公开(公告)号：US20020014615A1

公开(公告)日：2002-02-07

申请号：US09460389

申请日：1999-12-13

Inventor： YUKIO YAMADA ,  MIKIO SAKAIRI ,  YASUSHI AKUTSU ,  TOMOYUKI ISHIMATSU

IPC: H01B001/02 ,  H01B001/00

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0307 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive film capable of maintaining a high connection reliability on connection electrodes with a fine pitch on which an oxide film is formed. The anisotropic conductive adhesive film 1 comprises conductive particles 7 dispersed in an insulating binder 6. Each conductive particle 7 consists of a styrene resin particle 71 and a thin metal film 72 formed on the surface thereof by gold-plating, etc. Projections 72a are formed on the surface of the thin metal film 72 of the conductive particle 7.

Abstract translation: 能够在形成有氧化膜的细间距的连接电极上保持高连接可靠性的各向异性导电粘合膜。 各向异性导电粘合膜1包括分散在绝缘粘合剂6中的导电粒子7.每个导电粒子7由苯乙烯树脂粒子71和通过镀金等形成在其表面上的薄金属膜72组成。形成突起72a 在导电性粒子7的薄金属膜72的表面上。

公开(公告)号：US20010030019A1

公开(公告)日：2001-10-18

申请号：US09800718

申请日：2001-03-08

Applicant: SONY CHEMICALS CORP.

Inventor： Masao Saitoh

IPC: B32B031/00

CPC classification number: B32B37/144 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2307/54 ,  B32B2307/706 ,  B32B2379/08 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0129 ,  H05K2201/0221 ,  H05K2201/0233

Abstract: An anisotropically electroconductive connecting material, which is disposed between a connection terminal on a first substrate and a connection terminal on a second substrate and joins the substrates together by thermocompression bonding while maintaining electroconductive connection therebetween, includes electroconductive particles dispersed in an insulating adhesive, wherein the modulus of elasticity of the electroconductive particles at the compression bonding temperature is 200% or less of the modulus of elasticity of the first substrate at the compression bonding temperature.

Abstract translation: 设置在第一基板上的连接端子和第二基板上的连接端子之间的各向异性导电连接材料，并且通过热压接合将基板连接在一起，同时保持其间的导电连接，包括分散在绝缘粘合剂中的导电颗粒，其中， 导电性粒子在压接温度下的弹性模量为第一基材在压接温度下的弹性模量的200％以下。

公开(公告)号：US5502891A

公开(公告)日：1996-04-02

申请号：US270675

申请日：1994-07-05

Applicant: Hideo Mori ,  Hiroshi Takabayashi ,  Masanori Takahashi

Inventor： Hideo Mori ,  Hiroshi Takabayashi ,  Masanori Takahashi

IPC: G02F1/1345 ,  G02F1/13 ,  H01B7/00 ,  H05K3/32 ,  H05K3/36 ,  H05K3/34 ,  H01R43/00

CPC classification number: H05K3/323 ,  H01R12/714 ,  H05K3/361 ,  G02F1/13452 ,  H01L2224/293 ,  H05K2201/0233 ,  H05K2201/0394 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49201

Abstract: A method of forming an electrical connection from a drive circuit to an electrical device is provided. An electrical connection structure includes: electrodes formed on a device side, electrodes formed on a flexible film carrier having an electrode pattern connected to a drive circuit; and an anisotropic conductive film having metal particles or metal plated particles dispersed therein, interposed between the electrodes on the device side and the electrodes on the flexible film carrier, for electrically connecting the electrodes facing each other through thermocompression bonding. The electrodes, on the flexible film carrier are exposed by removing the flexible film at an electrical connection area, and the length of each exposed electrode is from 1.5 mm to 2.5 mm.

Abstract translation: 提供了从驱动电路到电气设备形成电连接的方法。 电连接结构包括：在器件侧形成的电极，形成在具有连接到驱动电路的电极图案的柔性膜载体上的电极; 以及介于器件侧的电极和柔性膜载体上的电极之间分散有金属颗粒或金属电镀粒子的各向异性导电膜，用于通过热压接将电极彼此电连接。 柔性膜载体上的电极通过在电连接区域移除柔性膜而暴露，并且每个暴露电极的长度为1.5mm至2.5mm。

公开(公告)号：US5162087A

公开(公告)日：1992-11-10

申请号：US753198

申请日：1991-08-30

Applicant: Hidemoto Fukuzawa ,  Tatsuhiro Imai ,  Yasuhiro Okada ,  Noriyuki Ousaka

