公开(公告)号：US20130040153A1

公开(公告)日：2013-02-14

申请号：US13588881

申请日：2012-08-17

Applicant: Daisuke FUJIMOTO ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

Inventor： Daisuke FUJIMOTO ,  Yasuyuki Mizuno ,  Kazutoshi Danjoubara ,  Hikari Murai

IPC: C09D109/00 ,  B32B15/08 ,  H05K3/00

CPC classification number: H05K1/0353 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/726 ,  B32B2457/08 ,  C08J3/246 ,  C08J5/24 ,  C08J2387/00 ,  C08K3/013 ,  C08L9/00 ,  C08L15/00 ,  C08L21/00 ,  C08L47/00 ,  C08L71/00 ,  C08L71/12 ,  H05K1/024 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31696 ,  C08L2666/14

Abstract: A thermosetting resin varnish that includes a thermosetting resin composition of an uncured semi-IPN composite having compatibilized with one another (A) a polyphenylene ether, (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified, and (C) a crosslinking agent; (D) an inorganic filler; and (E) a saturated thermoplastic elastomer. Also, a resin varnish for a printed circuit board, a prepreg, and a metal-clad laminate, using the thermosetting resin varnish.

Abstract translation: 一种热固性树脂清漆，其包含彼此相容的未固化的半IPN复合材料的热固性树脂组合物（A）聚苯醚，（B）在其分子中含有40％以上的1,2- - 丁二烯单元在其侧链中具有1,2-乙烯基，并且不经化学改性，和（C）交联剂; （D）无机填料; 和（E）饱和热塑性弹性体。 另外，使用该热固性树脂清漆的印刷电路板用树脂清漆，预浸料坯和覆金属层压板。

公开(公告)号：US20130034725A1

公开(公告)日：2013-02-07

申请号：US13649333

申请日：2012-10-11

Applicant: World Properties, Inc.

Inventor： Sankar K. Paul

IPC: B32B7/12 ,  B32B15/06 ,  B32B33/00 ,  B32B15/085

CPC classification number: C09J107/00 ,  B32B7/12 ,  B32B15/14 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L71/126 ,  C08L2666/08 ,  C08L2666/14 ,  C09J171/12 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0355 ,  Y10T428/273 ,  Y10T428/2804 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/31696 ,  Y10T428/31855

Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.

Abstract translation: 一种电路材料，包括导电金属层或介电电路衬底层和设置在导电金属层或介电衬底层上的粘合剂层，其中粘合剂包括聚（亚芳基醚）和聚丁二烯或聚异戊二烯聚合物。

公开(公告)号：US20130000843A1

公开(公告)日：2013-01-03

申请号：US13615167

申请日：2012-09-13

Applicant: Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

Inventor： Yasuyuki MIZUNO ,  Daisuke FUJIMOTO ,  Kazutoshi DANJOBARA ,  Hikari MURAI

IPC: C08L47/00 ,  H05K3/46 ,  C08K3/36 ,  H05K3/00 ,  C08K5/03 ,  C08K5/3417

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08277948B2

公开(公告)日：2012-10-02

申请号：US12279571

申请日：2007-02-14

Applicant: Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

Inventor： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC: B32B15/08

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US08187696B2

公开(公告)日：2012-05-29

申请号：US12504996

申请日：2009-07-17

Applicant: Sankar K. Paul ,  Christopher J. Caisse ,  Dirk M. Baars ,  Allen F. Horn, III

Inventor： Sankar K. Paul ,  Christopher J. Caisse ,  Dirk M. Baars ,  Allen F. Horn, III

IPC: B32B15/00

CPC classification number: H05K1/0373 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T156/10 ,  Y10T428/24612 ,  Y10T428/24917 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257

Abstract: A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Abstract translation: 一种电路基板层叠体，包括导电金属层; 介电复合材料的介电常数小于约3.5，损耗因数小于约0.006，其中介电复合材料包括聚合物树脂; 和约10至约70体积％的三氧化二铁含量小于或等于3重量％的空心微球。

