公开(公告)号：US07940514B2

公开(公告)日：2011-05-10

申请号：US11746813

申请日：2007-05-10

Applicant: Tamio Ikehashi

Inventor： Tamio Ikehashi

IPC: H01G5/00 ,  H01G7/00

CPC classification number: B81B3/0072 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

Abstract: A micro-electro-mechanical system (MEMS) includes a first electrode interposed between a first fixed end and a second fixed end, the first electrode being movable by an actuator element. The MEMS also includes a substrate on which the first and second fixed ends are located. The MEMS further includes a second electrode formed on the substrate to face the first electrode. A shape from the first electrode to the first fixed end and a shape from the first electrode to the second fixed end are asymmetrical, the first electrode to be lowered to the second electrode.

Abstract translation: 微电子机械系统（MEMS）包括插入在第一固定端和第二固定端之间的第一电极，第一电极可由致动器元件移动。 MEMS还包括其上定位有第一和第二固定端的衬底。 MEMS还包括形成在基板上以面对第一电极的第二电极。 从第一电极到第一固定端的形状和从第一电极到第二固定端的形状是不对称的，第一电极被降低到第二电极。

公开(公告)号：US20100285271A1

公开(公告)日：2010-11-11

申请号：US12239281

申请日：2008-09-26

Applicant: Robert C. Davis ,  Richard R. Vanfleet ,  David N. Hutchison

Inventor： Robert C. Davis ,  Richard R. Vanfleet ,  David N. Hutchison

IPC: B32B3/10 ,  B05D1/36 ,  B05D1/32 ,  B29C39/00

CPC classification number: H01J5/18 ,  B81B2201/018 ,  B81B2203/0109 ,  B81C1/00031 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B32/168 ,  C01B2202/20 ,  C01B2202/34 ,  C01B2202/36 ,  Y10T428/24273

Abstract: A carbon nanotube assembly comprises a plurality of carbon nanotubes arranged into a patterned frame and extending from a base of the patterned frame to a face of the patterned frame, the patterned frame having a height of at least about 10 μm or greater. At least one passage extends through or is defined in the patterned frame, the at least one passage extending from the base of the patterned frame to the face of the patterned frame. An interstitial material at least partially fills interstices between at least some of the carbon nanotubes.

Abstract translation: 碳纳米管组件包括布置成图案化框架并从图案化框架的基底延伸到图案化框架的表面的多个碳纳米管，所述图案化框架具有至少约10μm或更大的高度。 至少一个通道在图案化框架中延伸通过或限定在其中，该至少一个通道从图案化框架的底部延伸到图案化框架的表面。 间隙材料至少部分填充至少一些碳纳米管之间的间隙。

公开(公告)号：US20090021884A1

公开(公告)日：2009-01-22

申请号：US12237681

申请日：2008-09-25

Applicant: Shunji Nakamura

Inventor： Shunji Nakamura

IPC: H02N2/04 ,  G02B26/08 ,  G01P15/00

CPC classification number: B81B3/0059 ,  B81B2201/018 ,  B81B2201/047 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/055 ,  B81B2203/056 ,  B81B2203/058

Abstract: A movable device simultaneously enabling reduction of size down to the submicron level, higher speed operation, a streamlined production process, low costs, and greater reliability. A movable device provided with bottom electrodes and a basic conductive layer fixed to a substrate, an elastic shaft of a carbon nanotube with a bottom end fixed on the basic conductive layer and standing up, and a top structure including a top electrode spaced away from the bottom electrode and fixed to a top end of the elastic shaft, wherein when applying voltage between a bottom electrode and the top electrode, the top electrode displaces relatively to the bottom electrodes within an allowable range of elastic deformation of the elastic shaft.

