公开(公告)号：US20150371974A1

公开(公告)日：2015-12-24

申请号：US14743967

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US12043541B2

公开(公告)日：2024-07-23

申请号：US17588932

申请日：2022-01-31

Applicant: X-Celeprint Limited

Inventor： Raja Fazan Gul ,  Ronald S. Cok ,  Steven Kelleher ,  António José Marques Trindade ,  Alin Mihai Fecioru ,  David Gomez ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Matthew Alexander Meitl

IPC: B81B7/00 ,  H01L29/06

CPC classification number: B81B7/0009 ,  B81B7/008 ,  H01L29/0684

Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.

公开(公告)号：US20220162056A1

公开(公告)日：2022-05-26

申请号：US17588932

申请日：2022-01-31

Applicant: X-Celeprint Limited

Inventor： Raja Fazan Gul ,  Ronald S. Cok ,  Steven Kelleher ,  António José Marques Trindade ,  Alin Mihai Fecioru ,  David Gomez ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Matthew Alexander Meitl

IPC: B81B7/00

Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.

公开(公告)号：US20200339414A1

公开(公告)日：2020-10-29

申请号：US16842591

申请日：2020-04-07

Applicant: X-Celeprint Limited

Inventor： Raja Fazan Gul ,  Ronald S. Cok ,  Steven Kelleher ,  António José Marques Trindade ,  Alin Mihai Fecioru ,  David Gomez ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Matthew Alexander Meitl

IPC: B81B7/00

Abstract: A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.

公开(公告)号：US20190148598A1

公开(公告)日：2019-05-16

申请号：US16244860

申请日：2019-01-10

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte, JR.

IPC: H01L33/38 ,  H01L23/538 ,  H01L23/482 ,  H01L33/50 ,  H01L33/60 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H05B33/08 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18 ,  G02B26/04 ,  G02F1/167 ,  G09G3/32 ,  H01L33/58 ,  F21V9/08 ,  H01L27/15 ,  G09G3/22 ,  H05K5/00

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US20190035970A1

公开(公告)日：2019-01-31

申请号：US16137809

申请日：2018-09-21

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

IPC: H01L33/00 ,  H01L33/40 ,  H01L29/78 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/62 ,  H01L33/44 ,  H01L21/683 ,  H01L33/38 ,  H01L33/36

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US20180006186A1

公开(公告)日：2018-01-04

申请号：US15705785

申请日：2017-09-15

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte ,  Salvatore Bonafede

IPC: H01L33/00 ,  H01L21/683 ,  H01L33/62 ,  H01L33/36 ,  H01L33/44

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US20170207364A1

公开(公告)日：2017-07-20

申请号：US15476703

申请日：2017-03-31

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Carl Prevatte, JR. ,  Salvatore Bonafede

IPC: H01L33/00 ,  H01L21/683 ,  H01L33/44 ,  H01L33/62 ,  H01L33/36

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L29/7848 ,  H01L33/007 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/26 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/62 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033

Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

公开(公告)号：US20170103964A1

公开(公告)日：2017-04-13

申请号：US15387389

申请日：2016-12-21

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg

IPC: H01L23/00 ,  B41K3/04 ,  B41F16/00

CPC classification number: B41F16/00 ,  B25J15/00 ,  B41F16/0046 ,  B41F16/006 ,  B41F16/0073 ,  B41K3/04 ,  B41K3/12 ,  H01L21/3065 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67103 ,  H01L21/683 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3171 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83001 ,  H01L2224/83011 ,  H01L2224/83013 ,  H01L2224/83024 ,  H01L2224/832 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10336 ,  H01L2924/10337 ,  H01L2924/10338 ,  H01L2924/1034

Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

公开(公告)号：US20160343772A1

公开(公告)日：2016-11-24

申请号：US15226583

申请日：2016-08-02

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L27/15 ,  G09G3/22 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/50

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.