公开(公告)号：US08129823B2

公开(公告)日：2012-03-06

申请号：US11986998

申请日：2007-11-27

Applicant: Ravindra V. Tanikella

Inventor： Ravindra V. Tanikella

IPC: H01L23/58 ,  H01L23/52

CPC classification number: H01L23/49894 ,  C08F283/04 ,  C08G73/121 ,  C08K3/36 ,  C08K9/10 ,  C08K2201/011 ,  C08L79/08 ,  C08L2666/66 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/15787 ,  H01L2924/15791 ,  H01L2924/18161 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/28 ,  H05K3/421 ,  H05K3/422 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/1163 ,  H05K2203/121 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Abstract translation: 用于微电子封装的高度可靠的互连。 在一个实施例中，积聚互连中的电介质层具有玻璃化转变温度的等级; 并且稍后施加的电介质层在低于较早施加的电介质层的玻璃化转变温度的温度下被层压。 在一个实施方案中，通过热固化工艺增加了积聚互连中早期施加的介电膜的玻璃化转变温度，以超过用于层压后来施加的电介质膜的温度。 在一个实施方案中，在层压聚酰亚胺材料的膜（例如通过催化剂的密封剂的光化学或热降解）之后，形成具有嵌入催化剂以促进交联的聚酰亚胺材料。 在一个实施例中，阻焊剂开口壁具有通过激光辅助接种产生的可湿性层，使得阻焊剂开口壁之间没有间隙，并且在阻焊剂开口中没有底部填充物。

公开(公告)号：US20110008636A1

公开(公告)日：2011-01-13

申请号：US12919999

申请日：2009-03-02

Applicant: Takashi Kiuchi ,  Kiyoshige Kojima

Inventor： Takashi Kiuchi ,  Kiyoshige Kojima

IPC: B32B27/08 ,  B32B27/00 ,  C08K5/14

CPC classification number: H05K1/0326 ,  C08J5/24 ,  C08J2365/00 ,  C08K5/14 ,  C08K5/159 ,  C08L65/00 ,  H05K2201/0158 ,  Y10T428/31913

Abstract: There is provided a curable resin composition comprising a cycloolefin polymer and a cyclic peroxide which has a cyclic structure and a peroxy structure in the cyclic structure. There is also provided a laminate obtained by using a molded article which is obtained by forming the curable resin composition into a sheet shape or a prepreg which is obtained by impregnating the curable resin composition into a reinforcing fiber.

Abstract translation: 提供一种包含在环状结构中具有环状结构和过氧结构的环状烯烃聚合物和环状过氧化物的固化性树脂组合物。 还提供了一种通过使用通过将固化性树脂组合物形成为片状而获得的成型体或通过将固化性树脂组合物浸渍到增强纤维中而获得的预浸料而获得的层压体。

公开(公告)号：US07820274B2

公开(公告)日：2010-10-26

申请号：US11755374

申请日：2007-05-30

Applicant: Toshihiro Ohta ,  Tomiho Yamada ,  Shigeru Asami

Inventor： Toshihiro Ohta ,  Tomiho Yamada ,  Shigeru Asami

IPC: B32B3/00

CPC classification number: C08J5/24 ,  B32B15/08 ,  B32B27/04 ,  B32B27/12 ,  C08J2351/04 ,  C08L51/006 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0158 ,  Y10S428/901 ,  Y10T428/12028 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T442/2992 ,  C08L2666/02

Abstract: A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

Abstract translation: 具有低介电常数，低介电损耗和高耐热循环电阻的预浸料。 预浸料包括片状预成型体和粘附到片状预成型体上的树脂浸渍的片状纤维增强材料的热压力。 片状预成型体包括接枝共聚物（a），其中将15〜40质量份芳族乙烯基单体接枝至60〜85质量份的无规或嵌段共聚物，其包含选自非极性α-烯烃单体的单体单元 和非极性共轭二烯单体。 树脂浸渍的片状纤维增强材料包括片状纤维增强材料（b1）和热塑性树脂（b2），其中浸渍有片状纤维增强材料（b1）。 热塑性树脂（b2）是选自非极性α-烯烃单体和非极性共轭二烯单体的60〜90质量％的单体单元和10〜40质量％的芳香族乙烯基单体的无规嵌段共聚物 单元。

