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    OLEDs for micro transfer printing
    21.
    发明授权
    OLEDs for micro transfer printing 有权

    公开(公告)号：US11289652B2

    公开(公告)日：2022-03-29

    申请号：US16255596

    申请日：2019-01-23

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

    IPC: H01L51/00 ,  H01L51/56 ,  H01L51/50 ,  H01L27/32 ,  H01L51/52

    Abstract: An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

    DEVICE SOURCE WAFERS WITH PATTERNED DISSOCIATION INTERFACES
    22.
    发明申请
    DEVICE SOURCE WAFERS WITH PATTERNED DISSOCIATION INTERFACES 有权

    公开(公告)号：US20220085235A1

    公开(公告)日：2022-03-17

    申请号：US17531567

    申请日：2021-11-19

    Applicant: X Display Company Technology Limited

    Inventor： Brook Raymond ,  Christopher Andrew Bower ,  Matthew Meitl ,  Ronald S. Cok

    IPC: H01L33/00 ,  H01L33/32 ,  G03F7/20 ,  G03F7/00

    Abstract: A transfer-printable (e.g., micro-transfer-printable) device source wafer comprises a growth substrate comprising a growth material, a plurality of device structures comprising one or more device materials different from the growth material, the device structures disposed on and laterally spaced apart over the growth substrate, each device structure comprising a device, and a patterned dissociation interface disposed between each device structure of the plurality of device structures and the growth substrate. The growth material is more transparent to a desired frequency of electromagnetic radiation than at least one of the one or more device materials. The patterned dissociation interface has one or more areas of relatively greater adhesion each defining an anchor between the growth substrate and a device structure of the plurality of device structures and one or more dissociated areas of relatively lesser adhesion between the growth substrate and the device structure of the plurality of device structures.

    Electrically parallel fused LEDs
    23.
    发明授权
    Electrically parallel fused LEDs 有权

    公开(公告)号：US11265992B2

    公开(公告)日：2022-03-01

    申请号：US17136918

    申请日：2020-12-29

    Applicant: X Display Company Technology Limited

    Inventor： Matthew Meitl ,  Ronald S. Cok ,  Christopher Bower

    IPC: H05B45/52 ,  H01L27/15 ,  G09G3/34 ,  H01L21/66 ,  H01L33/62 ,  H01L27/02 ,  H01L23/52 ,  H05B45/50 ,  H05B45/56

    Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

    ELECTRICALLY PARALLEL FUSED LEDS
    25.
    发明申请
    ELECTRICALLY PARALLEL FUSED LEDS 有权

    公开(公告)号：US20210120650A1

    公开(公告)日：2021-04-22

    申请号：US17136918

    申请日：2020-12-29

    Applicant: X Display Company Technology Limited

    Inventor： Matthew Meitl ,  Ronald S. Cok ,  Christopher Bower

    IPC: H05B45/50 ,  H01L27/15 ,  H01L21/66 ,  H01L33/62 ,  H01L27/02 ,  H01L23/52

    Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

    MULTI-LEVEL MICRO-DEVICE TETHERS
    26.
    发明申请
    MULTI-LEVEL MICRO-DEVICE TETHERS 审中-公开

    公开(公告)号：US20200335381A1

    公开(公告)日：2020-10-22

    申请号：US16921556

    申请日：2020-07-06

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, JR.

    IPC: H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00

    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

    LED optical components
    27.
    发明授权
    LED optical components 有权

    公开(公告)号：US10782002B2

    公开(公告)日：2020-09-22

    申请号：US15796259

    申请日：2017-10-27

    Applicant: X Display Company Technology Limited

    Inventor： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok ,  Brent Fisher

    IPC: F21V7/04 ,  F21V19/00 ,  H01L25/075 ,  F21Y113/10 ,  F21Y115/10 ,  G02B19/00 ,  H01L33/58 ,  H01L33/60

    Abstract: A light-emitting diode (LED) optical component comprises a component substrate and an disposed on the component substrate. The LED emits light when provided with electrical power. An optical element is disposed at least partly in contact with the component substrate such that at least a portion of the emitted light is incident on the optical element. A second optical element can optionally be disposed between the LED and the component substrate or on a side of the component substrate opposite the LED. An LED optical system includes a system substrate on which one or more LED optical components are disposed. The system substrate can be or include one or more optical elements.

    Chiplets with connection posts
    30.
    发明授权
    Chiplets with connection posts 有权

    公开(公告)号：US11495560B2

    公开(公告)日：2022-11-08

    申请号：US16778964

    申请日：2020-01-31

    Applicant: X Display Company Technology Limited

    Inventor： Carl Prevatte ,  Christopher Bower ,  Ronald S. Cok ,  Matthew Meitl

    IPC: H01L23/00 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

    Abstract: A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

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