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公开(公告)号：US11808644B2
公开(公告)日：2023-11-07
申请号：US18081255
申请日：2022-12-14
Applicant: NEXTINPUT, Inc.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
CPC classification number: G01L1/16 , G01L1/18 , G01L5/0028 , B81B3/0072
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
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公开(公告)号：US20230339741A1
公开(公告)日：2023-10-26
申请号：US17726935
申请日：2022-04-22
Applicant: Rosemount Aerospace Inc.
Inventor： John C. Christenson
IPC: B81B3/00 , G01L1/14 , H01L41/113 , B81C1/00 , G01L1/18
CPC classification number: B81B3/0021 , B81C1/00269 , G01L1/142 , G01L1/18 , H01L41/1132 , B81B2203/019
Abstract: A stress-sensitive device includes a substrate having a first surface with a cavity defined therein and a three-dimensional deformable material extending along the first surface and into the cavity. The three-dimensional deformable material has an electrical characteristic responsive to deformation. A method of forming a three-dimensional stress-sensitive device includes providing a substrate having a first surface and a second surface opposite the first surface, forming a cavity in the substrate, wherein the cavity is open to the first surface, depositing a sacrificial layer in the cavity, depositing a deformable material on the sacrificial layer, and removing at least a portion of the sacrificial layer to form an interstitial space between the deformable material and the substrate in the cavity.
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公开(公告)号：US20230236074A1
公开(公告)日：2023-07-27
申请号：US17941796
申请日：2022-09-09
Inventor： Woo Seok YANG , Kyung Soo CHO , Sung Hoon HONG
IPC: G01L1/18
CPC classification number: G01L1/18
Abstract: Disclosed herein to a strain sensor and a method for fabricating the strain sensor. According to an embodiment of the present disclosure, there is provided a strain sensor. The strain sensor comprising: a stretchable piezoresistor formed by a composite of a conducting nanocarbon filler distributed within a matrix of an insulating elastomer; and a stretchable electrode which is formed by a composite of a metal filler distributed within the matrix of the insulating elastomer and is partially inserted into both ends of the stretchable piezoresistor, wherein resistance increases due to a longitudinal tensile strain of the piezoresistor.
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公开(公告)号：US11662261B2
公开(公告)日：2023-05-30
申请号：US17644375
申请日：2021-12-15
Applicant: MINEBEA MITSUMI Inc.
Inventor： Shinya Yamaguchi
Abstract: A sensor chip includes multiple sensing blocks each of which includes two or more T-patterned beam structures. Each T-patterned beam structure includes strain-detecting elements, at least one first detection beam, and a second detection beam extending from the first detection beam in a direction perpendicular to the first detection beam. Each T-patterned beam structure includes a connection portion formed by coupling ends of second detection beams in respective T-patterned structures, the connection portion including a force point portion. The sensor chip is configured to detect up to six axes relating to predetermined axial forces or moments around the predetermined axes, based on a change in an output of each of the strain-detecting elements, the output of each strain-detecting element changing in accordance with an input applied to a given force point portion.
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公开(公告)号：US20190252556A1
公开(公告)日：2019-08-15
申请号：US15895513
申请日：2018-02-13
Applicant: STMicroelectronics S.r.l.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Marco Omar Ghidoni
CPC classification number: H01L29/84 , G01L1/18 , H01L23/047 , H01L23/06 , H01L23/10 , H01L24/05 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L29/0657 , H01L29/16 , H01L2224/04042 , H01L2224/29111 , H01L2224/29117 , H01L2224/29139 , H01L2224/29144 , H01L2224/32245 , H01L2224/33181 , H01L2224/48105 , H01L2224/48155 , H01L2224/73215 , H01L2224/73265 , H01L2924/01032
Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.