Abstract translation: 可移动装置同时能够将尺寸减小到亚微米级，更高的速度操作，简化的生产过程，低成本和更高的可靠性。 一种可移动装置，其具有底部电极和固定在基板上的基本导电层，碳纳米管的弹性轴，其底端固定在基本导电层上并竖立起来，顶部结构包括顶部电极， 底部电极并固定到弹性轴的顶端，其中当在底部电极和顶部电极之间施加电压时，顶部电极在弹性轴的弹性变形的允许范围内相对于底部电极移位。

公开(公告)号：US20080061387A1

公开(公告)日：2008-03-13

申请号：US11519142

申请日：2006-09-11

Applicant: Flavio Pardo

Inventor： Flavio Pardo

IPC: H01L29/82

CPC classification number: H01H61/04 ,  B81B3/0024 ,  B81B2201/018 ,  H01H2001/0047 ,  H01H2061/006 ,  H01H2061/008

Abstract: A micro-electromechanical actuator employs metal for the hot arm and silicon for at least the flexible portion of the cold arm. The cold arm made of silicon is coupled to a metal wire that moves with it and is used to carry the signal to be switched when at least two of such actuators are formed into a switch. Arrays of such switches on a first chip may be cooperatively arranged with a second chip that is flip-chip bonded to the first chip, the second chip having thereon wires routing the electrical control currents to the various hot arms for heating them as well as the signals to be switched by the various switches.

Abstract translation: 微机电致动器至少将冷臂的柔性部分用于热臂和硅的金属。 由硅制成的冷臂联接到与其一起移动的金属线，并且当至少两个这样的致动器形成开关时，用于承载要切换的信号。 第一芯片上的这种开关的阵列可以与倒装芯片接合到第一芯片的第二芯片协同地布置，第二芯片具有将电控制电流路由到各种热臂以加热它们的电线， 信号由各种开关切换。

公开(公告)号：US07339446B2

公开(公告)日：2008-03-04

申请号：US11153998

申请日：2005-06-16

Applicant: Jun Su ,  Dong S. Shim ,  Oing Ma ,  Valluri R. Rao

Inventor： Jun Su ,  Dong S. Shim ,  Oing Ma ,  Valluri R. Rao

IPC: H03H7/01 ,  H03H2/00 ,  H03H1/00 ,  H04B1/40

CPC classification number: H03H7/0153 ,  B81B7/02 ,  B81B2201/018 ,  B81B2201/0271 ,  H01P1/203 ,  H03H7/1758 ,  H03H7/1766 ,  H03H7/1783 ,  H03H7/1791 ,  H03H2007/006 ,  H03H2007/013 ,  H03H2210/015

Abstract: According to an embodiment of the present invention, a microelectromechanical system (MEMS) element tunes a resonator to a frequency.

Abstract translation: 根据本发明的实施例，微机电系统（MEMS）元件将谐振器调谐到频率。

公开(公告)号：US20070262400A1

公开(公告)日：2007-11-15

申请号：US11746813

申请日：2007-05-10

Applicant: Tamio Ikehashi

Inventor： Tamio Ikehashi

IPC: H01L29/84

CPC classification number: B81B3/0072 ,  B81B2201/018 ,  H01G5/16 ,  H01H59/0009

Abstract: A MEMS includes a first fixed end, a second fixed end, a first electrode, and an actuator element. The first electrode interposes between the first fixed end and the second fixed end. The first electrode is movable by the actuator element. A shape from the first electrode to the first fixed end and a shape from the first electrode to the second fixed end are asymmetrical.