Inventor： Hidemoto Fukuzawa ,  Tatsuhiro Imai ,  Yasuhiro Okada ,  Noriyuki Ousaka

IPC: C09J135/00 ,  C08K9/08 ,  C09J1/02 ,  C09J9/02 ,  C09J133/04 ,  C09J133/08 ,  C09J201/00 ,  H01B1/22 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/323 ,  C08K9/08 ,  C09J133/08 ,  H01B1/22 ,  H01L2924/07811 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K3/361

Abstract: An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

公开(公告)号：US5155301A

公开(公告)日：1992-10-13

申请号：US567648

申请日：1990-08-15

Applicant: Akira Mase

Inventor： Akira Mase

IPC: H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/2036 ,  H05K3/361

Abstract: Electrical connection between electrode arrangements formed on first and second substrates is described. The first substrate is placed over the second substrate with a UV light curable adhesive between them. The UV light curable adhesive carries first and second particles dispersed therein. The first and second substrates are pressed against each other and exposed to UV light in order to harden the adhesive. The first particles are made from conductive particles and preferably resilient and function to form current paths between the electrodes of the first and second substrates. The second particles function to prevent the first particles from being destroyed by excess deformation.

公开(公告)号：US5123986A

公开(公告)日：1992-06-23

申请号：US602715

申请日：1990-10-24

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B44C1/165

CPC classification number: H01R4/04 ,  G02F1/1345 ,  H05K3/323 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/361

Abstract: A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 公开了一种用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接方法。 在第一和第二电子部件的多个连接端子之间插入有导电性接合剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电粘合剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：US5001542A

公开(公告)日：1991-03-19

申请号：US443169

申请日：1989-11-30

Applicant: Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

Inventor： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC: H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

Abstract: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US20190157541A1

公开(公告)日：2019-05-23

申请号：US16257252

申请日：2019-01-25

Applicant: BROTHER KOGYO KABUSHIKI KAISHA

Inventor： Toru KAKIUCHI

IPC: H01L41/047 ,  B41J2/14 ,  B41J2/16 ,  B41J2/175 ,  H05K3/36 ,  H05K3/32

CPC classification number: H01L41/0475 ,  B41J2/14072 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1643 ,  B41J2/17526 ,  B41J2/1753 ,  B41J2002/14491 ,  H01L41/0973 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0233 ,  H05K2201/09745 ,  H05K2203/0278

Abstract: An actuator device includes: an actuator including a first contact; and a wire member including a second contact connected to the first contact with a conductive adhesive including a conductive particle. One of the first contact and the second contact is a particular contact. The other of the first contact and the second contact is a specific contact. At least two protrusions and at least one recess are formed on and in the particular contact. The at least two protrusions are arranged in a first direction. The at least one recess is interposed between the at least two protrusions. The particular contact is joined to the specific contact with the conductive adhesive provided in the at least one recess, in a state in which each of the at least two protrusions is in contact with the specific contact.

公开(公告)号：US09756728B2

公开(公告)日：2017-09-05

申请号：US14423417

申请日：2013-05-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Koji Motomura

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/32 ,  H01L23/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81193 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/147 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0278 ,  H05K2203/0425 ,  H05K2203/0465 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

公开(公告)号：US20150009633A1

公开(公告)日：2015-01-08

申请号：US14321995

申请日：2014-07-02

Applicant: AU Optronics Corporation

Inventor： Chih-Hung CHEN ,  Po-Fu HUANG ,  Chih-Hao WANG

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K3/361 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/0233 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10136

Abstract: A circuit board module includes a first circuit board, an electrically conductive structure, a first bump, a second circuit board and an electrically conductive film. The electrically conductive structure and the first bump are disposed on the supporting surface of the first circuit board. The electrically conductive structure and the first bump respectively have a first maximal thickness T1 and a second maximal thickness T2 along the normal direction of the supporting surface. The second circuit board is disposed on the electrically conductive structure and the first bump. The electrically conductive film is disposed between the second circuit board and the electrically conductive structure, and it has a plurality of electrically conductive particles. An average particle diameter D of the electrically conductive particles when undeformed satisfies: 0

Abstract translation: 电路板模块包括第一电路板，导电结构，第一凸块，第二电路板和导电膜。 导电结构和第一凸块设置在第一电路板的支撑表面上。 导电结构和第一凸块分别具有沿着支撑表面的法线方向的第一最大厚度T1和第二最大厚度T2。 第二电路板设置在导电结构和第一凸块上。 导电膜设置在第二电路板和导电结构之间，并且其具有多个导电颗粒。 当未变形时导电颗粒的平均粒径D满足：0