公开(公告)号：US20100233495A1

公开(公告)日：2010-09-16

申请号：US12279571

申请日：2007-02-14

Applicant: Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

Inventor： Yasuyuki Mizuno ,  Daisuke Fujimoto ,  Kazutoshi Danjobara ,  Hikari Murai

IPC: C08L71/12 ,  C08L73/00 ,  B32B15/08

CPC classification number: H05K1/0353 ,  C08J3/243 ,  C08J5/24 ,  C08K5/14 ,  C08L9/00 ,  C08L71/12 ,  C08L79/085 ,  C08L2205/04 ,  H05K2201/0158 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/31696 ,  Y10T428/31931 ,  C08L2666/14 ,  C08L2666/24 ,  C08L2666/04

Abstract: Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil.The present invention relates to a thermosetting resin composition of a semi-IPN composite, comprising (A) a polyphenylene ether, and a prepolymer formed from (B) a chemically unmodified butadiene polymer containing 40% or more of a 1,2-butadiene unit having a 1 2,-vinyl group in a side chain of a molecule and (C) a crosslinking agent, in a compatibilized and uncured state; and a resin varnish, a prepreg and a metal clad laminated board using the same.

Abstract translation: 提供一种可用于制造印刷电路板的热固性树脂组合物，其在高频带中具有良好的介电性能，可以显着降低传输损耗，具有优异的吸湿性和热膨胀性能之后的耐热性，并满足剥离 树脂组合物与金属箔之间的强度。 本发明涉及一种半IPN复合材料的热固性树脂组合物，其包含（A）聚苯醚和由（B）含有40％以上1,2-丁二烯单元的化学未改性丁二烯聚合物形成的预聚物 在分子的侧链中具有12个 - 乙烯基，和（C）交联剂，其相容化和未固化状态; 树脂清漆，预浸料和使用该树脂清漆的金属包覆层压板。

公开(公告)号：US20100108367A1

公开(公告)日：2010-05-06

申请号：US12443427

申请日：2007-09-28

Applicant: Tomoya Furushita

Inventor： Tomoya Furushita

IPC: H05K1/00 ,  C08K5/521 ,  C08K5/3492 ,  B05D3/02 ,  B32B27/32 ,  B32B27/36 ,  B32B27/06 ,  B32B5/00 ,  B32B37/00

CPC classification number: C08L65/00 ,  C08F283/002 ,  C08F283/14 ,  C08G2261/418 ,  C08G2261/76 ,  C08J5/10 ,  C08J5/24 ,  C08J2365/00 ,  C08K3/32 ,  C08K5/34928 ,  C08K5/5205 ,  C08L51/08 ,  H05K3/4661 ,  H05K2201/012 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0278 ,  Y10T156/10 ,  Y10T428/27 ,  Y10T428/31797 ,  Y10T428/31938 ,  C08F222/06

Abstract: A curable resin composition comprising: 100 parts by weight of an alicyclic olefin polymer (A); from 1 to 100 parts by weight of a curing agent (B); from 10 to 50 parts by weight of a salt (C) of a basic nitrogen-containing compound with a phosphoric acid; and from 0.1 to 40 parts by weight of a condensed phosphate ester (D); of which phosphorus element content is not less than 1.5% by weight. The composition can provide a molded body or composite body which excels in a moisture resistance, a flame retardancy, a smoothness of the surface, and an electric insulation property and a cracking resistance, and hardly generates a harmful substance in burning. A multilayered circuit board is obtained by molding the composition into a sheet; laminating the sheet on an inner layer board; curing the laminated sheet to form an electric insulating layer; and forming an electric conducting layer on the electric insulating layer.

Abstract translation: 一种可固化树脂组合物，其包含：100重量份的脂环族烯烃聚合物（A）; 1至100重量份的固化剂（B）; 10〜50重量份的碱式含氮化合物与磷酸的盐（C）; 和0.1至40重量份的缩合磷酸酯（D）; 其中磷元素含量不小于1.5重量％。 该组合物可以提供耐湿性，阻燃性，表面平滑性以及电绝缘性和耐龟裂性优异的成型体或复合体，在燃烧时几乎不产生有害物质。 通过将组合物成型为片材而获得多层电路板; 将片材层压在内层板上; 固化层压片以形成电绝缘层; 以及在所述电绝缘层上形成导电层。