Abstract translation: MEMS包括第一固定端，第二固定端，第一电极和致动器元件。 第一电极介于第一固定端和第二固定端之间。 第一电极可由致动器元件移动。 从第一电极到第一固定端的形状和从第一电极到第二固定端的形状是不对称的。

公开(公告)号：US20070009203A1

公开(公告)日：2007-01-11

申请号：US11532689

申请日：2006-09-18

Applicant: Rogier Receveur ,  Philippe Habets ,  Ralph Danzl ,  Richard Houben ,  Michael Mattes

Inventor： Rogier Receveur ,  Philippe Habets ,  Ralph Danzl ,  Richard Houben ,  Michael Mattes

IPC: G02B6/26

CPC classification number: H01H59/0009 ,  B81B3/0054 ,  B81B2201/018 ,  B81B2203/051 ,  H01H2001/0042 ,  H01H2001/0078 ,  Y10T29/49105

Abstract: A micro electromechanical (MEMS) switch suitable for use in medical devices is provided, along with methods of producing and using MEMS switches. In one aspect, a micro electromechanical switch including a moveable member configured to electrically cooperate with a receiving terminal is formed on a substrate. The moveable member and the receiving terminal each include an insulating layer proximate to the substrate and a conducting layer proximate to the insulating layer opposite the substrate. In various embodiments, the conducting layers of the moveable member and/or receiving terminal include a protruding region that extends outward from the substrate to switchably couple the conducting layers of the moveable member and the receiving terminal to thereby form a switch. The switch may be actuated using, for example, electrostatic energy.

Abstract translation: 提供了适用于医疗设备的微机电（MEMS）开关，以及生产和使用MEMS开关的方法。 一方面，在基板上形成包括被配置为与接收端子电配合的可移动部件的微机电开关。 可移动构件和接收端子各自包括靠近衬底的绝缘层和靠近与衬底相对的绝缘层的导电层。 在各种实施例中，可移动构件和/或接收端子的导电层包括从基板向外延伸的可突出地连接可移动构件和接收端子的导电层从而形成开关的突出区域。 可以使用例如静电能来致动开关。

公开(公告)号：US20060290445A1

公开(公告)日：2006-12-28

申请号：US11153998

申请日：2005-06-16

Applicant: Jun Su ,  Dong Shim ,  Oing Ma ,  Valluri Rao

Inventor： Jun Su ,  Dong Shim ,  Oing Ma ,  Valluri Rao

IPC: H03H9/70 ,  H03H9/56

CPC classification number: H03H7/0153 ,  B81B7/02 ,  B81B2201/018 ,  B81B2201/0271 ,  H01P1/203 ,  H03H7/1758 ,  H03H7/1766 ,  H03H7/1783 ,  H03H7/1791 ,  H03H2007/006 ,  H03H2007/013 ,  H03H2210/015

Abstract: According to an embodiment of the present invention, a microelectromechanical system (MEMS) element tunes a resonator to a frequency.

Abstract translation: 根据本发明的实施例，微机电系统（MEMS）元件将谐振器调谐到频率。

公开(公告)号：US06917086B2

公开(公告)日：2005-07-12

申请号：US10817270

申请日：2004-04-02

Applicant: Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

Inventor： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01L29/82 ,  H01L21/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.

Abstract translation: 三层梁MEMS器件及相关方法。 根据一个实施例，提供一种制造三层梁的方法。 该方法可以包括在衬底上沉积牺牲层并在牺牲层上沉积第一导电层。 该方法还可以包括通过去除第一导电层的一部分来形成第一导电微结构。 此外，该方法可以包括在第一导电微结构，牺牲层和衬底上沉积结构层，并且通过结构层将通孔形成到第一导电微结构。 此外，该方法可以包括以下：在结构层和通孔中沉积第二导电层; 通过去除所述第二导电层的一部分来形成第二导电微结构，其中所述第二导电微结构通过所述通孔与所述第一导电微结构电连通; 以及去除足够量的牺牲层以便将第一导电微结构与衬底分开，其中结构层在第一端由衬底支撑并且在相对的第二端处自由地悬挂在衬底上方。

公开(公告)号：US06882264B2

公开(公告)日：2005-04-19

申请号：US10290807

申请日：2002-11-08

Applicant: Shawn Jay Cunningham

Inventor： Shawn Jay Cunningham

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01H37/52 ,  H02N2/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。