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Patent Agency Ranking
公开(公告)号：US20190011316A1
公开(公告)日：2019-01-10
申请号：US15745196
申请日：2016-07-09
Applicant: Jan KLEMM
Inventor： Jan KLEMM
CPC classification number: G01L1/2262 , G01L1/18 , G01L1/20 , G01L1/2281 , G01L1/26
Abstract: A device for electrically measuring a force includes a load cell having a first metal electrode and a second metal electrode disposed opposite thereof in the direction of the force, each having contact surfaces in which the force to be measured can be impressed, and electrical resistance in the range of a few milliohms to less than or equal to ten ohms and a mean roughness value (Ra) of less than or equal to 400 nanometers, for forming force-independent conductivity, a thin insulating film disposed between the first and second metal electrodes in a form-locked manner, a reference metal electrode disposed on a section of the thin insulating film such that it is force-decoupled from the first metal electrode and tensioned with respect to the second metal electrode at a constant retaining force by a fastening element, and a measuring circuit designed as a half bridge or a full bridge.
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公开(公告)号：US20180356388A1
公开(公告)日：2018-12-13
申请号：US15781924
申请日：2016-11-14
Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE
Inventor： Kota SHIBA , Genki YOSHIKAWA , Gaku IMAMURA
Abstract: Provided is a sensor which enables detection/identification of various types of fuels for automobiles by using simple devices. According to the present invention, high-octane gas, regular gas, diesel oil, heating oil, gasoline laced with heating oil, and the like can be clearly identified without using a large-scale analysis such as gas chromatography or mass spectroscopy by using a sensor having a structure in which a surface of a sensor body which detects a surface stress or the like is coated with particles modified with a hydrocarbon group such as an alkyl group.
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公开(公告)号：US20180313866A1
公开(公告)日：2018-11-01
申请号：US15958373
申请日：2018-04-20
Applicant: Shinya YAMAGUCHI , Tomohito TAKI
Inventor： Shinya YAMAGUCHI , Tomohito TAKI
CPC classification number: G01L5/162 , G01L1/18 , G01L1/2225 , G01L1/2268 , G01L1/2281 , G01L5/228
Abstract: A force sensor includes a sensor chip that detects displacements in multiple axial directions, and a strain body that transfers force applied thereto to the sensor chip. The strain body includes a sensor chip mount on which the sensor chip is mounted, multiple columns disposed around and apart from the sensor chip mount, and connecting beams via which the sensor chip mount is fixed to the columns.
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公开(公告)号：US20180299335A1
公开(公告)日：2018-10-18
申请号：US15753147
申请日：2016-07-08
Inventor： Man WONG , Kevin CHAU
CPC classification number: G01L1/18 , B81B7/02 , B81B2201/0292 , B81B2203/0109 , B81B2203/0118 , B81B2203/0315 , B81C1/00547 , B81C2201/0132 , B81C2201/0133 , B81C2201/0176 , G01B7/18 , G01B7/20 , G01L1/26
Abstract: The present invention is related to a sensor. In particular, the present invention is related to a MEMS strain gauge die and its fabrication process. The MEMS strain gauge die comprises a handle, a device layer and a cap all connected together. A silicon oxide layer is formed between the handle and the device layer. Another silicon oxide layer is formed between the device layer and the cap. Recesses are respectively formed on the handle and the cap and face each other. The handle recess and the cap recess are connected to form a cavity. The device layer, which spans the cavity, further comprises a bridge on which a plurality of piezoresistive sensing elements are formed. The present strain gauge die is more immune to temperature effects. It is especially suitable for operating in a high temperature environment and is capable of delivering accurate and reliable strain measurements at low cost.
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公开(公告)号：US20180267668A1
公开(公告)日：2018-09-20
申请号：US15983098
申请日：2018-05-18
Applicant: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
Inventor： Feng Lu , Qijun Yao , Liang Liu , Conghua Ma , Shaolong Ma
CPC classification number: G06F3/0416 , G01L1/18 , G01L1/2262 , G06F3/0412 , G06F3/0418 , G06F2203/04105 , G11C19/00
Abstract: The present disclosure provides display panel and display device. By adjusting positions of the input signal line and the output signal line of the force sensor, the problem that output signal of the force sensor in the existing display panel is interfered by signal transmitted on the peripheral circuit wirings. Non-display area of the display panel is provided with force sensor and driving circuit; the distance between an orthographic projection of the first output signal line of the force sensor on the display panel and an orthographic projection of the driving circuit input line on the display panel is at least 30 μm; and the distance between an orthographic projection of the second output signal line of the force sensor on the display panel and the orthographic projection of the driving circuit input line on the display panel is at least 30 μm.
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