Abstract:
A display device capable of operating at high speed and with low power consumption is provided. A miniaturized display device occupying a small area is also provided. The display device includes a support; a display portion which includes a pixel; a light-blocking unit which is in the support and includes a light-blocking layer having a first opening overlapping with at least part of the pixel, and a movable light-blocking layer blocking light passing through the first opening; a transistor which is electrically connected to the light-blocking unit and includes an oxide semiconductor film; and a capacitor electrically connected to the transistor.
Abstract:
A method for manufacturing a sloped structure is disclosed. The method includes the steps of: (a) forming a sacrificial film above a substrate; (b) forming a first film above the sacrificial film, the first film having a first portion connected to the substrate, a second portion located above the sacrificial film, a third portion located between the first portion and the second portion, and a thin region in a portion of the third portion or in a boundary section between the second portion and the third portion and having a thickness smaller than the first portion; (c) removing the sacrificial film; and (d) bending the first film in the thin region, after the step (c), thereby sloping the second portion of the first film with respect to the substrate.
Abstract:
As discussed herein, there is presented an apparatus comprising micro-posts. The apparatus includes a substrate having a planar surface, a plurality of micro-posts located on the planar surface, wherein each micro-post has a base portion on the planar surface and a post portion located on a top surface of the corresponding base portion, and wherein side surfaces of the base portions intersect the planar surface at oblique angles.
Abstract:
Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.
Abstract:
A mirror axis (MA) is displaced by deformation of a holder (HD) and with resonance of an optical scanner (LS) itself according to the frequency of a voltage applied to a piezoelectric element (PE). The frequency of the applied voltage for causing a resonance deforms the holder (HD) so as to generate at least one node intersecting with respect to the length of the holder (HD) itself.
Abstract:
A micro-electro-mechanical systems (MEMS) autofocus actuator having a support member for supporting a lens element, the support member including a stationary portion and a movable portion, the movable portion attached to the stationary portion by a movable support beam. An electrostatic drive member is attached to the stationary portion and the movable portion to drive movement of the movable portion with respect to the stationary portion. A lens holder is suspended within the support member by a resilient arm member attached to the movable portion and a deflection beam attached to the stationary portion so that in a non-actuated state, the lens element is in a first focal position that is substantially out-of-plane with respect to the stationary portion, and in an actuated state, the lens element is in a second focal position, the second focal position being different from the first focal position.
Abstract:
This disclosure provides systems, methods and apparatus for electromechanical systems (EMS) device packages having integrated sensors. In one aspect, electrodes within a packaged EMS device can be used in conjunction with an electrode disposed on another substrate within the EMS device package to form one or more capacitive sensors. The capacitive sensor may be used to determine the relative deformation of substrates within the EMS device package, which can in turn be used as part of a pressure, touch, mass, or impact measuring system.
Abstract:
This disclosure provides systems, methods, and apparatus for an electromechanical systems (EMS) device with one or more protrusions connected to a surface of the EMS device. In one aspect, the EMS device includes a substrate, a stationary electrode over the substrate, and a movable electrode over the stationary electrode. The movable electrode is configured to move to three or more positions across a gap by electrostatic actuation between the movable electrode and the stationary electrode. When the protrusions contact any surface of the EMS device at one of the positions across the gap, the protrusions change the stiffness of the EMS device. At least one of the surfaces in contact with the one or more protrusions is non-rigid. In some implementations, the protrusions have a height greater than about 20 nm.
Abstract:
In accordance with the disclosure, a MEMS substrate is provided that includes: a central planar portion configured to support a MEMS device; and a first electrical pad coplanar with the central planar portion, the first pad being connected to the central planar portion through a first flexure, wherein the first flexure is configured to substantially mechanically isolate the first electrical pad from the central planar portion.
Abstract:
A method for determining a minimum tension compensation stress which will have a membrane of a thickness of less than or equal to one micrometer, secured to a frame, having, in the absence of any external stress, a desired deflection. The membrane can be made as planar as possible in absence of any external stress, and its thickness can be less than or equal to one micrometer.