告)号：US20180202956A1

公开(公告)日：2018-07-19

申请号：US15594669

申请日：2017-05-15

Applicant: Winbond Electronics Corp.

Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

IPC: G01N27/04 ,  G01N33/00 ,  G08B21/12

CPC classification number: G08B21/12 ,  G01N27/125 ,  G01N33/0036 ,  G08B21/14

Abstract: A gas detecting device configured to be attached to a surface includes a substrate, a semiconductor layer, a light-emitting component, a first electrode and a second electrode. The substrate includes a plurality of stacking layers stacked onto one another, and a material of the substrate includes cellulose nanofibrils (CNF). The substrate is formed by 3-D printing, such that a contact surface of the substrate is tightly attached to the surface. The semiconductor layer is formed on the substrate by 3-D printing. The light-emitting component is disposed on the substrate. The first electrode is coupled to the semiconductor layer and the light-emitting component. The second electrode is coupled to the semiconductor layer and a ground electrode. The first electrode and the second electrode are both disposed on the semiconductor layer and maintain a gap therebetween. A resistance of the semiconductor layer is changed according to a concentration of a designated gas.

公开(公告)号：US20180160952A1

公开(公告)日：2018-06-14

申请号：US15700196

申请日：2017-09-11

Applicant: Winbond Electronics Corp.

Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

IPC: A61B5/145 ,  A61B5/1468 ,  G01N27/333 ,  C12M1/34 ,  A61B5/00

CPC classification number: A61B5/14546 ,  A61B5/01 ,  A61B5/14507 ,  A61B5/14539 ,  A61B5/1468 ,  A61B5/4312 ,  A61B5/6804 ,  A61B5/6823 ,  C12M41/32 ,  G01N27/06 ,  G01N27/333

Abstract: A sensing device for sensing ion concentration of a solution, including a first substrate, a second substrate, a sensing layer, and two electrodes. The material of the first substrate includes cellulose. The second substrate is located on the first substrate. The sensing layer is located on the second substrate. The two electrodes are separately disposed on the sensing layer to expose the sensing layer and bring a solution in contact with the sensing layer so as to measure the resistance value of the solution and convert the resistance value into the ion concentration of the solution.